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No-clean Flux Raises Reliability of Complex Assemblies
April 23, 2007 |Estimated reading time: Less than a minute
JERSEY CITY, N.J. The ALPHA EF-2210 wave solder flux from Cookson Electronic Assembly Materials (CEAM) suits lead-free and tin/lead wave soldering processes using a no-clean, water-based formula. The activator system is said to improve hole fill, minimize micro-solder balls, and reduce bridging and icicles.
The EF-2210 formula contains no VOCs, is low-solids and rosin-free, and passes Bellcore surface insulation resistance (SIR) electrical reliability requirements. The rosin-free flux meets complex soldering requirements and allows faster processing times than with fluxes requiring cleaning, said Mike Murphy, global product manager, flux products. Eliminating VOCs and flammable ingredients improves worker safety, Murphy added.