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Rogers Highlights High-frequency at IMS
May 25, 2007 |Estimated reading time: Less than a minute
ROGERS, Conn. Rogers Corporation will exhibit specialty materials for the high-frequency market at IEEE MTT-S International Microwave Symposium (IMS), June 57 in Honolulu, Hawaii, at Booth 843. Offerings include advanced packaging materials, copper bond technology, and antenna-grade materials.
Thermoset materials such as RO4350B, RO4450B, and RO4550D target applications requiring low moisture absorption and low loss. They suit FR-4 and lead-free multi-layer processing. The thermoset products are available in 0.004Ŕ.060" thicknesses. Also for advanced packaging applications, thermoplastic materials, including RO2800 and ULTRALAM 3000, exhibit low loss and low moisture absorption. These lead-free materials are available in thin dielectric layers from 0.001" to 0.004".
Rogers' copper bond technology is low profile and provides reportedly tighter trace-width tolerances, lower insertion loss, and improved passive intermodulation at high operating frequencies. This suits power-amplifier applications.
The company will exhibit a range of antennae-grade materials at IMS. These offer losses as low as 0.0013 and PIM values about -155 dBc. Thick dielectric grades and high-Dk products are also available. For more information on IMS visit our Events page.