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SMTAI 2008 Products
December 31, 1969 |Estimated reading time: 11 minutes
Inspection Systems
The Agilent Medalist sj5000 AOI solution for post- and pre-reflow and 2D paste inspection uses a linear gantry developed with Anorad, a division of Rockwell Automation. It features a simplified conveyor and clamping design. It is capable of 01005 inspection. “Lead ringer” technology detects lifted leads. The company also will have demonstrations of the ×6000 automated X-ray inspection and i3070 in-circuit test systems. Agilent Technologies Inc., www.agilent.com. Booth 731.
Cleaning System
Trident III automatic defluxing and cleanliness testing is a lead-free-compatible, fully automatic post-reflow defluxing system. It is equipped with an automatic chemical injection system. The system features a closed-loop wash solution recycling system. Wash solution is heated automatically. Rinse water is sprayed onto the assemblies until the desired cleanliness level is achieved. All rinse water is directed through the pre-drain filtration system. Assemblies are dried via the on-board convection and radiant forced air drying system. Standard features include programmable maintenance reminders, remote SPC viewing, and SPC data export. An optional zero-discharge evaporation system eliminates connection to a drain line. Aqueous Technologies Corporation, www.aqueoustech.com. Booth 207.
SMD/BGA Rework Station
The RE-7500 BGA rework station incorporates advanced dark medium IR technology and can be used to remove and reflow all SMD components without damage to the assembly or component. Temperature profiles are customizable. A built-in laser pointer optimizes PCB placement. AV Repair, U.S. supplier of Jovy System products, www.avrepair.com. Booth 729.
ESD-safe Wiping Products
The friendly green presaturated wipes are low linting and designed to remove all solder pastes and resins from stencils, screens, misprints, and other surfaces. They are saturated with low-toxicity compounds and contain no solvents or HAPs, and are biodegradable. The company also will feature THE AQUAVATOR stencil wiping fabric with harmless cleaning agents embedded throughout the ESD fibers. Water activates this cleaning agent. High-Tech Conversions’ GREEN MONSTER ESD stencil wiping roll will also be on display. It is a stencil wiping roll that is antistatic as well as lead-free compatible. The fabric is made of a highly cross-linked acrylic polymer that bonds the long, coarse fibers together. Also at the booth will be durable pink antistatic wipes that feature conductive carbon fibers and sealed edges. Blue Thunder Technologies Inc., www.bluethundertechnologies.com. Booth 302.
Programming Technologies
Designed to solve excessive programming times in current in-system, JTAG, and in-circuit programming production methods, the 3000FS is modeled from the BPM 3710 handler and contains four Flashstream programming sites. Rated at 1050 devices per hour, it handles parts in tray, tube, or tape for device input or output. For high-density flash, the 2800F Flashstream flash vector programming system has upgradeable RAM for future densities. The Flashstream technology offers programming of NAND and NOR flash memory at speeds as fast as 2.5% over theoretical programming minimum, enabled by the proprietary co-processor technology Vector Engine. Also on display will be the Enhanced 7th Generation device programmers. Models 1710, 2710, 2710M, 4710, 4710-M, 3710MK2, and 3710MK2-M offer increased communication speeds and greater reliability. On-board memory was increased for higher density semiconductor devices. BPM Microsystems, www.bpmmicro.com. Booth 717.
Handheld XRF with SDD
The TRACERturboSD handheld X-ray fluorescence (XRF) instrument uses a silicon drift detector (SDD) for improved speed, sensitivity, and resolution during inspection and analysis. TRACERturboSD analyzes sophisticated light-element alloys without a vacuum or helium attachment, and offers higher speed, sensitivity, and selectivity. The company also will feature its standard S1 Tracer handheld instrument with SiPIN diode technology for routine analysis. The company’s vacuum technology, co-developed with NASA, can be combined with the SDD handheld tool. Bruker Corporation, www.bruker-axs.com/handheld. Booth 608.
AXI Systems
The Dage XD7600NT features a 2M pixel imaging system, feature recognition to 250 nm, and oblique angle views up to 70° in any position around any point. The system can be equipped with a CT option providing 3D modeling and volumetric measurement of solder joints. Other new products include the Quick View CT software that allows users to obtain initial computerized tomography reconstructions within 5 mins. The company also will debut its XD7600NTHP digital X-ray inspection system with a high-power tube, offering 10 W power and submicron feature recognition. Dage Precision Industries Inc., www.dage.com. Booth 501.
Updated Printer
The Horizon 03i is equipped with a redesigned gull wing cover for accessibility and operator convenience. Horizon 03i, run on DEK’s Instinctiv V9 operating system, is now compatible with Productivity Tools. These include Cyclone understencil cleaning technology for improved throughput, HawkEye high-speed print verification, and the HD Grid-Lok reconfigurable high-density tooling solution. DEK International, www.dek.com. Booth 800.
Thermal Profiler
The MEGAM.O.L.E.20 profiler features built-in intelligence, 20 channels, and one-button go/no-go profile validation. It is 7.2-mm thick. MEGAM.O.L.E. “M.A.P.” software, with three workflow Wizards, is included. Detachable input/output Pods permit storage of machine, assembly, paste, and Target-10 parameters for a given PCB. Instant profile checking simplifies decisions without PC download; it also collects dozens of profiles prior to downloading. NANO-connectors suit restricted-space applications and increased thermal protection. ECD, www.ecd.com. Booth 526.
Pick-and-Place Machine
The PANTERA-XV placement system is designed for prototyping and mid-size production. It handles 0201s through 50- × 50-mm QFPs and pitches down to 0.4 mm. It has 108 feeder slots and recognizes intelligent tape and stick feeders. The system places 0201s at up to 4,500 CPH. A magnetic linear measuring system is accurate to 1 µm; alignment is performed with on-the-fly laser and bottom-up vision systems. Another vision system automatically corrects PCB positions and allows component location teach-in. CAD data can be converted directly to assembly programs. Essemtec AG, www.essemtec.com. Booth 211.
Low-voiding Paste
SLIC Paste boasts improvements in printability characteristics and manufacturing performance. Benefits include extended open and idle times, consistent release from small apertures, repeatable paste deposition control during print, and no to low voiding during reflow soldering. It is available in water-soluble or no-clean chemistries and a variety of lead and lead-free alloys, including SN100C. FCT Solder, a division of FCT Assembly, www.fctassembly.com. Booth 125.
Epoxy Flux
Hysol FF6000 epoxy flux material is formulated to provide fluxing action for lead-free solder joint formation and, when cured, delivers underfill-like protection against mechanical stress. It allows for various deposition methods: screen print, dispense, dip, and jet. It also boasts broad application options as an in-line, cost-effective alternative for processes such as ball attach, PoP assembly, flip chip, and large-format BGA and CSP assembly. Henkel Corporation, www.henkel.com/electronics. Booth 806.
Lead-free No-clean Solder Paste
Indium8.9 lead-free no-clean solder paste is an air-reflow solder designed to perform like tin/lead solders. Indium8.9 was formulated to produce consistent print volumes and high paste transfer efficiency through apertures below 0.66 area ratios. Indium8.9 exhibits low voiding (<5%) over many profiles when soldering BGAs with via-in-pad technology. Indium8.9 was designed to improve first-pass yields and reduce field failures when mounting BGA devices by eliminating head-in-pillow defects. It is thermally stable and maintains a soft, pliable residue after reflow. Indium Corp., www.indium.com/big. Booth 517.
Component Storage Solutions
INOCART-MSD manages multiple component reel sizes and waffle trays in a low relative humidity safe-storage condition. Included with each is MSD tracking and timing software. Available with 48 or 24 individual cells, the product’s cells disengage from the centralized “hive,” allowing environmental control to be maintained. The system uses multiple forced convection desiccant drying modules. A digital display shows temperature and RH percentage within the material handling system; an MSD Dashboard displays the condition of each package in the factory. The company also will showcase its three-bay INOCART material handling system and corresponding INOKIT software. Inovaxe Corp., www.inovaxe.com. Booth 819.
Selective Soldering Sytem
The 350E selective soldering system comes standard with an X,Y, Z, and A axis servo drive system. The system includes a soldering unit with forced hot air nitrogen pre-heat at the mini-wave nozzle, and a nitrogen management system. Standard features include spray or micro-dot drop jet fluxer, 5-liter pressurized flux tank, quick-exchange mini-wave nozzles, lead-free-ready solder pot, auto feeder solder roll, wave height control, on-/off-line programming software, and float sensor. The 350E is available with a dual nozzle, dual fluxing capability. Also available is an endoscope process camera. The 350E selective soldering system is a result of the partnership of Soldercom, Inertec, and Juki. Juki Automation Systems, www.jas-smt.com. Booth 317.
Thermal Profiler
KIC Explorer features a compact design to move through restrictive process dimensions. It incorporates SMT technology and high-temperature-rated components. The profiler has 12 thermocouples for complex thermal requirements, using a miniature-TC harness design. It also provides high sampling rate, memory capacity, and data precision. Software measures all critical profile and process data, including slope, peak temperature and time above liquidous, as well as the Process Window Index (PWI) statistic to determine the profile’s fit to the available process window. Manual prediction capability is standard. Optional KIC Auto-Focus automates process improvement and optimization. KIC, www.kicthermal.com. Booth 815.
Engineered Materials Sets
Products from FCT Assembly, Dow Corning Corp., HumiSeal Conformal Coatings, and Techcon Systems will be on display in this distributor’s booth. Dow Corning products include injection-mold novel resin-based silicones for high-throughput LED device manufacturing. HumiSeal conformal coatings are designed to improve product lifespan and reliability, and protect assemblies and components against environmental stress. Techcon System’s dispensing components range from disposable accessories to complete microprocessor-controlled dispensing systems, and precision valves. The distributor also will feature FCT Assembly’s range of soldering products based on the SN100C lead- and silver-free alloy from Nihon Superior. Krayden Inc., www.krayden.com. Booth 330.
Aqueous Cleaner
AQUANOX A4625 is an aqueous chemistry designed for cleaning lead-free residues while providing mirrored solder finishes. This product is environmentally friendly, has a long tank life, and is safe for multiple pass applications. A4625 runs at low concentrations and low temperatures. AQUANOX A4625 is a biodegradable low-VOC aqueous solution that contains no CFCs or HAPs. It is compatible with materials commonly used in electronics assembly manufacturing and cleaning. Kyzen Corporation, www.kyzen.com. Booth 401.
AOI System
MV-3L is a five-camera AOI system. The proprietary “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. An Intelli-Beam laser system measures Z-axis height for coplanarity testing of BGA/CSP devices and enhanced solder paste measurement. Automatic Teaching Tool (ATT) software uses CAD centroid data. Typical programming time is under one hour per assembly. The standard SPC software package helps track and eliminate defects. MIRTEC Corp., www.mirtecusa.com. Booth 424.
Flexible Placement System
The MY100 Series placement platform offers 70% more throughput and a higher feeder capacity than previous generations. The new series consists of MY100DX-10 and MY100DX-14, with 96 and 160 feeder positions respectively, and can be configured with various options. The machines are compatible with the existing range of machines, feeders, and software. The company also will highlight its MY500 “digital stencil” solder paste printer. MYDATA automation, www.mydata.com. Booth 417.
Lead-free Pastes and Fluxes
An expanded range of SN100C Sn/Cu/Ni/Ge alloy includes eCore low-spatter lead-free flux-cored solder wire; two types of SN100C solder paste – no-clean ePaste for general reflow purposes and ePaste, a special low-voiding paste for critical applications such as die attach; P500 flux medium with high fluidity close to its melting point and fast wetting in a no-clean halide-free medium; eBalls for flip chips and area-array packages; eFlux; and SN100CL for HASL processes, including fine-pitch. The SN100C alloy demonstrates drop-in lead-free replacement traits. Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., www.nihonsuperior.co.jp. Produced with North American partner FCT Assembly. Booth 125.
WEEE-/REACH-compliant Materials
TRIBOGARDS static dissipative white and colored polyimide materials suit RoHS applications. The full line of THERMOGARD and TRIBOGARD RoHS-/WEEE-compliant thermal transfer printable barcode label materials will be at the show. Many REACH-compliant materials are available. THERMOGARD and TRIBOGARD label materials are designed for circuit board and related electronic component marking. They withstand standard PCB manufacturing, most tolerate higher-temperature lead-free manufacturing, as well as aggressive fluxes, cleaners, and saponifiers. Polyonics Inc., www.polyonics.com. Booth 607.
Selective Soldering System
The GoSelective Light is an alternative to hand soldering for small and medium production. During the process, the assembly remains in a fixed position; the work stations, mounted on a high-precision axis system, successively approach the solder. The GoSelective Light suits lead-free and leaded processes. It will be featured with a micro drop jet fluxer. The system also includes a preheat area. The nozzle technology permits small distances between solder joints. A local nitrogen inertization ensures oxide-free wave. SEHO North America Inc., www.sehona.de. Booth 635.
Flying Probe Test System
Pilot V8’s vertical architecture enables high-speed/high-precision probing on both sides of the UUT simultaneously. It includes eight electrical flying test probes, two Openfix capacitive and two power flying probes, plus two CCD cameras and mobile power probes. With 14 mobile resources available, Pilot V8 has a range of in-circuit and functional test capabilities. It can implement a series of net-oriented measurement techniques. Pilot V8 can also execute parallel tests on two UUTs. Seica systems run on its VIP software platform. Seica S.p.A., www.seica.com. Booth 500.
Placement System
The SIPLACE X-3 features a SIPLACE 20-nozzle Collect&Place head, placing 01005s through 6- × 6-mm components. Intelligent feeders ease setup and changeovers. Private demos are available. The company also will feature its suite of software tools. Siemens, www.siemens.com. Booth 201.
CT X-ray System
The Vertex Series-CT X-ray system is a high-resolution CT system designed to analyze the inner structure of any specimen. It offers a flexible configuration with a range of X-ray tubes, detectors, motion hardware, and mechanical components. The system software is provided through cooperation with the Fraunhofer Institute. The adaptive computing network can be optimized for economics, speed, or reconstruction volume. Available in different sizes, the Vertex system at the show measures 54 × 36". VJ Electronix Inc., www.vjelectronix.com. Booth 825.
Design and Manufacturing Services
A contract manufacturer, Zurvahn will display various PCBs to highlight its design capabilities. The company also will showcase its thru-hole and surface mount solutions as well as the flexible circuit products it manufacturers. Zurvahn LLC, www.zurvahn.com. Booth 706.