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NEWS ANALYSIS
December 31, 1969 |Estimated reading time: 4 minutes
Review: BPA’s High–value Flex Report
BPA Consulting released “High-value Flex and Flex-rigid Substrates Market Opportunities 2006–2012,” a specialized market and technology review for assemblers, fabricators, and materials suppliers studying higher-margin flex and rigid-flex assembly markets. These comprise certain medical, military, aerospace, computer, and communications applications. BPA sees the flex PCB market growing rapidly — it increased from $2 billion in 2001 to more than $7 billion in 2006 — and high–value substrates make up about one–fifth of the industry.
Finer features, higher layer counts, thinner materials, and higher reliability define the higher–value flex and flex–rigid substrates. BPA points to optical subassemblies, hearing aids and other medical devices, missiles and satellites, and related applications as key to the higher–value segment. These areas are typically lower volume, targeting specific projects or emerging markets.
BPA compiled the report from interviews with substrate suppliers, end users, EMS and ODM companies, and materials and process equipment developers. It also used proprietary forecasting techniques to determine opportunities, key players, impact, and segment growth. While flex-rigid for medical applications will “remain in the West,” finer–featured flex, for transducer and detector arrays, is “shifting to Asia,” according to the report. BPA also notes sourcing regulations for defense applications, the booming healthcare market, and commercial interests that pull certain flex and flex-rigid production to Asia, the U.S., or Europe. Niche, high&ndah;value markets hold sway in the West, as “the European market consumed $116 million flex and flex–rigid PCBs in 2006 for medical, military, and aerospace applications.” BPA adds that revenues in North American for these application areas reached $347 million.
While a large segment of flex products end up in high–volume consumer or computing products, the niche, high-value markets represent interesting opportunities for suppliers and assemblers. Some may not develop into viable commerce for several years, while others are in full swing today. For more on this report, contact BPA Consulting at www.bpaconsulting.com.
SCANFLEX Boundary Scan Integrated with ATE
JENA, Germany — GOEPEL electronic integrated modified versions of its SCANFLEX boundary scan platforms onto Teradyne’s Spectrum 8800-series board test platform and Aeroflex’s 5800-series multi-configuration automatic test equipment (ATE). On Teradyne’s 8800 platform, GOEPEL’s CASCON GALAXY software can access and use probes in the equipment’s bed-of-nails adapter, driving and measuring circuit nodes. This partnership supports unaltered reuse of all JTAG/boundary scan test and programming procedures. With Aeroflex’s 5800 machines, GOEPEL integrated PXI-based SCANFLEX boundary scan to enable structural device and board- and system-level test access throughout the product life cycle without bed-of-nails test access.
EMS Code of Practice
LONDON —Intellect, a trade association for U.K. technology firms, launched a code of practice for EMS providers, stressing high quality and professionalism. It is a “landmark” document, said Phil Inness, chair of Intellect’s Association for Contract Electronics Manufacturers (ACeM), adding that it demonstrates commitment to a solid future for electronics manufacturing in the U.K.
The document covers 20 areas, ranging from products to individual skills to dispute resolution, corporate social responsibility (CSR), and sharing of best practices. All members of ACeM agreed to adhere to the code, and Intellect is seeking industry-wide adoption. Members that repeatedly fail to comply will be asked to leave the industry body “because they will be failing to reach the high standards aspired to by Intellect members.” To see the code, visit www.intellectuk.org.
Henkel Expands European Labs
HEMEL HEMPSTEAD, U.K. — The electronics group of Henkel completed expansion of its R&D and applications lab in Hemel Hempstead, adding development and testing capabilities and remodeling the facility. The investment covers advanced conformal coating development tools — such as automated selective dispensing applications — and expanded testing for materials compatibility. Advanced production and analytical equipment was selected for adaptability to future market requirements.
Henkel’s expanded U.K. lab includes an assembly line.
The lab operates a PCB assembly line and testing area for studying material behavior in–process. Technical R&D teams at Hemel Hempstead work in concert with applications teams to coordinate customer projects, streamline product development and introduction, and build and test parts for specific applications. The Hemel Hempstead facility measures 225 sq.m.
October Book-to-Bill steady
The combined rigid and flex PCB industry book-to-bill for North America held at 1.08 in October, according to IPC. The market was slightly depressed for flex and rigid PCBs throughout the month.
- Shipments for rigid PCBs were down 0.8% from October 2006, and bookings dropped 1.7% from the same month last year. Compared to September 2007, billings slid 10.7% and bookings fell 16.4%.
- Flexible circuits posted a 8.6% decline in shipments and a narrow 0.2% rise in bookings from October 2006. Compared to the previous month, flex shipments decreased 0.3% and bookings jumped 6.8%.
- Combined, the flex and rigid PCB market slowed by 1.3% in billings and 1.6% in bookings from the same month last year. Compared to September 2007, shipments of flex and rigid PCBs decreased 10.1%; bookings dropped off 15.2%.