NEW PRODUCTS
December 31, 1969 |Estimated reading time: 3 minutes
Dual-port Soldering System
The Hakko FM-203 offers two ports for using multiple Hakko tools, such as two soldering irons or a combination of soldering iron and SMD hot tweezer or mini hot tweezer, or a desoldering tool. The product’s sleep mode engages when handpieces are returned to holders. A lockout key card prevents unauthorized temperature adjustments. Other benefits include auto shutoff and process control. American Hakko Products, Inc., Valencia, Calif., www.hakkousa.com.
Water-based Conformal Coating
Reducing VOC emissions in high-volume, in-line dip coating, the 1H20 AR3 conformal coating targets automotive and other extreme-temperature electronic assemblies. It is high performance, high solids, fast drying, and water based. Electrical properties are similar to those of solvent-based acrylics, and adhesion properties reportedly are improved, as is chemical resistance. Build-per-dip equals 40 μm for the acrylic emulsion. Cure time is 15 min. at 80°C. The coating dries transparent for inspection, and has a UV tracer in the compound to aid UV inspection. HumiSeal Europe, Chase Specialty Coatings, Chase Corporation, Camberley, U.K., www.humiseal.com.
Inventory Management
Comprising a motorized surface mount parts counter, barcode reader, and label laser printer, the 2000 PRO component inventory management system targets shortage detection, traceability, and year-end or on-the-spot inventory tallies. Users scan barcodes on the reel, verify counts, and print new labels with current quantity, date, and time. The counter processes 2- to 32-mil-pitch taped parts. Manncorp, San Diego, Calif. and Willow Grove, Pa., www.manncorp.com.
Micro Assembly System
The micro assembly cell MicRohCell and exchangeable platform system MicRohFlex enable economic assembly of small, precise products and components. Mounting platform changeovers reportedly are performed in minutes, and manual operations can be built into the line. Accuracy reaches ±2 μm, and the MicRohCell uses an X/Y/Z portal system with linear drives. Working area on the assembly cell equals 510 × 450 × 80 mm, with additional units expanding lines. The MicRohFlex system can be equipped with a dip module, camera, or other tooling. Rohwedder AG, Bruchsal, Germany, www.rohwedder.com.
Resettable SMD
In the PolySwitch resettable polymeric positive temperature coefficient (PPTC) SMD family, the picoSMD035F offers overcurrent protection for consumer and computing assemblies. It occupies an 0805 EIA-compliant form factor for high-density designs, and boasts low power dissipation at 6 V. The device provides 0.35-A hold current, 0.75-A trip current, and 1.4-Ω maximum resistance. Full-edge terminations are nickel-gold finished, and the device is RoHS-compatible. Tyco Electronics Ltd., Menlo Park, Calif., www.tycoelectronics.com.
Thermal Profiler
The MEGAM.O.L.E. 20 profiler uses four nano-connectors to offer 20 channels. It is 7.2-mm thick to suit use with nitrogen curtains, smaller PCBs, and other space constraints. It has capacity for more than 25 runs prior to data download. Three workflow Wizards program setup and M.O.L.E.-Readiness indicators prevent wasted runs. The OK Button feature signals whether parameters are within limits. MAP software generates ramp, soak, time above liquidus, and peak temperature data into a color-coded summary. ECD, Milwaukie, Ore., www.ecd.com.
Repair Station
The Weller WR3M suits electronics assembly repairs at manufacturing facilities, engineering operations, and labs. It has three independent tool channels with automatic tool detection and 400-W power. An LCD display shows machine settings. Sensors offer digital control and heat transfer. High-speed measured-value acquisition targets temperature precision and optimized performance in load situations. The station is bundled with a hot-air pencil, soldering iron, desoldering iron, and vacuum pencil. The system integrates with a PC for data logging and monitoring. Cooper Hand Tools, Apex, N.C., www.cooperhandtools.com.
Epoxy Resin
A bromine-free resin system for Dicy cure formulations with UL V0 qualification, BF 180 comprises XZ 92740.00 epoxy resin solution and XZ 92741.00 co-hardener solution. It helps PCB makers reach Tg up to 180°C and Td as high as 380°C. Reported benefits include better signal integrity, lower dielectric constant and loss, higher transmission rates, and lower signal loss. The resin system is said to reduce a laminate’s density for better stress resistance in lead-free soldering. Adhesion and toughness properties also are strengthened. Dow Epoxy, Midland, Mich., www.epoxy.dow.com.
High-speed AXI System
With programmable angle-shot capability, the high-speed X2.5 AXI system automatically inspects solder joints - including BGA, quad flat-pack no-lead (QFN), and thru-hole joints - on double-sided PCBs with reportedly high throughput. The wide X-ray beam enables a usable radiation cone of up to 100° with a minimal focal spot of 5 μm. Object resolution ranges from 5 to 10 μm. A high-speed linear drive table positions PCBs with ±5-μm accuracy for up to four X-ray images/sec. Slice-filter technology (SFT) is said to enhance hidden and overlapped joint inspection. Other features include automatic conveyor adjustments, variable angle control, automatic fiducial positioning, and on-the-fly changes from field of view (FOV) to X-ray imaging. MatriX Technologies GmbH, Dachau, Germany, www.m-xt.com.