-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Executive Forum Fosters Innovation
August 31, 2007 |Estimated reading time: 1 minute
BANNOCKBURN, Ill. IPC Association Connecting Electronics Industries will highlight success through innovation at its 2007 Executive Market and Technology Forum Conference in Shanghai, China, September 19-20, 2007.
Themed "Innovation: The Driving Force Behind the Electronics Industry," the event is co-hosted by the Hong Kong Printed Circuit Association (HKPCA) and the China Printed Circuit Association (CPCA). The Management Meetings and Executive Forum conference will be combined and feature presentations on globalization, innovation challenges, management issues, and market opportunities. "Our conferences benefit from the regional perspective that our partner organizations bring to these events," commented Sharon Starr, IPC's director of market research. "Combining forces with CPCA and HKPCA makes this conference both global in scope and focused on the needs of the companies operating and doing business in Asia."
The event's opening day hosts a keynote address from John Gross, director of Asian Operations Engineering for Dell Incorporated. Grosso will discuss his company's future vision and its expectations from the suppliers in the interconnect industry so the supply chain can make future plans. Nick Pearne of BPA Consulting will give an overview of IPC's commissioned study on geographic strategies for global expansion. Wang Longji, president of the CPCA, will offer solutions for sustainable development in light of new environmental challenges. Other topics include economic forecasts for the electronics industry, technology innovation challenges and their effect on the supply chain, embedded components, printed electronics, and standardization for final finishes.
Day 2 will focus solely on management challenges and market opportunities. Shauzab Ladha, IBM Global Business Services, will look at the business side of managing innovation. Daniel Chan, global PCB council chairman, Integrated Supply Chain, IBM, will speak to best practices for global supply-chain management. Discussions will also touch on flexible circuit market forecasts, moving from rigid to flexible PCBs, and how Asia-based business entities can overcome entry barriers in overseas markets. For more information, visit