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New PCBs and Components
March 15, 2010 |Estimated reading time: 6 minutes
— These new products include cable/harness assembly support, new components, new PCB materials, oddforms like EMI shields and heatsinks, and pin connectors.Products and Services to Support Cable/Harness Assembly
Cable Assembly Kits and Training support customers involved in cable and harness assembly. The Cable Assembly Kit addresses the majority of component types that are encountered in operational production. It utilizes Mil-Spec-style connectors that have two sizes of contacts, combined with the appropriate insertion/extraction tools. Additional terminals, solder sleeves, and crimp lug terminations are provided for broad skill development. STI has included a terminal soldering kit for enhanced soldering skill development. In addition, the kit features an overlay and wire list for the student to use that is typical of those encountered in production operations. The Cable Assembly Kit is effectively used in STI’s NASA Cable and Harness Training program. IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, an industry consensus standard for cable and wire harness fabrication and installation, is modeled after IPC-A-610. In addition to IPC/WHMA-A-620 courses, STI also offers Cable/Harness Assembly training to NASA/MSFC-8739.4, “Crimping, Interconnecting Cables, Harnesses, and Wiring.” STI Electronics Inc., www.stielectronicsinc.com
EMI Shielding
As circuit board footprints decrease and chip speeds continue to increase, efficient board layout and proper EMI shielding become major engineering concerns. Several factors including shield space, weight, and cost are pressure. A cost-effective, multi-cavity version of Leader Tech’s standard CBS product line is called the Multi-Cavity CBS product line. It combines multiple circuit board shields under the same footprint to reduce space, weight, assembly cost, and time-to-market. Multi-Cavity CBS products use standardized manufacturing methods to create shielding solutions with minimal nonrecurring engineering charges (NRE) and virtually limitless customization options. Leader Tech, http://www.leadertechinc.com
Kinky Pin PCB Connectors
The Oxley range of Kinky Pin PCB connectors and test points use a kinked retention mechanism to retain the pin in the PCB prior to soldering. The Kinky Pin, originally designed for plated-through-hole assembly methods, is now being used as a compliant terminal where no solder is used or using through-hole-reflow techniques. The design of the Kinky Pin combines low insertion force with high retention capability so that the pin is held securely and perpendicularly on the board. This is critical for the assembly of flex circuits to rigid boards as it allows the PCB to be flipped upside down for reflow soldering without the pin falling out. The slot produced by the kink enhances the wicking effect when soldering to create a better joint, reducing the risk of air pockets and dry joints. Aerco, www.aerco.co.uk
Low Loss Core
TSM-DS, a dimensionally stable low loss laminate that offers low DF (0.0010 at 10 GHz) with better dimensional stability than epoxy. TSM-DS is a ceramic-filled reinforced material with very low fiberglass content (~5%) that assures consistency and predictability in fabricating large format, high-layer-count PWBs. For microwave applications, the low X/Y/Z CTE values ensure that spacing between traces in filters and couplers have very low movement with temperature. TSM-DS can be used with very low profile copper foils yielding a clear copper edge between coupled lines. TSM-DS has a temperature stable Dk ±0.35% (-30 to +120° C) and is compatible with resistor foils. TSM-DS in combination with fastRise 27 prepreg (DF = 0.0014 @ 10 GHz) offers a solution for stripline designs. The recommended fabrication temperature and pressure is as per FR-4 (epoxy) conditions. These low insertion losses can only be rivaled by fusion bonding, a costly process that causes excessive material movement and puts stress on plated through holes (PTH). Taconic Advanced Dielectric Division, www.taconic-add.com
RF/EMI Shields with Snap-on/snap-off Covers
This line of EMI/RF shields with snap-on, snap-off covers allows easy access at any time to components within the shields. These shields are designed to protect components from radio frequency/electromagnetic interference and environmental hazards, and to provide electrical grounding. Standard forming tools are available in any size and shape to create covers that attach onto a fence yet can be removed and replaced easily. Photochemically etched fences have grooves etched approximately 50% of the material thickness, so PEI’s custom spring finger designs snap into them firmly. PEI will quote on any existing shield that has a removable cover and apply its design; the only tooling charge will be for a phototool. Shielding options for circuit board applications include one- or two-piece construction. Standard base materials including brass, tin, tin/lead, nickel, copper, and cold-rolled steel, all of which can be provided with solderable plating. The nickel/silver base material does not require additional finishing because it is already solderable. Applications for PEI’s line of shielding products include aerospace, defense, and commercial electronics; communications and telecommunications equipment; medical and biomedical equipment; and appliances. PHOTOFABRICATION ENGINEERING, INC. (PEI), www.photofabrication.com.
BGA Pitch-changing Adapters
These BGA Switch-A-Pitch adapters allow for smaller-pitch devices to be used with larger-pitch boards. The new adapters in the series adapt 0.40-mm devices to boards with a 1.00-mm pitch. BGA Switch-A-Pitch adapters, part of the line of Correct-A-Chip adapters, reduce costs by making possible use of newer, tighter-pitch devices with larger-pitch boards, which are more available and economical, lowering the PCB cost. The adapters have tops with BGA landing pads on a 0.40-mm pitch and bottoms fitted with BGA balls on a 1.00-mm pitch. Open space around the adapter tops provides space for further components to be added to the design at a lower cost. High density interconnect (HDI) construction is reduced and the need for laser-drilled microvias on the motherboard is eliminated by adapting tighter pitch devices to larger footprints. The BGA Switch-A-Pitch adapters enable the use of standard line and trace spacing down to 0.003" (0.076 mm). The innovative adapters can operate at up to 105°C for FR4 and up to 130°C for lead-free. The recommended PCB size for a 1.00-mm pitch is 0.020" (0.50 mm). Boards are 0.062" (1.57 mm) thick FR4 or Rogers 370 HR with 0.5 oz copper traces on both sides. Solder spheres are 63/37 tin/lead or lead-free SAC 305. The adapters feature non-soldermask defined (NSMD) pads finished with electroless nickel immersion gold (ENIG). Correct-A-Chip Adapters allow the use of different termination styles or pitches on one board designed for an alternative style or pitch and can be fitted with either active or passive components for added functionality. Aries adapters are available as adapter only or as a turnkey solution with mounted devices. The Switch-A-Pitch Adapters are custom made to customer requirements. Aries Electronics Inc., http://www.arieselec.com
Low-profile Heatsinks
A line of lower-height heat sinks, maxiFLOW is designed for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heatsinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm. The heat sinks are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins and minimizes weight. Tests on maxiFLOW heatsinks using an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40% below the temperatures achieved using other heat sinks. Low-profile maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP mounting hardware. This attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core; ETSI 300 019; and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximizes the heat transfer from component to the cooling solution. The heatsinks are also available without the mounting system. Advanced Thermal Solutions, www.qats.com.
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