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December 31, 1969 |Estimated reading time: 6 minutes
SOLDERING MATERIALS
LF-4300 lead-free solder paste is a no-clean, water-washable formula with clear flux residue that meets S.I.R. requirements. Manufacturers can perform in-probe ICT and AOI. It is available for alloys up to 300°C, and reportedly generates low voiding and no mid-chip beading. Volatile organic compound (VOC) and halide-free, the paste is RoHS-compliant and classified as REL0. AMTECH, Branford, Conn., www.solderproducts.com.
DEVICE PROGRAMMING
Self-contained and automated, the FLX500 desktop device programmer processes 500 devices per hour, and rejects failed devices. It is configurable for 8 or 16 sockets, with self-contained pneumatic air supply. Hot-swapped programmer modules are detected automatically within the system. Minimal tooling and language-independent user interface are said to provide ease-of-use and fast changeover. Data I/O Corporation, Redmond, Wash., www.dataio.com.
TESTING and INSPECTION
With K- and L-shell characteristic X-rays, the LeadTracer-RoHS XRF system analyzes the entire body of components for RoHS and materials analysis. The isotope-based design reportedly eliminates false negatives that occur with element-masking. The handheld XRF screener for the electronics industry features safety protection, a parts library, and full-spectrum display with elemental rank order for quantitative results. RMD Instruments LLC, Watertown, Mass., www.rmdinc.com.
REWORK & REPAIR
ALPHA CoolCap and CoolShield thermal management devices protect standard and odd-form components from nearby rework activity that could induce second reflow or solder damage. CoolCaps cover ICs adjacent to a rework site, maintaining solder joints at up to 60°C cooler than the rework temperature. CoolShields surround the rework site, protecting odd-form packages from high heat. Cookson Electronic Assembly Materials, Jersey City, N.J., www.cooksonelectronics.com.
PROCESS CONTROLKIC Vision eliminates manual verification profiling with reflow recipes, running continuously in the background, and providing hourly profiles. The software measures peak temperature, soak, fit-to-process-window, and other parameters using embedded sensors, then compares the data against a baseline profile. Graphical design helps simplify training and operation. KIC, San Diego, Calif., www.kicthermal.com.
SOFTWARE
An automatic database-management and audit application, the Materials Declaration Wizard MDW/1752 software program supports declaration documents for global RoHS-related legislation. It uses the IPC-1752 format to collect and manage information for RoHS-banned substances, JIG-A list substances, and full materials disclosure. The open architecture connects with existing MRP, PLM, or ERP factory-management databases. XML import/export, BOM-related ppm data generation, and China RoHS disclosure tables organize component data. The Goodbye Chain Group, Colorado Springs, Colo., www.goodbyechain.com.
SOLDERING EQUIPMENTThe EVS series de-drossing system separates reusable solder from waste dross with an integrated hopper, advanced controls, integrated diagnostics, solder tray, and covered dross bin in an enclosed, automated system. It recovers solder ingots from hot dross and deposits spent dross in disposal receptacles. Safety protocols protect users from hot ingots or hazardous dross. A hopper extraction system contains dust and fumes, while filters purify expelled air. The natural process uses no chemicals, additives, or toxic substances. EVS International, Isle of Wight, U.K., www.solderrecovery.com.
PASSIVES & CONNECTORS
Braided Electrical Contact Element, BeCe, technology enables cost-effective assembly of larger ICs and packages. It is said to offer higher reliability and cooling capability than traditional contacts. BeCe may also enable less costly IC testing. Che-Yu Li & Company LLC, Homer, N.Y. Nominated by Ron Lasky, Ph.D., Indium Corporation, www.indium.com.
PRINTING
The AWF300B automatic wafer-bumping system uses a single robotic arm with pre-aligner, automated print stage (EFEM), and vibration squeegee technology for ultra-fine-pitch printing down to 38 μm. The in-print area (IPA) wafer-wiping squeegee system operates separately from the two main squeegees; in wafer-gasket printing, final residual cleaning wipes can be produced within the print area - reportedly preventing contamination. Remaining solder paste is removed with ultrasonic cleaning and a proprietary cleaning fluid. Operators program wiper frequency, stroke, and clean time. Milara Inc., Medway, Mass., www.milarasmt.com.
PICK-AND-PLACE
With a maximum throughput of 120,000 cph and the ability to place 01005s to 30-mm2 components, the Genesis GC-120Q suits high-volume and high-mix environments. It uses four Lightning heads with 55-ms head tact times, a positioning system, feeder, and software controls for component placement. Spindles incorporate individual direct-drive theta control, and the machine offers closed-loop controls for valves and pick/place touchdowns. Accuracy is 65 μm at 4 sigma. Universal Instruments Corporation, Conklin, N.Y., www.uic.com.
UNDERFILLS/COATINGS/ENCAPSULANTSHigh-flow, reworkable, and lead-free-compatible, Loctite 3536 is formulated to underfill advanced CSP and BGA packages. It cures quickly, inline, at low temperatures, minimizing thermal stress. The material protects joints from mechanical stresses in shock, drop, and vibration tests with handheld devices. In JEDEC drop tests with 0.4- and 0.5-mm lead-free devices, the underfill increased reliability over non-underfilled assemblies. Henkel Corporation, Irvine, Calif., www.henkel.com.
ASSEMBLY TOOLS
The Magna-Print squeegee system comprises a universal-fit squeegee holder, quick-change blade holder, and 45° and 60° adapters. The proprietary blade holder lacks tooling, loose hardware, and other locations where fit can be compromised and solder paste can harden. Magnets secure squeegee blades; a non-stick coating reduces cross-contamination. Blades can be changed without removing holders, only one set of holders is necessary regardless of blade size. Ovation Products, Bethlehem, Pa., www.grid-lok.com.
CLEANING EQUIPMENT
Each of the four process chambers comprising the SMT1000-QUAD provides autonomous wash, rinse, cleanliness tests, and dry functions, allowing for synchronous or asynchronous batch defluxing. The chambers connect to a single, built-in wash-solution filtration and recycling system. The system removes all post-reflow flux residues for medium- to high-volume throughput environments, is designed to be environmentally sound, and can output SPC data. Aqueous Technologies Corporation, Rancho Cucamonga, Calif., www.aqueoustech.com.
ENVIRONMENTALLY FRIENDLY PROUCTS
UltraPure K100LD silver-free bar solder alloy contains tin and copper, along with two metallic dopants. The RoHS-compliant solder is said to offer good wetting and flow characteristics, minimizing defects. The dopants slow copper-dissolution rates to stabilize copper levels in the pot, improving hole-fill and reliability and maintaining soldering consistency. They also improve grain structure, producing bright, smooth solder joints with no visible shrinking. Anti-drossing technology and metallization compatibility are additional benefits. Kester, Des Plaines, Ill., www.kester.com.
CONTRACT SERVICES
A streamlined process and custom software stencil support product meets demands on the supply chain, improving efficiency, quality, and turn times. Engineers order stencils or other products directly through a technical service rep, and the order is immediately visible to all manufacturing groups; 510 custom routes promote proper manufacturing. The WIP system supports real-time management, and personnel can approve quality checks, note special requirements, and rework and re-insert products throughout the process. Photo Stencil, Colorado Springs, Colo., www.photostencil.com.
CLEANING MATERIALS
The Simple Green stencil and misprint cleaner incorporates biodegradable, low-toxicity compounds and high cleaning strength to remove dried solder paste and flux residues. It removes pastes, rosin, water-soluble and no-clean solder, and leaded and lead-free alloys from stencils, screens, and misprints. It is available for immersion cleaning systems or manual cleaning. The formula can shorten cycle times, and meet or exceed current and anticipated VOC requirements. Aqueous Technologies Corporation, Rancho Cucamonga, Calif., www.aqueoustech.com.
DISPENSING EQUIPMENT
The Active Stencil system transforms inline screen printers with 29" × 29" frame capabilities into accurate fluid-dispensing systems, adding dispense capabilities to an SMT line without additional standing equipment. A proprietary servo robot cassette inserts into the printer, like an ordinary stencil, and users program dispense routines: importing, editing, and converting common image files. The dispense valves accommodate adhesives and solder pastes. A stainless-steel roll cabinet houses the PC and display, and stores the robot and dispense supplies. Ovation Products, Bethlehem, Pa., www.grid-lok.com.