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Samsung Increases Throughput on Flexible Platform
October 4, 2007 |Estimated reading time: Less than a minute
HORSHAM, Pa. Dynatech Technology, Samsung's SMT Assembly Solutions distributor, will debut the SM411 and SM421 pick-and-place systems at Mexitrónica, October 2325, 2007 in Guadalajara, Mexico. The placement systems are based on the company's SM400-series Smart platform.
Adding the SM411 chip shooter and SM421 flexible mounter allows Samsung to increase throughput on a flexible product line, said Mike Foster, CM, Dynatech. The SM411 achieves 42,000 CPH placement at IPC standards, and 30,000 CPH for SOP. It is based on a dual-gantry platform with flying vision cameras for a range of component sizes. It has single- and dual-lane capability and accepts IQ intelligent SM feeders for inventory and production monitoring.
The SM421 features IPC placement speeds of 21,000 CPH. It has a high-precision single-gantry design for fine-pitch-component placement as well as standard-chip mounting. Combining on-the-fly recognition with fine-pitch stage vision reportedly enables high-mix placement. Like the SM411, it accepts IQ feeders, and can operate in tandem with the SM411 machine.
For more on SM line, visit www.dynatechsmt.com. To learn more about Mexitrónica, see Networking Buyers to Suppliers Mexitrónica's Focus.