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Versatile Flip-chip Underfills
August 31, 2007 |Estimated reading time: Less than a minute
IRVINE, Calif. The Hysol FP4581 and FP4583 flip-chip underfill materials are said to offer improvements over previous technologies for a variety of conditions.
Hysol FP4581 is a high-purity, liquid epoxy encapsulant made for high-lead, bumped large-die flip-chip packages. Improvements over previously used underfills include a low coefficient of thermal expansion (CTE); a seal absorbs stress on solder joints to protect against cracking.
Hysol FP4583 is designed for smaller applications fillers are smaller than 2-µm in diameter and works in lead-free environments. Hysol products reportedly resolve issues that flip-chip technology experiences had in larger devices, notes Dan Loskot, director of Global Product Management, Liquids. Unlike past underfills, these materials reportedly adhere well to silicon nitride, adds Loskot.