On the Show Floor at Nepcon Shanghai
April 21, 2009 |Estimated reading time: 11 minutes
SHANGHAI, China Following are the new and flagship products being promoted at this week's Nepcon China, April 21 to 24 at the Shanghai Everbright Center. International companies will exhibit advanced products for the Chinese assembly market, including inspection systems, halogen-free solder materials, rework systems, digital dispensers, XRF solder analyzers, and more.
YESTech, a subsidiary of Nordson Corporation, will showcase their flagship F1-Series AOI, benchtop AOI and X-ray inspection solutions for populated printed circuit boards in booth 4E01. The booth will be staffed with YESTech's newly expanded local sales and support team, highlighting the company's growing commitment to the region. YESTech will feature their flagship F1 Series AOI, with advanced Thin Camera technology, and Fusion Lighting, offering high-speed PCB inspection with exceptional defect coverage and an extremely low false failure rate. The F1-Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution. They will also showcase the X3 Automated X-Ray Inspection System (AXI). The X3 provides electronics manufacturers advanced 3-D inspection capability for fast and complete inspection of double sided PCBs with BGAs and other critical solder joints. The X3's proprietary tomographic imaging technology rapidly gathers multiple oblique images to digitally construct three dimensional slices that are used for unobstructed inspection of solder and component related defects on double sided boards. Multiple slices, or inspection planes, can be generated from the same set of oblique images at any time. www.yestechinc.com.
Indium's Indium8.9 halogen-free solder.
Indium will be exhibiting at Booth 2D06. Indium8.9HF solder paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies. As a halogen-free solder paste tested per EN14582 test method, Indium8.9HF possesses a unique activator package and oxidation barrier, which allows it to coalesce and wet as well as, or better than, its halogen-containing counterparts. The oxidation barrier also ensures there is no graping on small passives. Additionally, the combination of outstanding oxidation barrier and high slump resistance allows Indium8.9HF to effectively eliminate head-in-pillow defects. Indium8.9HF can be manufactured with SnPb powder so it can be used on products currently exempt from RoHS. Using Indium8.9HF in a SnPb process offers high thermal stability and low voiding in mixed-alloy applications. It also eliminates the need to change solder paste chemistry when transitioning to a RoHS-compliant environment. Overall, Indium8.9HF provides superior performance characteristics that increase customers cost savings and finished goods reliability, while ensuring compliance with REACH, RoHS, and future halogen-restricting legislation. www.halogen-free.com.
Vi TECHNOLOGY is exhibiting a range of inspection equipment and software solutions for applications in PCB assembly, final test and back-end semiconductor production at East Hall, Level 1, Booth 4F10. The company enlarged its product range for the 2009 show, including the K Series AOI for small to large boards and with dual lane capabilities, and new software solutions with Vision 2008, including a number of new features like Library Pro as well as 3D SPI solutions. The company will demonstrate a new solution to help users verify a selective 3D measurement for pre-reflow and post-reflow applications quickly and easily. The feature is designed to maintain the efficiency of the traditional AOI system and production efficiency. www.vitechnology.com.
OK International's rework offering.
The OK International Booth #1D06 will highlight its flexible MFR Series of multi-function rework systems with SmartHeat Technology. The economical and operator friendly MFR-1100 Series single-output system uses both a soldering cartridge and tip. Appearing alongside it at Nepcon Shanghai, the MFR-2200 Series features a dual-output capability to allow the use of one or two hand-pieces simultaneously. The MFR-1100 and MFR-2200 can be used together to create a tri-output system offering extreme flexibility for increased productivity across a wider range of applications. The OK International team will launch the MRS-1000 Modular Rework System, a powerful, high-accuracy benchtop solution. Comprised of a handheld convection tool with a wide array of nozzles, preheater, adjustable tool holder with board holder, and light magnifier, the manually-assisted rework system suits removal of delicate SMT components and other processes requiring increased control. With standard features including programmability, a digital display, program storage of up to 50 profiles and adjustability, the system is extremely versatile to boost ongoing productivity. The OK International booth will also showcase the Metcal MX-5000 Soldering, Desoldering and Rework System for complex assembly challenges. Prioritizing high throughput and precision control, the easy-to-use MX-5000 combines increased power with SmartHeat Technology to eliminate overshoot potential and maintain high productivity soldering and rework. Also incorporating a built-in digital power indication display, the MX-5000 enables continuous operator feedback for making consistent, quality solder joints. Also being demonstrated live at the booth is the APR-5000-XLS Array Package Rework System. Featuring precision heater control software, this unique technology manages the narrow lead-free process window without reaching excessive peak temperatures that damage components, connectors, other solder joints and the PCB substrate. It incorporates a dual convection bottom-side heater that enables faster rework while delivering precision temperature control.
Techcon is a dispensing business of OK International.
Dispensing will also be a major focus of the OK International booth, featuring the high performance DX-250 and DX-350 Digital Dispenser/Controllers. The DX-250 is an easy-to-use micro-air dispensing system, uniting affordability with accuracy and repeatability. Ideal for general dispensing challenges, the DX-250 enables diverse applications, ranging from the precision deposition of surface mount solder paste and adhesive, to semiconductor under-fill. The DX-350 is a microprocessor-driven, fully digital dispenser ensuring highly repeatable and precise fluid volume. Designed to dispense a wide range of fluid viscosities, the DX-350 also expertly controls variation in pneumatic dispense valves. The OK International dispensing display will be further enhanced by a comprehensive range of consumable items. www.okinternational.com.
RMD's XRF tool suits various analysis applications.
RMD Instruments LLC will premier a new solder analysis and identification feature of its innovative LeadTracer-RoHS XRF system, in distributor Kasion Automation's booth 1C05. Counterfeit suppliers are getting more sophisticated and are using techniques such as laser etching in production of these components, which makes them virtually undetectable from the real parts. The LTRSync+ software feature takes advantage of the LeadTracer's K-Shell X-rays that allows the user to identify parts that might be substandard. RMD has added a new solder analysis and identification feature to its LeadTracer-RoHS XRF system that accurately identifies all solder alloys within minutes. Additionally, this new resource accurately performs a solder pot analysis. This is especially beneficial for SAC alloys in which an increase in Cu and Pb content (due to component drag-out) can affect not only the soldering process, but also RoHS compliance status. The LeadTracer-RoHS XRF system analyses the entire body of the components in a short period of time, rather than simply carrying out a surface analysis. The LeadTracer-RoHS' ability to analyze the entire energy spectrum eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process. The LeadTracer-RoHS XRF system is now available with a sample preparation stand, ergonomically designed for optimum ease-of-use and accuracy and is equipped with RMD Instruments exclusive "quick disconnect" grip to enable users to operate the hand-held, portable LeadTracer-RoHS as a benchtop unit. www.rmd-leadtracer.com.
VJ Electronix will highlight various rework and inspection platforms.
VJ Electronix Inc. will highlight Summit 1800, an advanced rework system, in distributor Kasion Automation's booth 1C05. Summit 1800 addresses difficult rework challenges, including lead-free rework for large components. An increased 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets and connectors. The addition of programmable, motor-controlled top heater positioning in conjunction with the Summit's independent pick-up motion provides the ultimate in process flexibility. VJ Electronix's Windows-based SierraMate 7.0 software improves simple operation and process control. New Advanced Auto Profile with rules-based process development allows process engineers to set specific constraints to be applied during automatic profile generation. An automatic prism shuttle designed to accommodate large components facilitates accurate and repeatable component alignment. The system simultaneously looks up at the component and down at the board, providing a composite alignment view. The digital split image allows the operator to see bumps, leads or pads of large devices at a high magnification with a simple click on the graphical user interface. The Summit 1800 incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion allows precise placement force control and zero force removal. The component pick-up tube features 360° Theta control and automatic alignment height. Programmable heater position with automatic height sensing allows the nozzle to gasket the board with minimal force, or to be located at a pre-set gap above the board. With standard board handling of 18 × 22", placement accuracy of 0.0005 to 0.001" and magnification capability from 2 to 40×, the Summit 1800 offers advanced thermal data collection and analysis with trend capability, password-protected user accounts, and positive flow control for peak temperature protection of delicate components. Additionally, the system can rework MCM, BGA, QFP, CPU sockets, vertical connectors, straddle mount connectors, passive components, microSMD, flip chip, microBGA and CSP. Options include manual scavenger, component print station, cooling boost, sliding board support, 17" LCD monitor and 22 × 30" board size upgrade. VJ Electronix will also exhibit the 400 Rework System, designed for rework of microBGA, BGA, CSP, SMT, MCM and THT assemblies. The 400 system was developed to meet the demands for high performance and low cost and provides advanced features designed to address difficult rework challenges. Proprietary Windows based X-PC Advanced Process software features intuitive programming and Teach Mode profiling.
VJ Electronix also will showcase Vertex Series-A X-ray inspection system in distributor Beijing Hanson's booth 2G05. The system offers a new flexible design for faster load/unload product exchange and reproducible results based on repeatability of closed-loop control system. The Vertex Series-A offers an inspectable area of 508 × 610 mm with 100% coverage. The board-handling table and large inspection area suit server boards and other large assemblies. Its modular configuration offers multiple choices of tube, detector, and motion components as well as software options. Its footprint is comparable to that of an AOI machine. Ports accept barcode readers. Smart Tubes sense what kind of start-up procedure is needed for minimum operator interaction. The ergonomic design of the Vertex Series-A offers an adjustable operator console, sliding door, large window and easy sample loading. With the table moved next to the door, heavier assemblies may be loaded into the machine with minimal physical effort. Features include local language support, 1-2 GO (place sample-select program-Go), automated stored inspection sequences, and export of inspection data to other systems. Sealed X-ray tubes minimize maintenance. www.vjelectronix.com.
CyberOptics debuts the SE500 SPI line.
CyberOptics Corporation will introduce SE500, an advanced 100% 3-D solder paste inspection system, in booth 4E19. This system has the ability to inspect the most demanding assemblies with a >80 cm2/sec. inspection speed that does not compromise measurement accuracy and repeatability. The system inspects pad sizes down to 01005 component size while keeping up with line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 × 50 mm to 510 × 510 mm. The SE500-X can transport panels from 100 × 100 mm to 810 × 610 mm. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra. www.cyberoptics.com.
FINETECH will focus on rework for modern advanced packages like QFNs.
Shanghai FINETECH will showcase advanced rework equipment at the German Pavilion, West Hall, Level 2, booth #2F10-6. FINETECH will demonstrate the latest rework solution for modern leadless packages like QFN. When integrating the "Direct Component Printing Module" (DCP Module) into the FINEPLACER rework system, fresh solder can be printed onto QFN or MLF components before soldering. No additional reflow process is required to transfer fresh solder onto the component. It is guaranteed that the reworked assembly can be provided in OEM quality. Direct component printing becomes integral part of the rework cycle and can be performed within any FINETECH rework system equipped with the DCP Module. Easy retrofit of existing FINEPLACER rework systems with the DCP Module is possible. www.fineplacer.com.cn.
Techcon Systems, part of the OK International team, will exhibit with distributor PAS Trading (Shanghai) Co. Ltd. in stand 2F21. Techcon Systems DX-250 Digital Dispensers/Controllers will be on display, as well as precision valves; a range of dispensing and spray valves from simple manual dispensing, to precision valves for high-speed automated applications. The valve line includes easily maintained precision shot valves over a range of viscosities, material pressure and shot sizes, together with high-speed valves for precise deposit of heavy viscosity filled pastes. Techcon Systems will also showcase a manual syringe gun, a lightweight barrel applicator gun for medium-/high-viscosity products. It eliminates dripping and is available in sizes 5, 10, 30 and 55 cc. Techcon Systems will demonstrate a range of syringes and syringe kits, offering an ultra-low draft, construction of inner diameter yield, high accuracy and stability. The syringes are silicone and chloride-free, low-friction polypropylene and available in natural color for most generic applications, amber for protection of UV/visible light block (up to 520 nm), and black for total light block. Syringes and corresponding wiper pistons, tip caps, end caps etc. are also available. The wiper pistons, available in white, provide a seal for low-to-medium viscosity fluids. Red, straight wall pistons are recommended for reducing stringing, with medium to high viscosity fluids. Both styles are made of polyethylene. Other products include the Techcon Systems needle dispensing kit containing color-coded options from the TE, TE Bent and TT Needles. A manual-controlled version of the TS1212 valve, the Techcon gravity- or pressure-fed pen has a built-in stroke adjustment for optimum repeatability of shot and flow rate control. www.techconsystems.com.
For more information and products at the show, visit global.enepcon.com.