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IPC APEX Expo Preview: Technical Courses and Tutorials
February 17, 2009 |Estimated reading time: 3 minutes
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries is preparing for the 2009 IPC APEX EXPO, March 31April 2, 2009, at the Mandalay Bay Resort & Convention Center in Las Vegas. In total, 35 sessions with nearly 100 papers will present the industry's leading research and findings to stimulate new thinking and inspire the next generation of innovation.
IPC's technical conference international highlights include:From the UK, Christopher Hunt and Davide Di Maio, from National Physical Laboratory will present "A Test Methodology for Copper Dissolution in Lead-Free Alloys," a study of the effect of lead-free alloys on the copper metallization of PCBs. From the Netherlands, Gerjan Diepstraten and Dr. Di Wu, Cobar Europe B.V., will discuss their study predicting the processability of solder pastes based on their performance under heating in "Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis." Representatives from IBM Corporation and Celestica International Inc. in Canada will present "Rework Process Window and Microstructural Analysis for Lead-Free Mirrored BGA Design Points," discussing the reliability impact on components when a component on the opposite side of the board is reworked. From the U.S., Gregory Morose from the University of Massachusetts will present new findings on halogen and lead-free assemblies' reliability with "Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronic Assemblies." Joe Smetana of Alcatel-Lucent, will discuss how higher temperatures of lead-free assembly affect the performance of the printed board in "Bare Board Material Performance after Pb-Free Reflow." Jennifer Nguyen, Flextronics, will talk about the steps that can be taken in printed board fabrication to reduce copper dissolution in "The Effect of Copper Plating Processes and Chemistries on Copper Dissolution." Michael H. Azarian with the Center for Advanced Life Cycle Engineering (CALCE) will present "Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders," covering the level of liability associated with electromigration by lead-free alloys. Lei Nie, CALCE, will examine copper dissolution at rework and solutions to mitigate the problem in "Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies." Full technical conference agenda at www.ipcapexexpo.org.
IPC created targeted Websites for areas of interest at APEX. Visit www.ipcapexexpo.org/html/designers-summit/designers-summit.htm for the Designers Summit; www.ipcapexexpo.org/printed-circuit-boards.aspx for PCB manufacturing issues; www.ipcapexexpo.org/electronics-assembly.aspx for electronics assembly; and www.ipcapexexpo.org/environment.aspx for environmental legislation issues.
The association also announced a new continuing education series linked to the IPC EMS Program Management Training & Certification program. Powell-Mucha Consulting Inc. (PMCI) will present the first tutorial in the series at APEX on April 2, 8 am to noon. The tutorial is titled "Find It. Book It. Grow It. A Robust Process for EMS Account Acquisition," and is designed to help EMS companies address the critical challenge of finding and growing accounts in today's volatile economy. It pulls from the principles outlined in PMCI president Susan Mucha's book, Find It, Book It, Grow It. A Robust Guide to Account Acquisition in Electronics Manufacturing Services and outlines techniques to stretch marketing dollars, deal with a shift in effective promotion options, optimize the selling process, better enunciate competitive value propositions, and grow accounts over time. Topics include business models, increasing visibility, shortening sales cycles, long-term business growth plans, and more. Those who have completed or are currently enrolled in the IPC EMS Program Manager Training and Certification Program receive a discount; the course registration is open to all. www.ipcapexexpo.org/html/main/programs-for-executives.htm.
Phil Zarrow and James Hall will present the professional development course "Lean and Green SMT Manufacturing." Joe Fjelstad, SMT Editorial Advisory Board Member Ray Prasad, Ron Lasky, Ken Gilleo and others also have courses, which will run March 29 and 30 and April 2. 2009 course highlights include Lean and Green SMT Manufacturing; Flexible Circuit Technology: Structures, Applications, Materials and Manufacturing Processes, Implementing a Halogen-Free Circuit Board Assembly Process; Nanoelectronics, MEMS and MOEMS: Products and Packages; Vapor-Phase or Convection Reflow Soldering for Lead-Free and Tin-Lead Assembly; Lead-Free Flip-Chip Wafer-Level Packaging for 3-D System-in-Packages and PCB Assemblies, and Understanding Failure and Root-Cause Analysis in Lead-Free Electronics. More courses and descriptions are to be found at www.ipcapexexpo.org/profdev.
For more about keynotes, free forums, paper presentations, and other aspects of the 2009 technical conference at APEX, read Get Ready for APEX: Preview of Technical Sessions and Noteworthy Events.