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Exhibitors at Nepcon South China in Shenzhen
December 31, 1969 |Estimated reading time: 11 minutes
Nepcon South China, August 2628 at the Shenzhen Conference & Exhibition Center in Shenzhen, China, will co-locate with EMT South China, Finetech South China, ATE China, and AE South China. The show promises a glimpse at the economic recovery in electronics manufacturing. Here are the highlights of exhibitors at Nepcon Shenzhen.
BTU International (Nasdaq: BTUI) will showcase its PYRAMAX 150Nz12 reflow furnace at Booth #1H37. The PYRAMAX 150Nz12 is designed for high-volume, high-throughput production environments. It features a 12-zone oven to increase process control for lead-free processing, reducing the size of each of zones from the PYRAMAX 150 design. By incorporating technical enhancements in power and nitrogen consumption, BTU has also been able to further reduce the cost of owning the system. BTU's exclusive closed loop convection control, for precise control of heating/cooling and a constant heat transfer for maximum process control flexibility is featured, and ensures process repeatability from line to line and site to site.
X-ray inspection technology and rework systems manufacturer VJ Electronix Inc. will highlight Summit 1800, an advanced rework system, in distributor Kasion Automation's booth 1H35. Summit 1800 addresses difficult rework challenges, including lead-free rework for large components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. VJ Electronix added programmable, motor-controlled top heater positioning in conjunction with the Summit's independent pick-up motion. Windows-based SierraMate 7.0 software improves operation and process control. New Advanced Auto Profile with rules-based process development allow process engineers to set specific constraints to be applied during automatic profile generation. An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface. The Summit 1800 incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion allows precise placement force control and zero force removal. The component pick-up tube features 360° Theta control and automatic alignment height. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board. Other benefits include advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components.
Vi TECHNOLOGY will be represented with its Chinese agents to exhibit a range of inspection equipment and software solutions for a wide range of applications for PCB assembly, final test, and back-end semiconductor production. American Tech at booth 1F30 will display 3D SPI systems and premiere the 7K Series dual lane AOI equipment. WKK at booth 1G15 will also do a special focus on the company's 3D SPI solution. First Technology at booth 1F35 will demonstrate AOI solutions as well as VIT-DC Automation Equipment thermal oven 12 zones solution. The 7K Series, a dual lane machine with large board capabilities up to 21 × 11" for each of the two boards. Equipped with P-Series acquisition heads including i-LITE illumination, it uses the latest VIT software suite. This new AOI equipment is a branch of the 5K Series offering the same upgradeability in hardware and software. 3D Selective AOI technology provides accurate tilt and coplanarity measurement of ICs, connectors, and passive components. Vi TECHNOLOGY has increased its R&D team introducing the 7K Dual lane Series, the 3D Selective coplanarity inspection, and a new release of software over the past 6 months.
Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C soldering products in booth 1K30. SN100C P600 is a halogen-free high-reliability no-clean lead-free solder paste that does not contain F, Cl, Br, or I. It offers stable printability, good reflow wetting, minimum incidence of mid-chip balling, low residue, and significant cost advantages. SN100C P500 is a high-reliability no-clean lead-free general-purpose solder paste with high fluidity close to its melting point and fast wetting. SN100C (040) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that provides good separation of the solder from the tip with reduced incidence of icicles and reduced flux residue cracking and other defects. SN100C (030) is a high-reliability no-clean flux-cored lead-free solder wire. Benefits include less tip and pad carbonizing, less flux splatter, less flux residue cracking, fast soldering and melting, good spread, and substantial cost advantages. Additionally, the wire provides fewer shrinkage defects, reduced copper erosion and a stable intermetalic layer. As an additional service, Nihon Superior now has preform capability. It can provide very fine wire/cored wire down to 0.1 mm. Also, the company can provide SN100C as a foil and spheres for BGA.
YESTech, a subsidiary of Nordson Corporation (Nasdaq: NDSN), will announce their newly upgraded FX-Series AOI, BX benchtop AOI and X-Ray inspection solutions for populated printed circuit boards at booth 1H32. The FX Series AOI, with advanced 5-megapixel color camera technology and Fusion Lighting, offers high-speed PCB inspection with exceptional defect coverage and low false failure rate. With one top down viewing camera and four side viewing cameras, the FX-Series inspects solder joints and verifies correct part assembly. The FX-Series has a standard package library to simplify training and program portability across manufacturing lines. Configurable for all line positions, the FX-Series is equally effective for paste, pre-/post-reflow or final assembly inspection. Off-line programming and real-time SPC monitoring maximizes machine utilization. The system integrates color inspection, normalized correlation and rule-based algorithms. The YTV-BX AOI offers users powerful inspection capability in a compact, benchtop footprint. The BX comes standard with 5 megapixel color camera imaging technology, providing benchtop PCB inspection with exceptional defect coverage. The four optional side viewing cameras add inspection capabilities only found on in-line systems. YESTech will also feature live demonstrations in the booth of their product line, including the YTX-3000 AXI X-Ray Inspection System. The YTX-3000 offers high-resolution X-ray capability in a flexible, compact, maintenance-free configuration.
The Yamaha YS24 compact super-high-speed modular mounter will be highlighted at WKK's booth 1G15. Its area productivity is 34k CPH/m2. Mounting capability reaches 72,000 CPH under optimum conditions. The machine uses the Dual Stage Conveyor, with a flying scan camera component recognition system, incorporating two sets of narrow-pitch 10-inline multi heads. The system is designed to be compatible with large PCBs, 700 × 46 mm, for flat panel screens and LED lighting devices.
Fuji will display a number of machines. Among them will be the MWU8i Multi-Purpose Wafer Unit that simplifies the merged loading of SMD and semiconductor parts. A new option for the high-speed multi-purpose mounter is the XPF-W, which supports large panels up to 686 × 508 mm. The MWU8i's placement accuracy reaches 10 µm when using H02/H01/G04 heads. In semiconductor manufacturing, wafer mapping is supported and the multi-level supply unit can produce multiple types of wafers alternately, or the same type of wafer continuously, without the need to halt production. The XPF-W option facilitates borderless production through dynamic head exchange. A maximum of 128 types of parts can be loaded onto the compact body by using the MFU-40 dynamic head exchange, enabling heads to be used to their maximum potential. Trays are visible from the outside during operation, so the status of trays can be checked at a glance.
Aqueous Technologies Corp. will feature its two latest products in distributor Jamron's stand. The Trident fourth-generation automatic defluxing system is a fast batch-format defluxing system, with specific throughput rate determined by board size. The system is capable of defluxing and cleanliness testing up to 200 101 × 152 mm boards and up to 28 457 × 508 mm boards per hour. Trident offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. Trident's defluxing process consists of up to five cycles including prewash, wash, rinse, cleanliness testing and drying. Trident also features an inverse-mounted vertically oriented spray pump that virtually eliminates pump-caused dragout, built-in statistical process control (SPC) data capturing technology, stainless steel plumbing and EPDM pump seals. The Zero-Ion Ionic Contamination (Cleanliness) Tester automatically removes and detects contamination on an electrical assembly or bare board and provides quantitative contamination measurements. The Zero-Ion uses a dynamic technology that provides automatic regeneration of the machine's test solution and meets the requirements of military and commercial cleanliness testing standards including MIL 2000A, IPC test method 001, MIL-C-28809, MIL-P-55110 and IPC TM650-2.3.26. The Zero-Ion performs cleanliness tests automatically and is capable of storing 50 test parameters within its internal controller.
RMD Instruments' LeadTracer-RoHS XRF system will be demonstrated in representative KAL's booth number 1H35. The XRF analysis system targets fast, accurate, and portable screening to meet RoHS directives. RMD has added a solder analysis and identification feature to its LeadTracer-RoHS XRF system that accurately identifies all solder alloys within minutes. The LeadTracer-RoHS XRF analyses the entire body of the components in a short period of time, rather than simply carrying out a surface analysis. Analyzing the entire energy spectrum eliminates the possibility of false-negative indications in components. The LeadTracer-RoHS XRF system is available with a sample preparation stand, ergonomically designed and equipped with "quick disconnect" grip to enable users to operate the hand-held, portable LeadTracer-RoHS as a benchtop unit.
Icon i8, the fully automatic screen printer introduced by ICON Technologies, will be shown at WKK's booth 1G15. The company will reveal the latest upgrades to the Icon i8, including a software tool and an adhesive dispensing system. The Icon i8 now offers Instinctiv V9 next-generation advanced machine user interface. With a new Stinger dispensing system, printing and dispensing capabilities are available in a single platform, without taking up extra floor space. Also featuring a high degree of automation to maximize throughput and minimize operator intervention, the Icon i8 reduces product changeover time to a two minutes. With print speeds from 2 to 150 mm/sec, the Icon i8 can handle boards from 40 × 50 mm up to 508 × 508 mm, and a thickness of 0.2 to 6.0 mm. The maximum board weight is 1 kg.
Omron Electronics (Hong Kong) Ltd. will demonstrate the VP5200L New Generation SPI Machine in booth 1D10. The machine's inspection speed, supported by 3D technology, can reach up to 8000 mm2/sec. With a resolution of 12.5 or 25 µm, which can switch automatically to make precise and high-speed inspection possible, automatic programming takes as little as five minutes.
Kester will showcase its NXG1-HF halogen-free RoHS-compliant lead-free no-clean solder paste in booth 1K10. Alongside its SMT materials visitors will also be able to see the company's range of soldering materials exclusively for solar technology. NXG1-HF was developed with FLEX-LOY Technology for compatibility with various SnAgCu alloys, including that of SAC305 and low-cost low Ag versions such as SAC105 and SAC0307, where the absence of silver has proven to impact the solderability of most other paste products on the market. The product has good thermal performance, solderability, BGA voiding results, printability, and testability. Kyzen also will feature its EnviroMark 828 lead-free low-voiding water-soluble paste; UltraPure K100LD lead-free eutectic tin/copper solder alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize copper dissolution; the 979T no-clean flux high-quality, low-defect photovoltaic tab attachment; the 920CXF alcohol-based no-clean flux for high-reliability soldering to various PV metallizations; and the 952-S alcohol-based no-clean halogen-free flux that leaves behind minimal, non-tacky and non-conductive residues with its low solids content. Kester's solar technology product portfolio also includes the 275 No-Clean Cored Wire developed to provide superior wetting performance and reduce spattering.
In booth 1H30, KIC will feature the Reflow Process Inspection (RPI) system. The RPI system is an in-line process inspection system for SMT reflow ovens. The system is embedded inside the reflow oven and checks the profile of each product processed through the oven to verify whether it conforms to the spec. On a daily basis, the system generates two charts: defects per million opportunities (DPMO) and process yield for the thermal process.
P. Kay Metal will introduce its MS2 Molten Solder Surfactant in booth 1K40. By eliminating dross, MS2 reduces solder usage by as much as 70%, depending on production volume. The surfactant does not mix with the metal but forms a thin floating layer that covers areas of the solder surface excluding the wave, which is not disturbed during the process. It continues removing metal oxides as solder is pumped through the system, cleansing and purifying the bath. The result is lower surface tension.
Royal Philips Electronics subsidiary Assembléon is demonstrating its True Capacity on Demand initiative at Booth 1F20. The initiative tackles production fluctuations in today's dynamic electronic assembly market, and also prepares equipment makers for the global economic upturn. Electronics equipment manufacturers can buy pick-and-place equipment with the capacity that they need for day-to-day production, and hire in extra placement robots to increase capacity in peak periods. True Capacity on Demand reduces initial investments, with the temporary extra capacity being paid from the additional income that full production brings. The extra hired robots are simply returned to Assembléon after the peak period is over. This will be particularly attractive for the cost-conscious Asian market. The modular design of the A-Series Pick & Place machines use modular, calibration-free robots enable fast adaptation to existing machines on the line, with production levels being increased in easy and small incremental steps. The machine configuration remains the same, and there is no need for drastic machine modifications. The floor space remains the same, and the production line itself is undisturbed. A-Series machines offer single-digit defects per million placements. The company's parallel placement technique optimizes every placed component to give high first pass yields. Up to 20 individual robots each place 6,000 components an hour, giving IPC 9850 outputs up to 121,000 CPH.
For new products and show details, visit http://www.nepconchina.com/NepconSouthChina/eng/Exhibitor.htm.