BiTS 2007 Program Fosters Networking

Reading time ( words)

MESA, Ariz. The 8th annual Burn-in and Test Socket (BiTS) Workshop March 11 14, 2007 in the Hilton Phoenix East of Mesa, Ariz. issued an advance program with details on tutorials, keynotes, and presentations. BiTS EXPO, which runs concurrent with the workshop, will host about 40 socket and related companies. Organizers stress that all activities, including receptions, extended breaks, and sessions, will promote informal discussion and networking.

Steve Arobio will host "ATE Printed Circuit Board Design: Performance vs. Design for Manufacturability vs. Time to Test," to give test engineers options for increasing productivity of automated test equipment (ATE) within the constraints of signal speeds, multi-site device testing, and shortened time-to-test demands on PCBs with more layers, tighter pitch, higher aspect ratios, exotic materials, and customized processes. "An Overview of Critical Issues in IC Packaging," Charles Cohn's tutorial, will pinpoint critical packaging issues, such as volume production, form factor, pin count, and package pitch. Materials and test issues will also be addressed.

"From the Frying Pan into the Fire: Working on Both Sides of the Tooling Supply Chain," presented by invited speaker Steven Strauss, outlines Strauss' personal experiences purchasing and using test technology and test tooling at Intel Corporation and supplying those technologies with Antares Advanced Test Technologies. Strauss will examine common issues that arise from customer assumptions with respect to the capabilities of suppliers, and vice versa.

Steven R. Appleton of Micron Technology will deliver the keynote address, "The Impact of New Applications and Increasing Device Complexity on the Future of Testing." He will interpret the economic and technical changes to testing wrought by a rise in consumer applications and highly integrated packages. Appleton warns against the "one size fits all" maxim in the evolving test environment.

More than 25 paper presentations will cover topics focusing on both user and supplier perspectives. "Challenges Day," March 12, will include "Pushing the Power/Thermal Envelope" and other sessions. March 13, "Interconnect Day," will host "PCB Advancements and Opportunities" and "Advancements in Contacting Leading-edge Packages." Finally, "Design Day," the 14th, will include "Exploring Handler, Socket & Device Interfacing," as well as closing remarks and awards recognizing outstanding papers.

To register, visit Advanced Packaging and SMT Magazines are sole media sponsors of the event.



Copyright © 2019 I-Connect007. All rights reserved.