-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Requests Abstracts
December 7, 2007 |Estimated reading time: Less than a minute
ORLANDO, Fla. and SHANGHAI, China The SMTA is requesting abstracts for technical papers and presentations at its 2008 tradeshows, including SMTA International (SMTAI) in Orlando and three SMTA China shows in Shanghai, Shenzhen, and Tianjin.
SMTAI will occur August 1721, 2008, in Orlando. Abstracts for SMTAI are due by January 7, 2008, and should describe significant results from experiments; emphasize new techniques; and contain technical, economic, or appropriate test data. Materials should be original, unpublished, and non-commercial in nature. The SMTA will announce accepted papers in March, with final manuscripts due in June 2008. To submit a paper on emerging technology, business, PCB technology, process control, or another topic, visit www.smta.org and click Call for Papers.
The association also will accept abstracts for technical papers or presentations at its events in conjuction with Nepcon China in Shanghai, Nepcon South China in Shenzhen, and Bohai Electronics Week in Tianjin. Topics of interest include SMT assembly, advanced packaging, and lead-free reliability. Abstracts should obey the above guidelines, and be written in Chinese and English. For Nepcon China, submit an abstract by January 8, 2008; for South China, submit by April 27, 2008; and for Tianjin, abstracts are due by July 10, 2008. Full details are available at www.smta.org/education.