-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Pick-and-Place Head Targets High-throughput
October 4, 2006 |Estimated reading time: Less than a minute
Hampton, N.J. Ultra-low-mass, two-axis, and compact, IntellePro, Inc.'s IPROBE is a pick-and-place head targeted for high-throughput manufacturing that uses multiple, ganged heads. The product requires a 20-mm center and has a mass of 300 gms.
The head uses low-power drivers, since the brushless servo motors rate at 15 watts. Operators can also tailor the head with planetary gear box ratios that adjust speed, resolution, and payload. The Z and theta axes incorporate controlled drag.
An internally ported vacuum is said to eliminate moving pneumatic lines, while NB linear bearings support positioning. Stroke max reaches 38 mm with a 3-micron Z, and .018° theta, resolution.