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Cadence Improves Co-design Platform
May 15, 2007 |Estimated reading time: Less than a minute
SAN JOSE, Calif. Cadence Design Systems, Inc., released product and technology enhancements within its Allegro system interconnect design platform for PCB design, including constraint-driven flow and global routing.
Global route environment technology reportedly offers designers increased constraint-driven-design capabilities. Improved features target usability, productivity, and collaboration among IC, package, and PCB design teams. IC and package characteristics are more important at the board level due to lower supply voltages and climbing current needs, noted Xiangzhong Jiang, SI manager, Huawei Technologies. The next-generation Allegro PCB PI allows users to input package models, on-die current profile, and die capacitance to enable greater accuracy in simulation.
The platform's flow and methodology are designed to adapt to complex boards, high pin counts, restrained board real estate, and other challenges. Productivity enhancements with this generation of software cover physical and spacing constraints, noun-verb function selection mode, expanded RMB functions, open GL, and visual enhancements.