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Intelligent Autorouting Solution
December 31, 1969 |Estimated reading time: 4 minutes
Moving away from settings–based autorouting, the Dragon Routing Platform combines intelligence and a methodology–driven approach. The “Routing Strategy Environment” (RSE) applies all the knowledge required for next–generation high–speed boards with a guided step–by–step process for more accurate results in a shorter time frame. RSE helps define the strategy and will analyze designs for potential routing problems and suggest alternative routing strategies to overcome them. Sophisticated routing algorithms for specific routing tasks such as fan–out generation, 45° single net routing, and differential pair routing are all incorporated. The Dragon Router is available in the next version of CR–5000 Lightning. Zuken, Munich, Germany and Westford, Mass., www.zuken.com.
Triple–stack Dummy PoP
A dummy version of the Amkor PSvfBGA middle–stacked package that makes a triple–stack PoP measures 12 × 12 × 0.65 mm, targeting stacked daisy chain packages. The dummy component version is identical to the live package (without a die); made of the same materials on the same manufacturing lines; with the same size, thermal, and soldering properties. This middle package is designed to expand device options by simplifying the business logistics of stacking, integrated at the system level, meet JEDEC standards, eliminate margin stacking and expand technology reuse, and manage cost impact from multimedia processing and memory integration. Practical Components Inc., Los Alamitos, Calif., www.practicalcomponents.com.
AOI Software Pre–release
The V400 suite offers numerous advances from prior generations, including a reduction in programming time of 40%. A new strategy defines the easiest and shortest way to generate high–quality inspection programs. A new function creates customer libraries automatically, which allows users to deploy the same library in different process stages from first–off inspection until post–reflow or post–wave soldering. Other enhancements include a “Calculation” algorithm that operates in conjunction with proprietary “Synthetic Imaging” algorithms and facilitates the deployment of rule–based algorithms to improve AOI system capability, ideal for high–volume production applications. The software targets high real–defect detection with low levels of false calls. V400 also features an improved color modeling algorithm that dynamically allocates color information depending on the characteristics of the object to be inspected. V400 software is said to offer better AOI programs in less time and with less effort. Marantz Business Electronics, Eindhoven, the Netherlands, www.marantz.com.
Conductive Polymer Thick Films
ElectroSperse P–series silver–based conductor pastes are designed for use on low–temperature plastic substrates typically found in display electrodes, touch screen sensors, heaters, RFID antennae, biosensors, and membrane switches. The pastes are said to demonstrate excellent adhesion to a variety of flexible media, including indium/tin–oxide (ITO)–coated polyester. P–series products contain a highly uniform dispersion of silver with a tightly controlled particle size distribution in the low to submicron range. Users can directly print features as small as 50–µm wide, eliminating the need for costly subtractive processes. The ElectroSperse line also includes D–series silver–based cermet pastes, designed for firing onto glass and other high–temperature substrates. D–series pastes are available in both leaded and lead–free versions, suiting printed interconnects and linearization patterns in capacitive and five–wire resistive touch screen sensors. Five Star Technologies, Cleveland, Ohio, www.fivestartech.com.
Heat–reactive Transfer Adhesive
For general purpose bonding and electronic product assembly, Thermofilm H212U provides structural bond strength on a range of substrates including plastics, metals, and ceramics. The product activates and cures on exposure to heat and pressure, and is formulated for silicon chip bonding on electronic assemblies, gasket bonding, laminating to PVC and other plasticized materials, and splicing. Once cured, this transfer adhesive offers resistance to solvents, plasticizers, and elevated temperatures. A relatively low bonding temperature allows it to be used on temperature–sensitive substrates and sensitive electronic devices. For smart card manufacturing, It permanently bonds smart card chips onto PVC, ABS, PVC/ABS blend, PC, PET–G, and PET–F card materials. The adhesive’s soft bond minimizes chip damage. It reportedly meets or exceeds ISO 7810 requirements. Thermofilm H212U is a 2–mil–thick nitrile phenolic thermosetting transfer adhesive. Scapa North America, Windsor, Conn., www.scapana.com.
LED–on–Film Placement System
Based on the FLX2010 MKL, a three–head system was designed for economically dispensing solder paste, isolating adhesives, and placing LEDs on film substrates. The head features a placement axis with an integrated component adjustment mechanism, as well as two independent axes with a piezo flow valve and a time–pressure dispenser gear. The dispensing valves are mounted on motorized, closed–loop–driven precision linear axes to ensure an accurate movement in the Z axis. The substrate is positioned on the machine table and is secured by vacuum. A vision system offers fiducial alignment; the time–pressure dispenser applies three dots of isolating adhesive on the substrate. Solder paste dots are applied on the solder pads using a high–precision, piezo–controlled PFV nozzle. The LEDs are picked and placed from the company’s standard feeders. The isolating adhesive eliminates unwanted electrical contact between the solder dots. Essemtec AG, Aesch, Switzerland, www.essemtec.com.