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December 31, 1969 |Estimated reading time: 5 minutes
Buried Capacitance Method Decouples Components
SAN JOSE, Calif. - Sanmina-SCI developed Buried Capacitance Sandwich (BC) laminate, an embedded passive technology that offers a different approach to decoupling high-performance PCBs, which traditionally use conventional discrete capacitors. The technology reportedly improves reliability, reduces undesirable discrete-capacitor resonance and high-frequency discrete bypass capacitors, and lowers electromagnetic interference (EMI). BC’s glass reinforcement and specialty resins (for film-based versions) add to its manufacturability, note Sanmina-SCI representatives. Thickness tolerance, dimensional consistency, and reduced electrical breakdown during test and use make it viable for PCB integration.
A thin dielectric layer provides disruptive decoupling capacitance and replaces conventional discretes. Specialized copper foils and foil orientation reportedly ensure uniform capacitance and electrical integrity. To support the BC product, the company licensed laminate technologies to more than 20 PCB fabricators and material manufacturers. Technologies include the ZBC-1000 and 2000 laminates, which yield dielectric thicknesses of 0.0010" and 0.0020", respectively.
Some BC products incorporate a durable resin system for non-reinforced dielectrics equaling 1-mil thickness and thinner, while a proprietary barium/titanate formula raises capacitance values. The FaradFlex BC laminate is film-based and non-fiberglass reinforced, with a modified high-Tg FR-4 epoxy material. It is available in thicknesses ranging from 8-24 μm. Interra, also film-based non-fiberglass reinforced, but with a polyimide material, is 25-μm thick.
Relocation Serves Mexican Market
RICHARDSON, Texas - ViTechnology, Inc., relocated its Americas headquarters from Haverhill, Mass., to Richardson, Texas, to better serve customers throughout Mexico and South America. This region’s increase in sales and demand for packaging, board assembly, and test was significant enough to warrant the move, said Gary Burroughs, president of ViTechnology. Regions of high customer concentration, such as New England and California, will retain local offices and applications facilities.
“Texas appeared to be the best location to keep our main workforce as close to our customers as possible, and proximity to an international airport allows Texas-based support technicians to access directly customers in Canada, the U.S., Mexico, Brazil, and Argentina,” Burroughs explained. ViTechnology estimates that 50% of American electronics manufacturing takes place in Mexico and South America. “High-volume is the primary sector of assembly there,” said Burroughs. The company also opened a regional office in Shenzhen, China, to support increased activity there. The Shenzhen satellite will serve local customers and sales in the distribution channel. Both offices will house demonstrations for automated optical inspection (AOI) and automated optical measurement (AOM) systems, as well as process development centers.
Building Layout Streamlines Assembly
TRAUNREUT, Germany - Dr. Johannes Heidenhain GmbH completed construction on a 135,000 sq. ft. building for encoder assembly and R&D at its Traunreut headquarters. The building is the result of two and a half years of construction, and was designed to minimize lag from unproductive transports, storage, and layout.
Heidenhain constructed the facility to contain all assembly and packing for product lines on one floor. The basement, designated for OEM projects, hosts assembly, long-term product-qualification testing, and technical facilities for high-accuracy encoders. Linear, rotary, and angle encoders are also segregated; two floors are dedicated to offices and R&D labs for encoder mechanics, electronics, and quality assurance (QA).
The facility also features wider column spacing and higher ceilings to maximize process flow during assembly and R&D. This “optimal efficiencies” layout is said to improve logistics, minimize accounting tasks, and increase productivity.
OSDs Surpass ICs
SCOTTSDALE, Ariz. - The optoelectronics, sensors and actuators, and discretes (OSD) market grew 10% in 2006, one percentage point higher than the IC market, says IC Insights’ “O-S-D Report,” second annual edition. Optoelectronics and discretes each represented 43% of the $38.2 billion OSD market revenue. Sensors and actuators hit $5.3 billion, with MEMS-based devices accounting for 80% of revenues. Tracking and classifying the OSD market helps OEMs, EMS providers, and board designers gauge trends and costs when designing new systems, according to IC Insights.
Sensor and actuator growth rocketed within the OSD market, with an 18% climb in 2006. IC Insights notes that sales of sensor components showed a cumulative average growth rate (CAGR) equaling about 1.5× that of IC revenues, and 3× that of discretes. Revenues for discrete components rose 9% in 2006, as did optoelectronics revenues. “Contract manufacturers bought OSDs cautiously in 2005; 2006 saw an inventory replenishment in the first half and increased usage in the second half,” said Rob Lineback, senior market research analyst at IC Insights. He noted that discretes are used often as “quick fixes” and modifications by board designers, shortening time to market; new applications are incorporating more discretes, and adding optoelectronics and sensors for the first time as well.
In 2011, OSD will represent a larger, significant share of the total components market. Automotive (image sensors and power transistor modules), computer, consumer (cell phones, gaming systems, and displays), and some medical applications are driving the demand for OSD components. LEDs, accelerometers, gyroscopes, and other components have come to the forefront in recent years, Lineback noted, and are being integrated into more products. He sees a dynamic market in packaging OSDs to make them easily surface mounted, and reliable on the board. The full report is available at the research firm’s Website: www.icinsights.com.
Blom Leads SMTC’s Global Supply Chain
TORONTO - SMTC Corporation appointed Paul Blom as senior vice president, supply chain, responsible for leading supply chain strategy and execution, including materials planning, strategic procurement, and logistics. Blom is expected to bring solutions to SMTC customers, while expanding the company’s supply chain management capabilities. Blom has served in electronics manufacturing, supply chain management, and procurement positions for more than 20 years. He held a senior vice president position for global supply chain management operations at a major EMS provider prior to joining SMTC.
January Book-to-Bill Dips
BANNOCKBURN, Ill.- The North American PCB industry combined rigid and flex circuit book-to-bill slid to 0.91 in January, though the flex circuit book-to-bill continued its steady climb , according to the IPC - Association Connecting Electronic Industries. Flex circuits reached 0.93, while rigid PCBs dropped to 0.91.
Year-over-year, shipments for rigid and flex PCBs fell 2.6%. Orders booked decreased 18.7% from January 2006. Rigid PCB shipments slowed by 3.5% and bookings dropped 19.2% compared to January last year. Flex circuits rose 14.3% in shipments year-over-year, but bookings fell 10.6% from January 2006.