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SMTAI 2008: Call for Abstracts
October 1, 2007 |Estimated reading time: 1 minute
EDINA, Minn. The SMTA International (SMTAI) technical committee is accepting abstracts and short-course proposals for SMTAI 2008 through January 7, 2008. Topics solicited fall into emerging technologies, components, assembly, PCB technology, and business. SMTAI 2008 will take place August 1721 in Orlando, Fla.
SMTA suggests emerging technologies papers related to materials and processes, consumer applications, MEMS, nanotechnology, 0201/01005 components and assembly, and other areas. Components abstracts can deal with BGAs, battery interactions, flip chip and direct chip attach, harsh environment, fine-pitch components, and other topics.
The assembly category covers adhesives, alternative alloys, lead-free, copper erosion, lean manufacturing, medical electronics, selective soldering, and a range of related elements. PCB technology includes black pad, embedded passives and actives, microvias, substrate solderability, and all aspects of surface-finish process control.
The last category, business, covers broad interest areas, including contract manufacturing, Asia, environmental issues, supplier management, and technology roadmaps.
Awards will be given for best of conference, best of proceedings, and best international paper. Abstracts can be submitted, by January 7, 2008, at www.smta.org. SMTA will notify selected authors by March 3, 2008, with final manuscripts due June 1, 2008.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished, and non-commercial in nature. Authors should obtain all necessary approvals for submitted material before sending to the SMTA. For more information, email JoAnn Stromberg, or see our Events page.