New Products
December 31, 1969 |Estimated reading time: 3 minutes
Pick-and-Place
The AX-201 places a high mix of components at up to 18,000 cph. With reported accuracy of 20 μm, the system places 01005 components, fine-pitch devices, and odd-forms up to 130 × 79 mm. It shares a common platform, user interface, feeders, trolleys, and placement heads with other A-Series machines, and can be used as a stand-alone or line-balancing system. Programmable placement heads, fast product change-over, offline setup, machine vision, and laser alignment make it suitable for NPIs and prototyping, module production, or other medium- to large-batch productions. Assembléon, Eindhoven, the Netherlands, www.assembleon.com.
Inspection SystemAddressing increased component densities, the Medalist x6000 incorporates new algorithms for 3-D inspection of advanced packages with high joint density (flip chip, fine pitch, and BGA). It is said to offer reduced false-call rates and high throughput, detecting shorts, tombstoning, open joints, voiding, missing pins and balls, and other defects. Improved software and mechanics, including support for new programmers, are also featured. The re-engineered imaging chain targets efficient board movement and reduced image overlap. Agilent Technologies, Santa Clara, Calif., www.agilent.com.
Chemical Analyzer
The proprietary electrochemical bath analyzer Technic EBA uses AC and DC voltammetry to measure the presence of copper, sulfuric acid, and organic additives in acid-copper-plating chemistries. The AC/DC combination is said to detect low levels of organic additives. The machine is also designed to reduce sample prep times and analysis periods. Technic, Cranston, R.I., www.technic.com.
Thermal Profile Data Logger
The Q18 profiles thermal processes, and is designed to operate at a higher speed with finer resolution than prior generations. With six or ten channels, it stores up to 18,000 readings per channel. The machine offers accuracy at ±0.5°C. Datapaq Limited, Cambridge, U.K., www.datapaq.com.
Manufacturing Control Software
vSure, a quality management system, and vManage, for shop-floor control and materials management, target process bottlenecks and provide visibility during SMT assembly. vSure optimizes key process indicators (KPIs) with quality monitoring at manual and automated inspection and test areas, WIP tracking at PCB and box-build, repair-loop management, knowledge-based failure corrections, and other process-control features. vManage targets increased inventory turn and machine effectiveness, offering real-time system performance data, materials verification, RoHS segregation, and replenishment notification. Valor Computerized Systems, Ltd., Yavne, Israel, www.valor.com.
Defluxing Chemistry
Based on DuPont Vertrel and PPG VersaTrans solvents, PowerClean II alcohol-free defluxing chemistry cleans lead-free pastes and fluxes without generating white residue. It suits cleaning during manufacturing and rework-and-repair, and can remove flux from higher-heat reflowed assemblies. Micro Care Corp., New Britain, Conn., www.microcare.com.
Programming System
Designed for programming or preloading high-density flash during electronics manufacturing, the Flashstream Vector programming system uses proprietary co-processor technology (Vector Engine) to accelerate flash memory waveforms during programming cycles. Synchronous operations eliminate dead times, and multiple four-socket units can connect to one computer to run simultaneously. It programs up to 32-Gb flash with upgradable RAM. BPM, Houston, Texas, www.bpmmicro.com.
PCB Inspection Microscope
The Omano E-ZVU digital LCD microscope includes a V15 boom configuration, photograph storage, slide-show capability, and a continuous-glide microscope arm. It targets PCB inspection and quality control. Omano optics offer 7-45× zoom, and the 3.1 megapixel camera supplies 8-megapixel output resolution. The V15 boom stand includes a ball-bearing slide, dual horizontal arms constructed from a solid metal alloy, and 28" extension. A hanging bar enables multiple viewing angles. The Microscope Store LLC, Wirtz, Va., www.microscope-store.com.
Solder Paste
The BD41 series of solder pastes allow manufacturers to use solder-on-pad (SOP) BGA substrates with reportedly high yields. BD41 pastes accommodate solder dipping prior to placement, preventing printing steps and reducing ball movement. Types 5 and 6 spherical powders are water-cleanable in leaded or lead-free. An F640 powder offers lead-free, no-clean solder paste with strong wetting capabilities and print-to-print consistency. It is available in all standard alloys in Type 3, 4, and 6 powders for printing apertures to suit CSP and 01005 components. Heraeus Contact Materials Division, Hanau, Germany, www.heraeus.com.