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These are the new solder ovens, reflow profilers, hand rework tools, dross management chemistries, solder alloys, and other products, including a white paper with solder paste deposition information, developed to improve the soldering process in electronics manufacturing.
Stamp Soldering SystemFlexSolder S3532 uses stamp technology in a high-speed machine designed for continuous operation and high yield. Stamp soldering volumetrically controls and applies the correct amount of solder onto the leads of a thru-hole component in a controlled nitrogen atmosphere without pumps. Pumping solder through various size holes can cause instable waves, solder balls, bridging, and an uncontrollable amount of dross. Because the flux stamps are slightly smaller than the solder stamp, the flux is completely burnt off the PCB, with no overspray, improving flux activation and eliminating residue on the PCB. FlexSolder S3532 guarantees perfect flatness of the PCB during the soldering process. Supporting the board via top and bottom contour plates keeps the PCB in place in X/Y/Z, and controls board warpage caused by either double-sided reflow or PCB characteristics. The FlexSolder S3532 requires minimal programming, with no CAD, Gerber, or other types of data needed. Juki Corporation, www.jas-smt.com.
Thermal Profiling SoftwareVersion 2.17a of MAP thermal profiling software is designed to incorporate both the most recent profiling developments and the newly released IPC J-STD-075. Upgrades include new feature "Time within Temperature of Peak Custom Data Extraction," which allows the user to program the number of degrees within the peak temperature on any channel, and measure the time during which the channel was above that temperature. This will be particularly helpful in relation to the new J-STD-075 addressing passive component degradation by the reflow process, defining the amount of time within 5°C of peak a particular component can withstand without damage. A second new feature is "Align Profiles by Board Dimension," which allows users to optionally align their profile channel data using board placement physical dimensions and conveyor speed, reducing the lag time in retrieving information from the back of the board. "Bottom Zone Prediction" is a third new feature, allowing users to accurately predict (within one or two degrees) what board temperatures will be by adjusting the bottom zone temperature in addition to the traditional top-zone adjustment. ECD, www.ecd.com.
Fume Extraction ProductsWeller Zero-Smog fume-extraction products now include two tip extraction systems and five volume extraction systems. Fume-extraction systems are necessary in work environments that involve soldering, adhesives dispensing, welding, and laser applications. Weller Zero-Smog products combat the harmful effects of these emissions with filtration systems that catch polluted air at its source and re-circulate clean air back into the workplace. Weller's tip extraction systems collect fumes very close to where they are produced, right at the tip of the soldering iron, so they work very well in hand soldering applications. Many standard Weller soldering irons can be retrofitted to work with these systems or they can be used with Weller FE soldering irons that have a smoke exhaust tube integrated into the handle of the iron. The tip extraction systems are the WFE 20D and WFE 2P. Weller's volume extraction systems collect fumes from a wider area, and are suitable for applications involving solder baths, hot air soldering, laser processing, micro solders, and adhesives. The volume extraction systems are the WFE 8S, WFE 4S, WFE 2S, WFE 2X, and WFE 2ES/WFE 2CS. Cooper Tools, www.coopertools.com.
Solder Paste Deposition White PaperIs screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on each PCB pad may be the ultimate answer to the growing quality challenge. The white paper "Tackling SMT Enemy Number One," addresses these questions. MYDATA, www.mydata.com.
Nitrogen GenerationAssemblers requiring an all-nitrogen processing environment for reflow, wave, or specialty soldering applications can produce volume nitrogen needed in-house and at low cost. EconoGen is a compact plug-and-play nitrogen generator that eliminate reliance on outside sources for cylinders. EconoGen systems comprise two filter beds of carbon molecular sieve. While pre-heated compressed air enters the bottom of the first bed and passes across the sieve, oxygen and trace gases are preferentially absorbed as nitrogen is allowed to pass though to enter a low-pressure storage tank. As one bed becomes saturated, the second bed automatically activates and takes over the separation process. This continuous swing in pressure between absorption and regeneration remains operative until N2 production requirements are met, or the storage tank is filled. Since the system is modular, additional low-cost tanks may be added as needed. Payback could come in as little as 18 months, and after that electricity and compressed air become the only out-of-pocket operating costs. EconoGen is offered in two series, with Series 1 systems used in low/medium to high-volume applications, while Series 2 generators are for laboratory, prototyping, or benchtop applications. Manncorp, www.manncorp.com/nitrogen-generators.
Simultaneous Lead and Lead-free Convection Soldering SystemThe Dual Lane Vision X Series convection soldering system enables simultaneous lead-rich and lead-free reflow soldering in a single system with parallel processing. The Dual Lane Vision X Series is equipped with two conveyor lanes that can be operated asynchronously at different speeds. With this multi-track variant, manufacturers can also operate the two lanes asymmetrically with different lane widths. The two conveyors can be loaded with diverse PCBs printed with different solder pastes, while a flexible heating system enables use of ideal reflow profiles for the separate products. The Vision X ovens use homogenous, non-separated heating and cooling zones across the entire width of the conveyor. It is said to offer a flexible process set up and open a wide soldering process window, with reliable and repeatable soldering results. Available with either an air or nitrogen atmosphere, the Vision Series offers an integrated residue management system including the company's Pyrolysis technology in the heat zones. Virtually maintenance-free, Pyrolysis splits long molecular chains into shorter ones to reduce the amount of condensable waste and unwanted dripping within the process chamber. Rehm Thermal Systems, www.rehm-group.com.
Lead Tinning SystemWhen gold on the leads must be removed, and the leads subsequently tinned to make them suitable for assembly, a new version of the LTS200 lead tinning system can be used. Fine pitch QFP components can be tinned after burn-in without bridging. The LTS-QFP reconditions QFP and FP component leads for high-reliability and/or RoHS applications. It incorporates a special robotic part handling device that picks QFPs from a loading platform with a precision vacuum head. The component is inspected at a camera inspection station. Flux is applied to only the leads. There are 2 solder pots, each with a solder wave feature that eliminates bridging even on ultra-fine-pitch QFPs. The first solder pot removes the gold while the second applies the final coating of virgin solder. The special configuration of the wave; the angle, speed, and insertion characteristics of the row of leads as presented to the wave; and the use of a minimal inert blanket to enhance wetting contribute to tinning without bridging defects. The LTS200, with its variety of tooling and fixtures, can be programmed to handle all leaded parts, including transistors, capacitors, diodes, axials, radials, pin grid array, SIPs, DIPs, connectors, and more. Programmable routines such as "agitate in the solder" to help remove the original coating can be created and operators can specify and control "withdrawal rate" from the final solder bath to increase solder thickness. ACE Production Technologies, www.ace-protech.com.
Water-soluble Solder PasteWS488 water-soluble solder paste is designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a range of applications. It offers slump resistance and good print characteristics with 8+ hours of stencil life. WS488 provides the necessary tack time and force for high-speed placement equipment, which will broaden the process window and reduce rework. It can be reflowed with a variety of profiles to fit various assembly or oven configurations. The product is designed to be cleaned with tap water. WS488 has a six-month refrigerated shelf life and is available in a range of powder mesh sizes, alloys, and packaging. It passes all applicable IPC reliability testing. AIM, www.aimsolder.com.
Dross Removal Powder A relatively inexpensive and easy-to-use powder that separates dross from molten solder for wave soldering and other processes involving considerable volumes of solder, "Dross-B-Gone" can reportedly recover in several minutes almost 90% of the pure solder originally used. The powder, effective with lead-free and leaded solders, eliminates dross by quickly oxidizing it into an easily removable powder that is discarded, while pure molten solder remains in the pot for reuse. The non-polluting powder is merely sprinkled on the molten solder at an approximate ratio of 10 grams per 1,000 grams of solder dross. The pure solder recovery rate is 880 grams. Manncorp, www.manncorp.com/wave-solder/dross-b-gone.
Halide-free, Lead-free, Water-soluble Solder PasteALPHA WS-820 offers excellent printability with print volume and print repeatability down to 0.3-mm features and has an excellent reflow process window with straight ramp, short soak or long soak profiles in air. WS-820 is the latest-generation water soluble, lead-free ALPHA paste. It is designed for print performance at both low and high relative humidity (20 to 65%), and it offers IPC 7095 Class III resistance to voiding. WS-820 is cleaned with warm deionized (DI) water, leaving virtually no ionic contamination. It is available in SAC305 and SAC405 alloys and in Type 3 and 4 powder. Cookson Electronics, www.alpha.cooksonelectronics.com.
Reballing/Prebumping Station for BGAs, CSPs, QFNsThe 03.1 Reballing/Prebumping Station performs BGA and CSP reballing and solder paste prebumping of QFN devices. The 03.1 system includes Rapid IR heating to achieve quick, energy-efficient lead-free processing temperatures while preventing damage to components and boards. It is also useful in converting BGAs, CSPs and QFNs from leaded to lead-free devices, or vice versa. The standard system includes tools and accessories for processing virtually all common packages. The company also offers a complete selection of masks, frames, and solder balls. Manncorp, www.manncorp.com/rework/multireball03.
Extra-fine Solder WireSN100C (030) lead-free flux-cored solder wire provides sharp spreading and good separation. The high-reliability alloy suits fine-pitch application. It contributes to higher economic productivity with its improved efficiency over conventional products. SN100C (030) also reduces bridging in soldering extra-fine coaxial harnessing in cell phones. The alloy (Sn0.7Cu0.05Ni+Ge) has a 0.1-mm diameter. SN100C (030) inhibits growth of the intermetallic layer and lowers copper erosion. Its highly ductile properties accommodate for strain on joints. Nihon Superior, www.nihonsuperior.co.jp.