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Thermal Material Suits Silicone-sensitive Apps.
October 25, 2006 |Estimated reading time: Less than a minute
ELKTON, Md. W.L. Gore & Associates introduced the GORE POLARCHIP thermal interface material (TIM) family dedicated to silicone-sensitive applications. The family includes soft silicone-free thermal gap pads and reportedly eliminates outgassing and oil migration (bleeding) problems associated with silicone.
Because of its high compressibility, the conductive material fills air gaps between heat-generating devices and heatsinks, spreaders, or metal chassis. The fluoropolymer composite comprises an expanded polytetrafluoroethylene (ePTFE) matrix populated with boron nitride (BN) particles. As BN particles create thermal conductivity, the ePTFE mass maintains low elastic modulus for conformability and compressibility, but also reportedly reinforces the assembly against wear.
The TIM family is available in rolls or sheets, die-cut or continuous, with pressure-sensitive adhesive on one side. Pre-cut pieces suit automated assembly processes.