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ECD Debuts Thermal Quality Management Program: ThQM
April 13, 2009 |Estimated reading time: 1 minute
MILWAUKIE, OR ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification. The program targets efficient and accurate communication about issues that must be communicated to both characterize and verify the reflow or wave soldering process.
Potential issues include the identification of sensitive components, solder requirements, oven requirements, and other variables that must be taken into consideration. ThQM provides a standardized way to for both the OEM and the volume manufacturer to approach each job, no matter how different from the previous or next. The introduction of this system takes into account the release of J- STD-075, which identifies overheated passive components as probable cause for many early field failures, and suggesting that those passive components also be profiled.
ECD designed the program to fill the void left by the increasing decline of experienced EMS middle management who instinctively, from experience, knew what to specify and how to characterize the maximum temperatures of various components when OEMs asked for a transition to lead-free. ThQM provides the OEM with specific guidelines, including those of the new J-STD-075, so they can adequately communicate to their manufacturers vital information that can otherwise be forgotten or misstated. Volume manufacturers, using their own checklists, can now implement that information to best advantage.
ECD is targeting better EMS/OEM relationships and fewer field failures with this soldering process control program.
For more information, and to take the ThQM quiz, visit www.ecd.com.