-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Enhanced AOI for SPI
July 6, 2007 |Estimated reading time: Less than a minute
YAVNE, Israel Orbotech Ltd. introduced the Symbion P36 Plus automated optical inspection (AOI) system for solder paste volume inspection, based on its Symbion P36 model. The enhanced version includes a streamlined architecture and improved processing capabilities.
P36 Plus features parallel optical path (POP); 2- and 3-D detection technology to measure volume, area, solder paste deposition, and paste height against set thresholds; and Wizard & Go operation system. It targets high-speed volumetric solder paste inspection (SPI). The updated model was derived from on-going R&D for yield and cost improvements in SMT manufacturing. Trend data from the paste inspection stage can be used to correct screening process parameters for defect reduction further down the line.