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SMTAI Show Highlights
October 10, 2007 |Estimated reading time: 5 minutes
ORLANDO, Fla SMTA International, October 711 in Orlando, enjoys its first year with an SMTA exhibition, selling out booth space. The show offers next-generation products, the Lead-free Symposium, live "chat rooms" on the exhibit floor, and a roster of technical speakers, tutorials, and certification instructors. Following are some highlights from the show floor from SMT, Indium, Austin American, ZESTRON, ACE, Assembléon, Asymtek, Cooper Hand Tools, CyberOptics, Henkel, DEK, EFD, Kyzen, Practical Components, Seica, PROMATION, and VJ Electronix.
The SMTA's Lead-free Symposium will occur for the 7th consecutive year, covering lead-free soldering technology and environmental compliance issues. Rework, design for manufacture (DfM), reliability, intrusive reflow, military applications, defects, China RoHS, and other lead-free topics will be examined. Organized by Paul T. Vianco, Ph.D., Sandia National Labs, the Lead-free Soldering Symposium will consist of a lead-free plenary presentation on China RoHS, as well as technical sessions on solder joint reliability of SAC alloy variants, iNEMI projects, and other topics.
SMTAI is also introducing a Global RoHS Symposium. The half-day Global RoHS Symposium was organized by Rob Rowland of RadiSys Corp., and features "The RoHS Revolution and Environmental Compliance Case Studies: No One Said It Would Be Easy." See the free session, "Regulatory Marking of Boards and Components for Lead-free World," presented by Steve Greathouse, Greathouse Solutions, LLC., Wednesday, October 10.
Dage Precision Industries' David Bernard, Ph.D., product manager, X-ray systems, will participate in the Process Advice and Defect Clinic on the show floor. Bernard will offer free and unbiased technical advice on common process problems, RoHS compliance issues, and field failure analysis, joining consultant Bob Willis, an SMTA lead-free auditor and workshop instructor. Visitors are encouraged to bring board assemblies for examination or process problems for discussion and review.
SMT presented its "The Heat Is On" panel on thermal management. Indium Corporation's Jordan Ross and Karthik Vijayamadhavan participated in the discussion, addressing thermal challenges caused by increased density at device, package, board, and system levels. Sherman Ikemoto, Flomerics; Alan Rae, Ph.D., NanoDynamics; and Brian Toleno, Ph.D., Henkel Technologies, participated in the panel as well. Austin American Technology will be discussing market trends in cleaning, introducing the AquaTherm cleaner, and providing some insight into other products currently in development at Booth 619.
ZESTRON America's Umut Tosun, M.S.Ch.E, accredited cleaning expert and application technology manager, is presenting "A New Definition of Low Stand-off Cleaning," a study of the impact of mechanical versus chemical contributions during the removal of contamination under 12 and 45 mil stand-off components, respectively. Experimental data addresses fluid flow patterns, temperature- and concentration-related effects, and data confirming general compatibility between residues and cleaning technologies.
ACE Production Technologies Inc. will debut its selective soldering systems with internal preheating modules, designed to meet challenges with thermal distribution and soldering results encountered on large, high-mass assemblies. Visit ACE at Booth 230.
Assembléon will highlight Release 2.0 of the Assembléon Manufacturing Suite (AMS), an open architecture package to increase connectivity to factory automation software and enterprise-wide networks. The release is said to shorten product ramp time and provide full control of the logistical flow. Visit Assembléon at Booth 609.
Asymtek, Booth 432, will display its DispenseMate D583/585 platform. The product is said to offer accuracy and repeatability in a compact system, providing an automated dispensing option for batch production, lab, prototyping, and R&D applications.
Cooper Hand Tools is debuting its Weller WHA900 hot-air station, which uses closed-loop feedback control to maintain a set temperature at the nozzle, regardless of airflow rate. A sensor in the nozzle adjusts heat output to stabilize at a pre-selected applied temperature, enabling lead-free and precise rework of surface mount device (SMD) components. Visit Cooper at Booth 123.
CyberOptics Corporation will display the SE 300 Ultra 3D solder paste inspection system at Booth 6. The next-generation in-line system accommodates panel sizes from 101 × 35 mm to 508 × 508 mm, handles odd-shaped pads, features improved paste height accuracy calculated using 200 thousand reference points, and can be integrated into manufacturing control systems.
Henkel, Booth 604, will introduce Macromelt low-pressure molding encapsulants for high-pressure injection molding and potting. The polyamide hot-melt material encapsulates circuitry and forms the outer shell of a package or assembly, reducing process time. Its low viscosity avoids damage to sensitive electronic components and enables fine-pitch applications.DEK is showcasing Horizon 01i for high-mix or high-volume applications. The system includes Instintiv user interface, HawkEye 400 post-print verification technology, Cyclone under-stencil cleaning system, and HD Grid-Lok tooling. See DEK International at Booth 623.
EFD, Inc., a subsidiary of Nordson Corporation will announce a no-drip SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation targets gap filling and application on vertical surfaces, as for soldering around a heat tube or heatsink. EFD is exhibiting No-Drip SAC305 solder paste at Booth 313.
At Booth 501, Kyzen Corporation will introduce the AQUANOX A4625 aqueous chemistry. The cleaner removes lead-free residues and is environmentally friendly. It has a long tank life and is safe for multiple-pass applications. A4625 runs at low concentrations and low temperatures.
Practical Components, Booth 510, will display dummy-component versions of Amkor Technology's package-on-package (PoP) PSvfBGA, a stackable fine-pitch BGA; Amkor's thin-substrate micro leadframe-TAPP (tsMLF); next-generation sub-100-µm flip chip test die; and redesigned Cookson, Indium, and AIM Print Test Boards and Kits.
At Booth 616, Seica will highlight the Firefly laser selective soldering system. Based on the VIVA Integrated Platform, the system offers a three-step process for generating, verifying and running a soldering program, as well as other software tools that can improve system flexibility and performance. The integrated temperature-control system provides feedback during the soldering process with a real-time, on-screen display of thermal profiles.
PROMATION has made available its next-generation 600-mm single drive transfer conveyor, 1000-mm single- and dual-drive transfer conveyors, and a full-featured 1000-mm dual-drive work station. Visit PROMATION at Booth 704.
VJ Electronix, exhibiting at Booth 600, will highlight its Summit 1800A advanced rework station, capable of lead-free rework with large components. A 65-mm alignment field of view (FOW), digital and optical zoom, and split image are standard. The system includes a programmable motor-controlled top heater and independent pick-up motion with zero-force removal.
To see more product profiles from SMTAI, read our Preview in the September issue.
For full details on SMTA International, visit www.smta.org/smtai or contact JoAnn Stromberg, (952) 920-7682.
For a list of award winners announced at SMTAI, see SMTA Congratulates 2007 Awards Winners.