-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Participate in IPC Midwest
February 20, 2009 |Estimated reading time: 1 minute
BANNOCKBURN, IL IPC Association Connecting Electronics Industries issued a call for participation for the IPC Midwest Conference & Exhibition, September 2324, 2009 in Schaumburg, IL. The conference will be held on September 23 and professional development courses will take place on September 24.
Technical experts are invited to present a paper or teach a professional development course. "This year's conference will focus on the quality and reliability of printed circuit boards (PCBs) and assemblies," says IPC conference director Greg Munie, Ph.D. "In these tough economic times, these issues can have an immediate impact on a company's profitability. We are going to put together a conference that will offer companies tangible information in these critical areas."
Technical presentations and/or papers are sought in the areas of board compliance: advances in plating technology, advances in flex and rigid-flex, via formation and fill; assembly technology: rework and repair, lead-free assembly, backward leaded/lead-free compatibility; quality/test/reliability: solder joint reliability, electrical test, X-ray/AOI; and eco-compliance: REACH, halogen-free technology, and lead free.
Abstracts must be submitted by April 14, 2009 and should include detailed case histories, field data, new technologies or innovations or research and findings. In addition, abstracts should summarize the problems and resolutions, methods used, results of experiments and benefits to the industry.
Proposals are also being solicited from individuals interested in teaching full-day (six hours) or half-day (three hours) professional development courses on design, printed circuit board and electronic manufacturing processes and materials. Proposals including course descriptions must be submitted by April 14, 2009.
For more information, visit www.ipcmidwestshow.org or contact Greg Munie at gregmunie@ipc.org or pdcoordinator@ipc.org.