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IBM Awards Endicott Interconnect Supercomputing Contract
September 10, 2009 |Estimated reading time: Less than a minute
ENDICOTT, NY — Endicott Interconnect Technologies Inc. (EI) was sole sourced on IBM’s next-generation supercomputing program, providing PCBs, board-level assemblies, and testing. It is a multi-year contract, but financial details were not disclosed.
IBM contracted EI to supply 100% of the printed circuit boards, board-level assemblies, and full functional test including all of the critical interconnect components for an advanced program. EI will use its existing processes and assembly capabilities on the advanced project.
“EI has a long standing relationship with IBM, committed to supplying high-quality, high-reliability, and cost-efficient products and services,” said Michael J. Hills, senior VP of sales, marketing, and product management at EI.
For more information, visit http://www.endicottinterconnect.com/ and http://www.ibm.com.