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Rohm and Haas Highlights Technologies
March 5, 2007 |Estimated reading time: 2 minutes
PHILADELPHIA Rohm and Haas Electronic Materials highlighted eight of its products and technologies at recent IPC Printed Circuits Expo/APEX/Designers Summit in Los Angeles. The theme of the Rohm and Haas display was "Creating Solutions for an Evolving Electronic World."
Rohm and Haas's latest product in electroless copper technology is Circuposit 3000-1, a next-generation pin-thruhole (PTH) process that provides benefits including reportedly excellent hole-wall adhesion; high-Tg laminate coverage, with no trade-off between coverage and adhesion; adhesion on copper, glass, and resin; and quality interconnect stress test (IST) and thermal cycling performance. Circuposit 3000-1 also allows reduced chemical usage of up to 45%, fast process start-up, and predictable deposition and coverage, according to Rohm and Haas.A non-electroless copper PTH solution, Graphite 2000, provides full desmear and PTH in five steps. It offers a short and flexible PTH process with a small footprint; simple operation; and robust thruhole plating. It is designed to meet demanding thermal shock requirements.
The Pallamerse SMT 2000 Process is an ENEPiG process that eliminates the risk of black pad while enabling gold wire bonding without the need for thick gold. This process provides a solution for all assembly needs within the one process line.
Performance advantages of the company's Duraposit SMT 88 electroless nickel and its Auroelectroless SMT immersion gold include bath stability, durability and uniformity, and a design which targets eliminating nickel corrosion and avoiding skip plating. Duraposit SMT 88 is compatible with Pallamerse SMT 2000 electroless palladium process.
Also featured under the theme were the Copper Gleam line of electroplating products, including Copper Gleam 2500 high throw, super leveling DC copper, and Copper Gleam CuPulse high-performance PPR electroplating products. Driven by high throwing power and increased operating current density, Copper Gleam 2500 provides enhanced plating efficiency and capacity opportunity. Delivering reportedly consistent performance over bath life, it features both built-in nodule suppression and good tensile properties providing robust thermal stress performance. The Copper Gleam CuPulse plating process offers a versatile PPR plating system, with high aspect ratio and mixed technology capability, and analytical tools designed to maintain consistent performance.
Circubond 2200 Plus, an enhanced performance innerlayer bonding process, provides enhanced peel strengths over a range of dielectrics at relatively low etch depths. This uniform topography is achieved on base ED foil or DC- or pulse-plated innerlayer surfaces. The process is lead-free capable and proven for vertical and horizontal applications.
The high-resolution dry film photoresist NIT product family displays production-proven sub-25-µm resolution for high density interconnect (HDI) and build-up applications. With wide processing latitude to provide the higher yields, the NIT family is compatible with all plating and final finishing types and is capable of providing ultra-straight side walls and artwork reproduction.