World Solder Paste, Solder Preform and Surface Mount Adhesives Market

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DUBLIN, Ireland — Research and Markets Ltd. released its latest research on the world surface mount technology (SMT) solder paste, solder preform, and surface mount adhesives markets. “World Solder Paste, Solder Preform and Surface Mount Adhesives Market” provides an overview of these markets along with analysis of key drivers, restraints, and challenges. Revenue forecasts by geographic region, pricing, and distribution trends are examined. This research also covers the competitive framework and market share analysis of the industry participants. Solder Materials Geared for Growth with High Demand from Electronics Sector The solder perform market has evolved steadily over the years, adapting to the varying needs and changing requirements of end users. The escalation in demand for consumer electronics, automotive electronics, aerospace engineering, and medical devices has contributed to the proliferation of surface mount technology (SMT) assembly lines globally. An increase in printed circuit board (PCB) complexity has augmented the growth of flexible and accurate-flue glass dispensers. The market for solder preforms is expected to follow an upward trajectory in the years to come as they greatly reduce complexity and produce robust end products. Both the solder paste and the solder perform segments are expected to develop at a steady pace with a compound annual growth rate (CAGR) of 11.7% and 6.8%, respectively, from 2008 to 2014. For more information, visit http://www.researchandmarkets.com/product/6d5288/world_solder_paste_solder_preform_and_surfacThe electronics industry has been gravitating toward lead-free products. With government regulations in effect and demand for environment-friendly products from end users, the revenues for lead-free solder product types — rosin, water-washable, and no-clean — are expected to increase substantially. To meet regional compliance regulations, assemblers are opting for lead-free solders. Solder performs are gaining acceptance as they are packaged in tape-and-reel for application with pick-and-place equipment. The market is poised for further expansion as it has the capability to support high-end technologies, and the latest innovations in the electronics industry. Rising Raw Material Costs Challenging for Solder ManufacturersThe markets are facing an unprecedented period of volatility, and solder manufacturers are battling high raw material prices. The cost of tin (Sn) and silver (Ag) has touched a 19-year high, impacting the supply of solder alloys. The ripple effects have been felt on the soldering materials supply chain, which is already stretched to its limits due to pricing pressures. Absorbing increased costs of such magnitudes will be a daunting task for market participants but competitive pricing is crucial for generating sales. Solutions include spend analysis to better manage procurement costs and strategic sourcing. Companies review their procurement strategies to manage the supply chains down to the raw material level. Procurement strategies suited for the product need to be revamped to help manage the supply chain. Quality, reliability, and ease-of-use are important purchase criteria for end users. There is a distinct preference for high-level automation and flexible equipment that can match up to the design requirements of the PCB. Great stakes are placed on the quality of after-sales service provided by the manufacturer. Apart from trying to expand their share in a market where demand is on an upward swing, participants must focus on maintaining their customer base. Most manufacturers rely on high brand equity to drive repeat business. For more information, visit http://www.researchandmarkets.com/product/6d5288/world_solder_paste_solder_preform_and_surfac