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Adhesives Bond to Thermoplastic Substrates
December 31, 1969 |Estimated reading time: Less than a minute
The ARALDITE series of high-strength epoxy and polyurethane adhesives encapsulate, insulate, and bond electronic components and PCBs. The products suit encapsulation and assembly of electronic automotive components, bonding of miniature high-speed telecom circuitry, bonding PCBs for medical devices, and other applications.
The epoxy line is high-temperature and offers chemical and moisture resistance. Bonding properties suit encapsulation and joints on metals and thermoplastics. The products cure at room or elevated temperatures and are formulated for a range of work time. They are said to offer low shrink, good sag resistance, and good dielectric characteristics, and are RoHS-compliant and UL-recognized.
The polyurethane materials, also UL-recognized, are high-temperature systems with flex properties and good lap shear strength. This line bonds thermoplastic substrates and encapsulates pressure-sensitive components. Sag resistant, the polyurethane materials cure at or above room temperature. Huntsman Advanced Materials, The Woodlands, www.huntsman.com.