Laminates: New Products and Technologies


Reading time ( words)

Rogers Corp. introduced a new laminate technology for high-frequency amplifier designs; the Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, presented “Glass as a Substrate for High Density Interconnects,” asserting a new packaging substrate opinion; and IPC — Association Connecting Electronics Industries released revision C of IPC-4101, “Specification for Base Materials for Rigid and Multilayer Printed Boards.”

The Advanced Circuit Materials (ACM) Division of Rogers Corporation introduced RO4360 laminates developed for the special requirements of high-frequency amplifiers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 @ 2.5GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for better mechanical stability than PTFE woven glass. Building on the company’s RO4350B laminate materials, the new product features low dissipation factor, generous power-handling capability, and improved thermal conductivity. Environmentally friendly RO4360 laminate materials are RoHS-compliant and compatible with standard printed circuit board (PCB) processing methods. The copper-clad laminates exhibit a glass transition temperature (Tg) of greater than 280ºC and a low coefficient of thermal expansion (CTE) in the z-axis (30 PPM/ºC) needed for reliable plated through holes (PTHs) in multilayer circuits. RO4360 laminates allow designers to reduce circuit dimensions in applications where size and cost are critical.  They suit power amplifiers, patch antennas, and other commercial high-frequency applications. Rogers Corporation (NYSE:ROG), www.rogerscorp.com

David A. Hutt, Xiaoyun Cui, Deepa Bhatt, Fuad Khoshnaw, and Paul P. Conway; Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, recently presented “Glass as a Substrate for High Density Interconnects,” positing that glass, with a similar CTE to silicon (Si) and manufacturability in thin sheets (50–150-µm-thick CMZ glass), will serve as a useful packaging substrate for high-density and stacked package applications. The paper covers laser machining of glass for microvias and tracks, electroless metallization of glass, lamination of glass, process limitations, and application to substrate manufacturing. See the entire presentation for Electronics Yorkshire here.

IPC — Association Connecting Electronics Industries released revision C of IPC-4101, “Specification for Base Materials for Rigid and Multilayer Printed Boards.” Covering the requirements for base materials used primarily in rigid and multilayer printed boards for electrical and electronic circuits, the C revision adds 11 new specification sheets to reflect the expanded offerings for current commercially available laminates and prepregs. The new specification sheets add laminate and prepreg materials with improved or additional properties for use in one or more of the following applications: low halogen, lead free, high thermal performance, and high speed/high frequency performance. Tony Senese, OEM business development manager, Panasonic Electric Works, and chair of the 3-11 Laminate/Prepreg Materials Subcommittee, responsible for the standard, notes “The specification sheets now cover a much broader range — from low halogen materials which are, for the most part, duplicates of the high performance FR-4 materials with higher Tg, to specification sheets for materials on the less demanding end of the spectrum.” In total, 66 individual specification sheets are contained in IPC-4101C, which can be searched using keywords. The keywords allow the document's user to easily find  groups of materials with common characteristics but with enough specific properties that allow them to fine-tune their laminate and/or prepreg search. More information on IPC-4101C, “Specification for Base Materials for Rigid and Multilayer Printed Boards,” is available in the IPC online bookstore at www.IPC.org/onlinestore. Questions should be directed to the 3-11 Subcommittee staff liaison, Tom Newton, IPC director of PCB programs, standards and technology, at TomNewton@ipc.org or (847) 597-2849.

Related articles on PCB production:New Products: PCBs, Connectors, and ComponentsIPC's July Book-to-bill Stays Just Above Parity

Share

Print



Copyright © 2019 I-Connect007. All rights reserved.