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APEX PRODUCT Preview
December 31, 1969 |Estimated reading time: 11 minutes
Adsorption Component Drying
For MSDs, the adsorption drying process dries components at speeds competitive with traditional methods, without oxidation problems. Designed with IPC/JEDEC J-STD-033B.1, XSD Series desiccant cabinets deploy self-regenerating desiccant. The Zeolite drying unit in the XSD Series achieves humidity levels under 0.5% RH, combined with a precision heating system. Relatively low drying temperatures accomodate taped reels. The XSD cabinets are heavily insulated; consume less energy than baking or vacuum ovens; and offer additional features including precision measurement, 24/7 data logging, and more. Totech Super Dry, Booth 234.
SaaS MRP System
INOVISION is an MRP system featuring a modular design that contains all of the inventory control feature/functionality of INOKIT plus supply chain management tools including material requirements planning, alternatives such as a MIN/MAX dashboard, and a dispatch shipping module. The software as a service (SaaS) offering is subscription-based and scalable. INOVISION identifies and recommends purchasing requirements considering acceptable vendor list, regulatory requirements, time buckets, and existing component supply and demand. It also calculates all purchasing information for pertinent procurement decisions. Component maintenance can be conducted while in the MRP screens. It includes full vendor quote request and purchase order placement capability and a purchasing exception dashboard. Inovaxe Corp., Booth 448.
Placement System
The IINEO-2 SMT platform is a flexible, dual-gantry SMT assembler with higher feeder count, increased board size, and increased maximum component height over previous systems. The platform uses turret heads, intelligent feeders, powerful software, linear motors, and digital cameras. IINEO-2 is configurable to have 8 or 12 spindle rotary heads, 1 or 2 board positioning mechanisms, oversized board options, feeders in front and rear or front only. It handles 2.4 × 2.4 mm to 18 × 24 mm PCBs with thickness of 0.019 to 0.18". It uses full-edge clamping with fiducial correction, and features a SMEMA interface. The dual-head configuration provides 2 nozzle holders, each with 40 positions in a smart nozzle tool bank. IINEO-2 features standard placement accuracy of 35 µm (QFPs) to 60 µm (chips), intelligent feeders from 8 through 88 mm tapes and an intelligent beltfeeder for sticks, and matrix tray holder. Maximum placement rate is 14,000–26,000 CPH. Component range is from 01005 to 2.75" in QFP/BGA, connectors up to 4". Options include glue dispense with Archimedean screw, electrical test, fixed camera, conveyor auto-width adjustment, special nozzle magazine (Universal gripper nozzle), supplemental nozzle holders, and more. This platform is accompanied by software products such as multi-job optimization and wireless stock management. Europlacer, Booth 473.
Stencil
The UltraSlic FG solder paste stencil reportedly offers excellent paste release on surface area ratios below 0.5. It is said to cost less than electroformed stencils. Apertures are formed using new-generation stencil laser technology and Datum Alloys’ Fine Grain stencil material, distributed by Ed Fagan Inc. UltraSlic FG stencils target improved aperture registration, higher performance, and lower costs. Options include step stencil designs and same-day turn time. FINE LINE STENCIL, a division of FCT Assembly, Booth 846.
Digital Microscopes
HIROX digital microscopes have been optimized for the characteristics of the imaging sensor – a flat, 2-D array with a known readout rate, response curve, and pixel size. The systems use sight physiology and visual signal processing for 3D rotational microscopy and other capabilities. Objects can be inspected dynamically 360°; BGA inspection goes up to 200× magnification. The microscopes feature various lenses and peripheral devices. Illumination uses a metal halide lamp for balanced color spectrum. Two models are available: KH-1330 and KH-7700. Seika Machinery Inc., Booth 1035.
Spray Fluxing System
SonoFlux Servo is an automated, flexible reciprocating spray fluxing system for high-volume lines requiring frequent PCB width changes and multiple flux types. Capable of fluxing PCBs from 2 to 24" wide, the SonoFlux Servo features programmable selective fluxing capability on a reciprocating platform. The ultrasonic atomization module uses a high-impact flux transfer system for maximizing topside fills. It integrates into all wave solder machines. SonoFlux Servo has 500,000 recipe storage, high-precision flux delivery pump, conveyor speed sensing, and barcode reader options. It features a non-clogging ultrasonic nozzle. Sono-Tek Corporation, Booth 1236.
Programming System
The Helix programming system automating the device programming cycle at a lower price. It comprises 2 tube input and output handling systems or a tray input and output handling system as well as up to 8 sockets for device programming. The machine picks parts from the tube or tray, transfers to the programming socket, programs the part, and returns it to the tube/tray. The precision tooling head requires no vision system for handling fine-pitched parts and features an 800 device/hour throughput. It has 2 enhanced 7th generation sites with FX4 socket capability. Integrated motors open and close programming sites in synchronization with placement and retrieval of parts. One computer and software interface controls both BPWin software and control operations. Options include Flashstream sites or universal site technology supporting 26,000+ device part numbers. BPM Microsystems, Booth 1279.
Vapor Phase Rework Station
The V-Works vapor phase rework station is a single-component rework tool using vapor phase technology to transfer heat for removal and replacement of single components and connectors. High maximum temperatures, small ¿ at peak temperatures, and uniform heat are features, specifically for lead-free. A 24 x 24" working envelope, split mirror and camera vision system for aligning components, on-board recipe storage for precise rework parameters, touch screen operator interface, manual X/Y/Z adjustment, vacuum environmental system, bottom-side global preheat, semi-automatic cycle for removal/replacement, cool-down function, and safety features are included. Vapor Works, a division of R&D Technical Services Inc., Booth 1543.
XRF System
A solder analysis and identification feature of the LeadTracer-RoHS XRF system, LTRSync+ software uses the system’s K-Shell X-rays to discover substandard or counterfeit parts. It determines alloys within minutes and performs solder pot analysis. It addresses dual-alloy manufacturing issues such as non-continuous lines; off-line inspection and analysis; and other situations where leaded and lead-free can be mixed. LeadTracer-RoHS XRF analyses the entire body of the components. RMD Instruments LLC, Booth 1563.
PCB/Stencil Cleaner
AQUANOX A4241 PCB and stencil cleaner is an aqueous cleaning solution designed with an inhibition technology to be effective on tough soils while protecting sensitive parts from etch or darkening. It can be used in a multi-process environment for spray batch, spray in-line, and stencil cleaning processes. A4241 reportedly leaves shiny solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. It is multi-metal safe including bare aluminium and copper. Nonflammable, noncorrosive, nonhazardous, and biodegradable, the cleaner is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes. Kyzen, Booth 1625.
Dispenser
The Stinger modular dispensing system enables traditional screen printing platforms to dispense as well. It integrates into the screen printer alongside the machine’s vision system. Once the PCB is screen printed, it is lowered down to vision height, where Stinger can accurately dispense adhesive or paste using industry-standard materials cartridges. Ovation, Booth 1747.
Oven Set-up Software
Easy Oven Setup (EOS) software for reflow ovens automatically calculates the best reflow oven settings based on product and process limits. EOS uses a newly developed search engine to process thousands of oven settings before recommending the best options to the user. Users run their product through the oven and enter the process limits. The software is designed to eliminate repeated trial-and-error experiments. It can be used to speed up oven setting selection, optimize oven settings, and optimize line speed. Datapaq, Booth 1646.
Advanced Rework Applications
These rework systems cover common applications. Residual solder removal is used for site dressing after SMD removal or for cleaning BGA interposers before reballing. Vacuum removes molten solder and a solder removal head allows contactless residual solder removal without disturbing pads or solder resist. The company also will show its Direct Component Print (DCP) module for paste printing integrated directly into the rework tool, targeting MLF and QFN leadless component rework. Rework to reball BGAs and CSPs will be demonstrated, including cleaning and removal of defective spheres on singular, multiple, or complete arrays. This is accomplished using hot gas bottom/top heating and high-resolution optics with thermal management. FINETECH, Booth 2059.
PCB Handling Systems
A PCB hand insertion system with auto recirculation of completed product after selective soldering will be displayed. A dual operator hand insertion solution with programmable slide shuttles for auto routing and PCB introduction into a selective soldering system with underside return also will be demonstrated. This product targets manual assembly and routing of products into a selective soldering system where specialized handling is required. PROMATION, Booth 2077.
Soldering Materials
Lead-free products, advanced fluxes, bar solder, and other products will be displayed, all based on the Nihon Superior SN100C alloy. The bar solder line targets wave, selective, tinning, and similar applications. XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen, reportedly offers excellent wetting on all common metal surfaces, shiny joints, and 150-200 mm/sec printing. SN100C-XF3 is designed to eliminate voiding better than SAC alloys. Cobar Solder Products, Booth 2111.
RoHS/WEEE/REACH Materials
THERMOGARD and TRIBOGARD RoHS-/WEEE-compliant thermal transfer printable barcode label materials are designed for circuit board and related electronic component marking in the electronics industry. The materials withstand standard PCB manufacturing processes; many are designed to handle higher lead-free temperatures and more aggressive, fluxes, cleaners, and saponifiers. Polyimides are available in white and RoHS-compliant colors. TRIBOGARD static dissipative white polyimide materials are designed for RoHS applications. Polyonics Inc., Booth 2183.
Printer with Vision and Cleaning
The SP150 screen/stencil printer is a semiautomatic system with integrated stencil cleaning, controlled printing process, and digital vision system. A space-saving front drawer reduces footprint. The vision system offers two digital cameras looking through a stencil opening onto the substrate, automatically recognizing misalignment. Integrated position encoders help instruct operators in alignment. The printer controls squeegee pressure, printing speed, print stroke, and the parallel separation of the stencil from the substrate. Two squeegees automatically spread the print pressure over the squeegee length. A stencil underside cleaning system is mounted directly on the front drawer. The magnetic PCB holder can be aligned without tools. Essemtec, Booth 2225.
Automatic Defluxing System
Trident Duo batch-format defluxing system is capable of defluxing and cleanliness testing up to 200 4 x 6" and up to 28 18 x 20" boards/hour. Flexible configurations include prewash, wash, rinse, cleanliness testing, and drying. Prewash offerings include steam soak, high-pressure DI water spray, or chemical spray and soak. The wash cycle is environmentally responsible, neutralizing and solublizing flux and other residues. Rinse is controlled by the cleanliness tester. Drying uses both radiant and convection heat. An automatic chemical management system automatically measures and doses chemicals into the wash-solution recirculation system. An inverse-mounted vertically oriented spray pump virtually eliminates pump-caused dragout. Built-in SPC data capture can be remotely accessed. Aqueous Technologies Corp., Booth 2247.
Reflow Process Inspection
The Reflow Process Inspection (RPI) tool is an in-line process inspection system for SMT reflow ovens. The system is embedded inside the reflow oven and checks the profile for every product processed to verify whether the profile is in spec. Out-of-spec thermal processes lead to defects such as inadequate wetting, too large or too small grain structure, and certain types of opens and cold soldered joints. The RPI inspects whether products were processed within the relevant thermal process parameters. It generates two data points (DPMO and yield) in a simple chart daily. KIC, Booth 2258.
X-ray Inspection System
The Vertex Series-A advanced X-ray inspection system offers modular construction with various X-ray tubes, detectors and product manipulators as well as sophisticated software. Sealed X-ray tubes minimize maintenance. Inspection area is 508 × 610 mm; a large removable sample tray accommodates multiple small assemblies. The ergonomic design includes an adjustable operator console, sliding door, large product viewing window, and easy sample loading. The X/Y table is indexed tangent to the door so that heavier assemblies can be loaded with minimal effort. On-board navigation quickly maps inspection locations. The simplified operator interfaces support local languages. VJ Electronix Inc., Booth 2265.
Closed-Loop Convection Reflow Oven
The Pyramax 100A oven features 100" heated length and 8 zones, 350°C maximum temperature, flexible configuration, low power consumption, and comprehensive options. Closed loop convection control minimizes operating costs and handles difficult thermal profiles at line speed. Side-to-side recirculation enhances temperature uniformity. It offers WINCON oven control software, parts-identification software, a range of options for flux management, advanced conveyor solutions and smart tracking SMEMA, optional barcode reader, and warranty . BTU International, Booth 2424.
Test Systems
Flying prober Pilot uses a vertical architecture for high-speed, high-precision probing on both sides of the UUT simultaneously. It uses 8 electrical flying test probes, 2 Openfix capacitive and 2 power flying probes, plus 2 CCD cameras. For ICT, it can implement net-oriented measurement techniques based on measurements executed on the board signal nets. Mobile power probes enable UUT power-up without additional fixed cables. Pilot V8 can also execute parallel tests on two UUTs. The Strategy line function test systems address consumer and automotive markets with traditional ICT, low voltage/power analog functional tests, and high-frequency digital functional tests with diagnostics guided by a mathematical simulator. It has a maximum of 8192 test pins, fiber optics bus, synthethic instruments, and a DSP hardware core. Seica, Booth 2438.
Lead-free Solder Products
SN100C P600 is a halogen-free high-reliability no-clean lead-free paste offering stable printability, good wetting, minimum incidence of mid-chip balling, and low residue. SN100C P520 is a high-reliability no-clean lead-free solder paste optimized for components down to 01005s. SN100C P500 is a high-reliability no-clean lead-free solder paste with high fluidity close to its melting point and fast wetting. Nihon Superior Co. Ltd., Booth 2564. For more APEX EXPO products, visit smtonline.com SMT