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Interposer Lowers Reflow Temps of Pb-free BGAs
June 27, 2007 |Estimated reading time: Less than a minute
WEST WARWICK, R.I. Advanced Interconnections offers a lead-free BGA device-attach service and interposer that converts lead-free BGAs to reflow with tin/lead assemblies cost effectively. The service comprises attachment of the lead-free BGA to an interposer adapter board, tin/lead solder ball mounting, and device-specific footprints to integrate onto a typical PCB.
The BGA interposer targets RoHS-exempt applications where a tin/lead BGA is difficult to source, or no longer available. Advanced Interconnections performs high-temperature lead-free reflow to mount the BGA to an FR-4 adapter board in a turnkey process. It then attaches eutectic tin/lead solder balls for mounting to the original assembly at lower-temperature tin/lead reflow profiles. Interposers are available in 0.80-, 1.00-, and 1.27-mm pitches, or finer pitches for custom applications. Assembled interposers are available in tape-and-reel packaging for automated assembly onto the final PCB.