New Products
December 31, 1969 |Estimated reading time: 4 minutes
CLEANING MATERIALS & EQUIPMENT
Water-based Cleaner
The VIGON A 201 removes a number of flux residues with short contact times. After cleaning, solder joints remain shiny, and white-residue formation is eliminated on parts and equipment. The water-based cleaner is said to last 10× longer than traditional surfactant-based products. This drop-in product is formulated for high-pressure cleaning. Its high bath-loading capacity allows for extended bath life. The cleaner is non-foaming, and meets RoHS and WEEE guidelines. ZESTRON America, Ashburn, Va., www.zestron.com.
COMPONENTS
Land-grid Array Capacitor
The land-grid array (LGA) Decoupling Capacitor, said to improve system performance with low ESL, emphasizes bottom connectivity and advances the technology used by interdigitated capacitors (IDC) and reverse-geometry multi-layer ceramic capacitors (MLCCs). The capacitors are said to lower inductance in an industry-standard geometry chip. They suit package- and board-level decoupling applications. Vertical orientation for internal electrodes reduces inductance for capacitors positioned close to the die, allowing I/O terminals to be located on the bottom of the capacitor - feeding signals directly into vias. The current path, or loop, includes internal electrodes and external termination, power planes, vias, mounting pads, and solder fillets of the substrate/package. Vertical electrodes and fine copper terminations (FCTs) are said to produce low ESL - reducing a two-terminal LGA inductance by up to 35 pH. The devices have lead-free terminations and are RoHS-compliant. AVX Corp., Myrtle Beach, S.C., www.avxcorp.com.
DISPENSING EQUIPMENT
Dispensing Workstation
The Ultra 2400 dispensing workstation applies uniform amounts of solder paste, flux, and other assembly fluids using an air regulator and microprocessor-controlled timer. A combination of dispensing tip size, air pressure, and dispense time regulates shot size. An operator can adjust the timer in 0.0001-sec. increments, while the electric foot-pedal feature allows for automatic, measured dispensing. Other features include a mountable syringe barrel, simultaneous digital displays of dispensing parameters, and a teach function that reportedly eases initial setup. The workstation operates in nine languages and is equipped with an automatic voltage converter and power adapters. Standard equipment includes a supply of syringe barrels, pistons, and dispense tips. Flexible task-light and LED-spotlight options are also available. EFD, Inc. East Providence, R.I., www.efd-inc.com.
PRINTING EQUIPMENT & MATERIALS
Label Print and Attach Machine
The ELC-200 label print and attach system applies labels to PCBs and print bar codes, producing 1- and 2-D labels on 50- × 50-mm to 330- × 250-mm PCBs. Standard features include an extruded aluminum frame with painted vanity panels and a transparent cover, three-color tower lamp with audible alarm, mechanical front stopper and clamper, and PC controls. The machine conforms to SMEMA specification 1.2, and has a 200-mm/sec. maximum conveyor speed. It operates at an 8-sec./label rate. Robot controls are 600 mm and 400 mm on the X and Y axes, respectively. The Z-axis has 300-mm cylinder control. The Zebra 110X13 printer features 300 dpi at 12 dots/mm, 90- × 100-nm print area, and a ribbon width of 20-110 mm. Eunil H.A. Americas, San Diego, Calif., www.eunil.com.
PCB Printer
The ProLegend creates legend prints on PCB prototypes without screen printing. The system includes the tools and consumables needed to bring legend printing in-house, and can be added to the LPKF soldermask system. This printing process reportedly requires little training to operate. LPKF Laser and Electronics, Wilsonville, Ore., www.lpkfusa.com.
REWORK/REPAIR
Ball Array Placement Module
A solder ball array placement (BAP) module for rework products places up to 200 solder balls directly onto a substrate or 300-mm and smaller wafers simultaneously. The application module reportedly boosts throughput and enables practical re-balling on FINEPLACER modules. A vacuum control secures pick and handling, as well as placement without deformations. The machine allows defined provision and flux transfer, then places several solder balls onto the substrate. Other features, such as a vision-alignment system, high-resolution video optics, and a bondforce module, are said to improve accuracy. Installed systems can be retrofitted to the BAP module. FINETECH, Berlin, Germany, www.finetechusa.com.
SOLDERING MATERIALS
Lead-free Solder Paste
The LF-4300, a RoHS-compliant solder paste, is available for multi-process applications including lead-free, tin/lead, and high-temperature alloys up to 300˚C. The paste meets no-clean and water-washable requirements. This proprietary formula is said to incorporate synthetic materials to deliver print consistency and a longer stencil life of 12 hours and a 24-hour abandonment time. The RELO-classified paste is VOC- and halide-free. With less than 200-ppm lead content, it also complies with the RoHS Directive. The paste reportedly creates no mid-chip beading, has low voids, and is pin-probable for in-circuit test (ICT) and automated optical inspection (AOI). AMTECH, Inc., Branford, Conn., www.amtechsolder.com.
Lead Detector Kit
A lead detector kit indicates the presence of lead on assemblies, workbenches, tools, machinery, and storage areas by displaying a pink to red color. Color intensity reveals the level of lead concentration. The detector wipes and swaps then can be sent to a lab for quantitative analysis of lead content. The lead remediation task force kit’s lead eliminator product complements the wipes, and removes any heavy metals that were detected. The lead eliminator is said to reduce invisible lead residue to RoHS/WEEE-acceptable levels. JNJ Industries, Franklin, Mass., www.jnj-industries.com.