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Dage Recognizes Market Demand
July 7, 2006 |Estimated reading time: Less than a minute
FREMONT, Calif. Dage Precision Industries has completed its U.S. sales and support operations move, to a newly-constructed facility in Fremont, Calif. The location allows for increased product demonstrations and expanded application laboratory capabilities. Dage states that the offices leave room for personnel additions, and "has added significantly to its staff in both sales as well as service and support personnel," according to Bob Klenke, marketing for Dage.
The facility move is a response to our growth, said Hal Hendrickson, general manager of Dage. He stressed that Dage also needed sufficient capacity for future expansion. They will demonstrate and develop next-generation x-ray inspection and bond-test technology in the new building. Technical and training seminars will occur as well.
There is an "increased demand for x-ray inspection everywhere, throughout all segments of both the PCB assembly and semiconductor markets," said Klenke. He noted that factors in the market rise included "more sophisticated and higher pin-count active devices, smaller passive devices, a corresponding increase in substrate density, and advanced packaging technologies such as stacked die." Hendrickson added that the new facility will allow customers to assess ball grip array (BGA) and chip-scale package (CSP) solder interconnection integrity.