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New Products for PCB Assembly Test
February 26, 2010 |Estimated reading time: 9 minutes
— These new test products include functional test with temperature calibration and a new test handler from Multitest, LXI test matrices from Pickering Interfaces, ESD testers from Transforming Technologies, a test system manager from QualiSystems, new boundary scan applications from JTAG Technologies, a test socket from Aries and test socket spacer cutting from A-Laser, Agilent characterization systems, and cleanliness test upgrades from Specialty Coating Systems.Temperature Calibration with 0.2°C Stability
A dedicated set up for the MT9928 gravity handler allows for calibrating temperature sensors. The combination of optimized test handler features and test contactor features meets the requirements of calibration equipment with a temperature accuracy of ±1.0°C and a temperature stability of ±0.2°C. The device under test (DUT) calibration solution continuously monitors the temperature stability of the DUT environment during the test time. In this aspect, the MT9928 calibration kit adds temperature sensor calibration to the classic functional test. The calibration kit consists of both a dedicated handler contact unit holder (CUH) and a Multitest contactor. The kit is available for the MT9928 as well as for the current version, the MT9928XM. Multitest, www.multitest.de/region.asp
LXI High Voltage Matrix
Expanding Pickering’s range of LXI-compliant products, the LXI High Voltage matrix 60-311 is a matrix designed for high-voltage switching applications. Designed to withstand voltages up to 1 kV with up to 2 A of carry current, the 60-311 provides a dense and cost-effective matrix switching solution where high user voltages may be encountered. The LXI Class C compliant device uses high voltage D Type connectors; connection solutions are readily available from Pickering and other suppliers. The 60-311 is offered in three configurations: single, dual, and triple 75 × 4 matrices. Each individual matrix includes isolation relays on the X and Y axes that simplify configuration of the matrix into larger matrix sizes, when interconnecting the matrices together, which avoids excessive matrix loading in many applications. The 60-311 allows simple Ethernet control of the matrix with local or remote access. The isolated nature of the LAN connection suits high-voltage applications. The 60-311 is designed to be used in rack, bench or distributed tests systems and uses a 3U rack mountable case system. Pickering Interfaces, www.pickeringtest.com
Test Handler
The InCarrier handler combines strip handling process benefits with the advantages of the standard test handling process. It overcomes the constraints of the strip test with respect to singulation after test and leadframe design. InCarrier supports ASIC and MEMS test, and offers low cost of test using high-test parallelism. The system also ensures a robust test handling process for small packages. InCarrier helps to fulfill special quality requirements, i.e. full device traceability, no device singulation after final test and re-test on the original equipment. Multitest, www.multitest.com/InCarrier
Defensive ESD Tester
ESD wrist strap and heel ground testers normally signal that a grounding device has failed during testing, but the Ohm Metrics - Defensive ESD Testers widen the test range to signal when the grounding device under test is nearing the fail range. This information can be used to retire marginal wrist straps and heel grounders before they fail. Defensive ESD testing reduces uncertainty and enables greater proactive protection for ESDA. PDT700 includes audible alarm and near-fail light. PDT800 includes LCD and test results. Transforming Technologies, www.transforming-technologies.com
Boundary Scan
JTAG Live is used for debugging boards too crowded for traditional probing, offering a mix of free and paid products targeting different aspects of the debugging process. JTAG Live is for electronics engineers and technicians to use in checking PCBs for basic continuity and correct operation. The family consists of three products, Buzz, Clip, and Script. JTAG Live is compatible with the popular JTAG programming cables from Altera and Xilinx, as well as with the two-port USB Explorer from JTAG Technologies. Buzz provides the ability to check quickly (direct and indirect) connections between devices supporting boundary-scan while Clip offers ways to verify cluster logic using vector-based cluster tests; Script enables users to adopt a functional, device-oriented test approach to take control of a design through on-board JTAG/boundary-scan compliant devices. Buzz is available free of charge from the JTAG Live website. Clip and Script are available as paid downloads. In Buzz, using an intuitive user interface, the user can quickly drag and drop pins into a continuity test panel and 'Buzz-out' a connection as you might traditionally do with a DMM. A new 'Watch' feature uses the JTAG SAMPLE instruction to monitor asynchronously the activity of a selected pin without disturbing the operation of the UUT. Adding the Buzz feature gives users a quick method to check out up to 10 pin to pin connections in one hit without the hurdles that are sometimes encountered when importing design data. JTAG Technologies, www.jtag.com
Test Lab Resource Management
The TestShell Resource Manager optimizes lab management with automatic reservation, scheduling, and topology configuration. The advanced application for lab resource reservation, scheduling and management is the latest module in the TestShell end-to-end test automation framework. Designed to improve test lab efficiency including in complex networking labs or distributed organizations, Resource Manager maximizes all lab resource utilization and significantly accelerates testing team performance. The solution enables multiple users to load, create, lock and reserve any number, type or brand of test resource, allowing them to be automatically scheduled and coordinated between various users, including across distributed sites. With embedded layer1 switch control, Resource Manager automatically reserves all paths required for test execution and wraps multiple switches into an easy-to-control cloud, using a shortest-path algorithm to guarantee effective monitoring. A built-in tracking system reports on resource use for increased efficiency in the lab management. It is available as an optional (client-server) module for the TestShell Team and Enterprise Editions. QualiSystems, http://www.qualisystems.com
Kelvin Test Socket
This Kelvin test socket handles devices with a lead pitch down to 0.4 mm. The socket uses two independent Aries Kelvin spring probes per device pad for highly reliable, low resistance testing of MLF, QFN, LGA and other leadless devices. With a signal path of 2.08 mm, the socket provides minimal signal loss for higher bandwidth capability. The socket's low-cost, two-piece construction and small overall size allows the maximum number of sockets per test board. The socket uses solderless pressure mount compression spring probes accurately located by two molded plastic alignment pins and mounted with four stainless steel screws, allowing for easy mounting and removal from the test board. Gold-over-nickel-plated probes leave very small witness marks on the bottom surface of the device pads. The probes are constructed of heat-treated beryllium-copper with a minimum of 50 micron inches (1.27 micron mm) gold per Mil-G-45204 over 50 micron (1.27 micron mm) nickel per SAE-AMS-QQ-N-290. The pressure pad compression spring provides proper force against the device and allows for height variations in device thickness. A probe blade edge tip ensures cutting through solder oxides layers for use in applications with RoHS-compatible or gold pads. Contact forces are 16 g per contact on a 0.40- to 0.45-mm pitch. The probe can operate in temperatures from -55°C to +150°C and contact life is an estimated minimum of 500,000 cycles. The machined socket components are UL 94V-0 PEEK or Torlon, screws and alignment pins are stainless steel, and molded socket components are UL 94V-0 Ultem. The Kelvin Test Socket Contact System is available for any Aries CSP Test Socket. As with all Aries sockets, the new Kelvin test socket is available in custom materials, platings, sizes and configurations to suit specific applications. Aries Electronics Inc., www.arieselec.com
New Features on Ionic Contamination Tester
New features are available on the Omegameter 600SMD ionic contamination test system. The system now features expanded test profile capabilities, storing up to 99 test profiles. Additionally, optional software gives users near-infinite memory to store test results that can later be viewed, sorted, printed and/or exported in a spreadsheet for further analysis. The SCS Omegameter offers users the ability to test components with a heated or non-heated test solution. Specialty Coating Systems (SCS), www.scscoatings.com
Nanomechanical Materials Testing
The Dynamic Contact Module (DCM) II for nanomechanical testing of materials features 3× higher loading capability (30 mN max load); easy tip exchange for quick removal and installation of application-specific tips; and a full 70 µm range of indenter travel. The DCM II is designed to optimize nanomechanical testing for a very broad set of materials, such as semiconductors, thin films, MEMs, hard coatings, DLC films, composites, fibers, polymers, metals, ceramics and biomaterials. The Agilent DCM II extends the range of load-displacement experimentation down to the surface contact level. With the DCM II option, Agilent Nano Indenter G200 and G300 users can study the first few nanometers of an indentation into the surface of a material as well as the pre-contact mechanics. Using standard methods, the displacement resolution of the DCM II is determined to be 0.2 picometers. Real-world testing shows that the noise levels are typically less than an angstrom. The DCM II indentation head can be configured for new or existing Agilent Nano Indenters. The DCM II head's flexible mounting bracket provides multiple mounting options for specific applications.
The enhanced-performance universal testing machine (UTM), Agilent T150 UTM, offers highly accurate nanomechanical characterization capabilities. Researchers investigate dynamic properties of compliant fibers via a large dynamic range and high resolution of five orders of magnitude of storage and loss modulus. The system suits dynamic studies as well as characterizing yield of compliant fibers and biological materials, and tensile and compression studies of polymers. When used in conjunction with the Continuous Dynamic Analysis (CDA) option, the T150 enables the direct and accurate measurement of sample stiffness at each point throughout a given test, allowing mechanical properties to be determined continuously as the specimen is strained. The Agilent T150 UTM employs a nanomechanical actuating transducer head to produce tensile force (load on sample) using electromagnetic actuation combined with a precise capacitive gauge. This approach provides sensitivity across a large range of strain. The flexible, upgradeable T150 can be configured for repeatable specific applications or a variety of new applications. NanoSuite software offers real-time experimental control and easy test protocol development. The Agilent T150 UTM provides fast, accurate generation of real-time test results; improved understanding of strain-rate-sensitive materials and time-dependent response; better statistical sampling in biomaterials applications; and automated reporting of test results in Microsoft Word and Excel. The user-friendly design of the T150 simplifies training requirements; standard tests can be run on the same day the instrument is installed. Agilent Technologies Inc. (NYSE: A), www.agilent.com
LXI High Isolation RF Multiplexer
The LXI High Isolation RF Multiplexer 60-722 is a 75-? RF Multiplexer featuring very high isolation and crosstalk performance. Available as a single or a dual 12:1 multiplexer, the 60-722 has a BW of greater than 1 GHz and a typical isolation and crosstalk performance in excess of 100 dB. The LXI Class C compliant device uses F Type connectors, suiting testing coaxial home network systems and video distribution components. The 60-722 is provided in a 2U rack mountable case. The LXI Class C compliant interface allows simple Ethernet control of the multiplexer with local or remote access. Pickering Interfaces, www.pickeringtest.com
Clean Cuts for DuPont Kapton Films
Currently, there is a large demand for laser cutting of Kapton spacers. This material is UV laser friendly and because of the properties of these lasers, A-Laser provides a very clean cut. Spacers often are used in test socket applications, where part profiles are shrinking. Polyimide films, especially Kapton, comprise a large percentage of the work FCT Assembly’s Parts Division processes. A-Laser provides high cutting edge precision and position accuracy (±0005"), fine contours, and virtually radius-free internal edges (<20 µm beam), and contact-free material processing to prevent material distortion. Same day quotes and 24-hour turnaround also are available. A-Laser, a division of FCT Assembly, www.a-laser.com
Also Read: Burn-in and Test Socket (BiTS) Workshop Preview
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