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From the Show: SMT/HYBRID/PACKAGING Goes Automotive
June 5, 2008 |Estimated reading time: 1 minute
By Françoise von Trapp, contributing editor
NURNBERG, Germany The highlight of SMT/HYBRID/PACKAGING 2008 was a demonstration line for automotive electronic assembly that moved a PCB assembly through its paces from bare board through to conformal coating steps. Featuring equipment from a host of international companies, it gave attendees a glimpse at the intricacies involved in today's automotive assembly.
Beginning with a Brady marking system for traceability, the board moved along a Rommel conveyor system from Muehlbauer, through a DEK Horizon stencil printer featuring Ovation's Gridlock tooling depositing AIM lead-free solder paste. A Test Research Inc. (TRI) post-paste inspection system provided a 3D image of the solder paste on the PCB. Next was a trip through the Siemens X3 pick-and-place system, which placed heterogeneous components including 01005s, heatsinks, bare die, BGAs, and flip chip components at speeds up to 75,000 CPH. The tool was fitted with a special flux dipping unit for the flip chip placement.
Batch solder reflow was next, performed with a fixed vapor phase system from IBL. TRI also provided AOI inspection with its ATE TR500, featuring a full color range to illuminate the PCB, and cameras positioned to give views at different angles. Heavy wire bonding for power transistors was done post-reflow on an F&K Delvotek wire bonder that features a modular head system for 30-minute changeover from heavy aluminum wire bonding to fine gold wire. An Itochu flying probe tester performed in-circuit testing. Asymtek's Axiom jet-dispensed UV-curable underfill system and a Werner Wurth PVA system handled encapsulation and coating of the components. A Fineplacer from Finetech ended the line for rework and repair, and the entire operation was coordinated through the use of ITAC software. The assembled tools in the line demonstrated the international representation at this year's show. In addition to the SMT portion of the line, there was also a series of packaging tools showcasing the full electronic assembly process. Many companies exhibiting talked about the move towards collaborative development in the industry and automotive is just the tip of the iceberg.
Look for more highlights from the show in our next SMT WEEK e-newsletter.