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Vapor-phase Soldering Systems
December 31, 1969 |Estimated reading time: Less than a minute
Suited to lead-free or tin/lead production, the Asscon vapor-phase line of soldering and rework systems is said to eliminate temperature differentials and failed liquidous during reflow or component removal/replacement.
The vapor phase processing environment reportedly addresses high-temperature peaks in lead-free reflow by bringing all parts on a PCB to the same peak temperature. Local differentials caused by part-mass variations across the PCB are eliminated.
For rework, an oxygen-free environment allows minimal or no flux use, and removal will not occur until solder joints are liquidous. The systems are designed to protect chip-scale packages (CSPs) and microBGAs, ceramic parts, lead-free components, and other elements on a PCB assembly (PCBA). Asscon Systemtechnik-Elektronik GmbH, distributed by A-Tek LLC, Berthoud, Colo., www.atekllc.com.