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Lead-free Paste Can Improve Hole Fill
December 31, 1969 |Estimated reading time: Less than a minute
SACX, formulated with ingredients designed to improve wetting performance and hole fill in lead-free processing, targets performance parameters comparable to a tin/lead solder. The alloy is said to generate low levels of dross and produce reliable lead-free solder joints. Good drainage characteristics reportedly reduce bridging.
The bar solder's process range allows use with a variety of flux chemistries. Purifying processes remove oxides and other contaminants to reduce brittleness in the final solder joint, and proprietary ingredients are said to control copper dissolution at reflow. A solder pot temperature of 255265°C is recommended with a contact time of 2.33.5 seconds. Cookson Electronics Assembly Materials, ALPHA division, Jersey City, N.J., www.alphametals.com.