-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
2006 Product Review
December 31, 1969 |Estimated reading time: 8 minutes
ASSEMBLY TOOLS & EQUIPMENT
PCB Clamping System
The Quik-Lok PCB clamping system for MPM UP2000 and AP25~27 series printers eliminates the need for conventional vacuum-chamber board fixtures on MPM printers. Field-retrofittable in approximately one hour, Quik-Lok provides secure, over-the-top-type PCB clamping, as well as a tool-less, hands-off product changeover. Ovation Products, Bethlehem, Pa., www.grid-lok.com.
Device Programming Equipment
The Helix system offers tubed parts for I/O and up to eight sockets for device programming. A precision tooling head requires no vision system to handle fine-pitched parts and provides 800 dph overall throughput. Two proprietary 7th generation sites incorporate FX4 socket capability. Integrated motors open and close programming sites in synchronization with parts placement and retrieval. One computer/software interface controls both BPWin software and operations. BPM Microsystems, Houston, Texas, www.bpmmicro.com.
CLEANING MATERIALS & EQUIPMENT
Stencil Cleaner
The water-soluble 440-R SMT Detergent enables manual SMT stencil and tool cleaning. The product chemistry is verified by the EPA for environmental and user safety, as well as cleaning efficiency. The cleaner is said to improve print production without noxious odors or hazards of heavy metal contact associated with solvents. Smart Sonic Corporation, Canoga Park, Calif.
Aqueous Cleaner
AQUANOX A4520T aqueous chemistry cleaner for flush-mounted and fine-pitch components cleans under low standoffs and in tight spaces. It reportedly works at low temperatures and low concentrations while exceeding industry standards for workers and environmental safety. Its chemistry is effective without the use of sump side additives, and provides shiny joints. Featuring a long bath life and RoHS compliance, its chemistry can clean numerous soils: lead-free flux, tacky flux, reflowed paste, no-clean flux, RMA flux, OA paste, oils, fingerprints, light oxides, and polymerized soils. Kyzen Corp., Nashville, Tenn., www.kyzen.com.
COMPONENTS
Chip Inductors
The AML0603E series of multilayer chip inductors reduce high-frequency loss by 20-30% over the past generation. The series, which ranges from 2-12 nH of inductance, offers low rates of energy dissipation in high-frequency bands. Suited to modules for mobile phones and other high-frequency circuits, the 0603 form factor resulted from simulation developments with computer-aided engineering, ceramics, and multilayer process technologies. FDK Corporation, Tokyo, Japan, www.fdk.com.
CONTRACT SERVICES
Manufacturing Process Control
The Synchronous Flow Manufacturing (SFM) process is said to increase customer scheduling flexibility while reducing inventory carrying costs and capital equipment requirements. With the SFM process, improvements reportedly include elimination of customers’ obligations for firm schedules with pulls, “ship-on-demand” while improving on-time delivery of customer requests from 74-87%, 90% reduced revenue associated with past-due orders, and reduced production square footage, including transfer or elimination of four production lines while supporting the same amount of revenue. EPIC Technologies, Rochester Hills, Mich., www.epictech.biz.
DISPENSING EQUIPMENT
Dual-mode Spray Head
The CAT 35 Integrated Liquid Delivery System (ILDS) dual-mode spray head offers an alternative to conventional air-atomizing, film coating, and dispensing technologies. The head consists of an ultrasonic transducer with a titanium spray-forming head and integrated liquid and air applicators. The ultrasonic spray head has two modes: narrow, with a 5-mm pattern width and wide, with a 3-25-mm pattern width. It applies a thin, defect-free coating of 0.5-5 mils thick, and works with urethanes; acrylics; water- and solvent-based; and 100% solid, UV-curable conformal coatings. Ultrasonic Systems, Inc., Haverhill, Mass., www.ultraspray.com.
ENVIRONMENT PROTECTION
Dross Eliminator
MS2 molten solder surfactant, available for leaded and lead-free processes, eliminates dross in wave soldering. It forms a thin, floating layer that covers the entire solder surface except the wave; therefore, it does not mix with the metal. MS2 prevents dross from forming on the surface and immediately converts any dross generated by the wave back into usable metal. P. Kay Metal, Inc., Los Angeles, Calif., www.pkaymetal.com.
HARDWARE/ACCESSORIES
Solder Pallet Material
WaveMax 7000, a thermo-set composite material, features durable properties designed for pallets used in high-temperature wave-solder applications. For use in high-temperature, high-volume production runs requiring a solder pallet to heat to 315˚C for as many as 5,000 soldering cycles, the 7000 comprises an epoxy resin and random-mat glass substrate. A high glass-to-epoxy ratio improves flexural strength and rigidity. Norplex-Micarta, Postville, Iowa, www.norplex-micarta.com.
INSPECTION EQUIPMENT
X-ray Inspection
The YTX-3000 HXR X-ray inspection system features an open-tube transmission target X-ray source with an integral, high-voltage power supply and computer-controlled operation. Ideal for high-resolution applications, the system resolves sub-micron features with zoom magnifications up to 2400×. A four- or five-axis sample manipulator and a 380- × 500-mm X/Y travel for samples up to 5 lbs., and full 360º rotation and 30º of tilt are available. Computer-controlled motor drives provide a wide range of motion from ultra-slow use at high magnifications to high speed for travel over large distances. YESTech Inc., San Clemente, Calif., www.yestechinc.com.
PICK-and-PLACE
Platform-based Pick-and-Place
AdVantis XS mixes semiconductor and standard surface mount assembly in one machine with proprietary VRM linear motors for accuracy and repeatability at ±9 µm. AdVantis XS provides a low-cost alternative for placing flip chips and other advanced packages accurately. The linear-motor-driven, Class 1000 clean room-compatible system includes high magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and various feeder types. Universal Instruments Corp., Binghamton, N.Y., www.uic.com.
Pick-and-Place Machine
The HLX8200 pick-and-place machine reaches production speeds of up to 22,000 cph using a feeder capacity of 192 tape and stick feeders, and space for 16 JEDEC trays. The machine can place 01005 chips through 50- × 50- × 17-mm components, including BGAs, microBGAs, and flip chips. A vision system - Cognex SMD 4 - measures and aligns all parts. Backlight component illumination deters reflection and inaccuracy problems. ESSEMTEC, Aesch, Switzerland, www.essemtec.com.
REWORK/REPAIR
Ball Array Placement Module
A solder ball array placement (BAP) module for rework simultaneously places up to 200 solder balls directly onto a substrate or 300-mm and smaller wafers. The application module reportedly boosts throughput and enables practical re-balling on FINEPLACER modules. A vacuum control secures pick and handling, as well as placement without deformations. The machine allows defined provision and flux transfer, then places several solder balls to the substrate. Other features, such as a vision alignment system, high-resolution video optics, and a bond-force module, are said to improve accuracy. FINETECH, Phoenix, Ariz., www.finetechusa.com.
SCREEN PRINTING
Stencil System Upgrade
The VectorGuard system with interchangeable foils for various applications is enhanced with laser-cut nickel foils. These new foils address lead-free paste rheology and aperture-release characteristic challenges, delivering a high level of paste volume repeatability. The system eliminates the need for a loading jig and facilitates alignment of stencil to frame with a foot-pedal operation. DEK International GmbH, Flemington, N.J., www.dek.com.
SMT MATERIALS
No-flow Underfill
The NF260 lead-free, reworkable, air-reflowable, no-flow underfill integrates with existing SMT processes, reportedly boosting productivity and reducing costs. The underfill can accommodate component placement with existing automated equipment, can be processed in typical lead-free reflow profiles, and has shown durability in thermal cycling and thermal-shock testing. Indium Corp., Clinton, N.Y., www.indium.com.
SOFTWARE
RoHS-compliance Software
With the MDW/1752 Material Declaration Wizard, companies can generate IPC-standard 1752 reports. Bill of materials (BOM), third-party, or other parts per million (ppm) data is imported directly and converted into any of the six IPC-1752 report classes. The Windows-based application includes comprehensive Help functions and an online encyclopedia of RoHS-compliance information. The software collects, manages, and reports data pertinent to European Union (EU) or Chinese restrictions. The Goodbye Chain Group, Colorado Springs, Colo., www.goodbyechain.com.
SOLDERING EQUIPMENT
Selective Soldering
The GoLaser selective soldering system can be used as a stand-alone system or integrated into a fully automated SMT production line, soldering THT components on the bottom side of a PCB. The power-controlled, 60-W diode laser, with closed-loop temperature and solder-volume control, reportedly guarantees a reproducible process and high precision. A vision system aligns assemblies to be processed automatically. The system can download CAD data; a comprehensive library of components is said to facilitate programming and operation. SEHO Seitz & Hohnerlein GmbH, Kreuzwertheim, Germany, www.seho.de.
SOLDERING MATERIALS
Lead-free Solder Paste
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high-volume stencil printing applications with 0.5- and 0.4-mm CSP lead pitches. The formula is said to deliver low voiding in BGA joints over a wide range of reflow profiles. Its tack force resists component movement during high-speed placement, allows a fast print speed with low print pressure to minimize board warpage, and offers humidity resistance. The material produces safe residues that eliminate the need for cleaning; post-reflow, low-color residues facilitate visual inspection. The electronics group of Henkel, Irvine, Calif., www.electronics.henkel.com.
RoHS-compliant Solder Paste
The LF-4300, a RoHS-compliant solder paste, is available for multi-process applications including lead-free, tin/lead, and high-temperature up to 300˚C. The paste meets no-clean and water-washable requirements. Its proprietary formula is said to incorporate synthetic materials to deliver print consistency and longer stencil life. The RELO-classified paste is VOC- and halide-free and complies with RoHS Directive 2002/95/EC. The paste reportedly creates no mid-chip beading, has low voids, and is pin probable for in-circuit test (ICT) and automated optical inspection (AOI). AMTECH, Inc., Branford, Conn., www.amtechsolder.com.
TEST EQUIPMENT
CSP Test Socket
The ARI-A-7212 CSP test socket accommodates devices 28-40 mm2, with pitches down to 0.40 mm. Operators can manually test chip-scale packages (CSPs), micro‑ BGAs, LGAs, and other such package types. Using a 1.95-mm signal path, the socket minimizes signal loss in high bandwidths. It measures about 77 × 64 × 32 mm to give components and connectors space. Solderless, pressure-mount compression spring probes enable mounting and removal; the springs leave small witness marks that can be located using plastic alignment pins. A four-point spring-probe crown creates reliable scrub mating with contacts; a pointed probe handles other contact types. Aries Electronics, Frenchtown, N.J., www.arieselec.com.