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Symposium Assists with HDI Design Techniques
September 13, 2007 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. Three top PCB design gurus will share their expertise on board design trends and technologies at the IPC Designers Learning Symposium, October 10, 2007, in Santa Ana, Calif.
Happy Holden of Mentor Graphics will discuss the pros and cons of high-density interconnections (HDIs) and implementing them into designs. Gil White, Dynamic Details Inc., will cover HDI fabrication and enabling technologies; and Rick Hartley of L-3 Communications will give attendees information on grounding methods to control noise and EMI.
The Designers Learning Symposium will also feature tabletop exhibits connecting designers with suppliers. Attendees can also speak directly with presenters. "As technology advances, designers are constantly challenged by packaging density issues," commented Scott McCurdy, president of the Orange County chapter of IPC. "No other event to date has offered this trio of experts together in one location," said Javier Jimenez, LA County chapter president. These two chapters are sponsoring the event.
As a follow-up to this symposium, Certified Interconnect Designs (CID) and Advanced Certified Interconnect Designers (CID+) workshops will occur October 11-121, with the exam scheduled for October 13.
Designers who are interested in registering for the event, or exhibiting, can download the conference brochure. Contact Nate Fitt, IPC Designers Council technical administrator at (847) 597-2827 with questions.