New Products
December 31, 1969 |Estimated reading time: 3 minutes
Platform-based Pick-and-Place
AdVantis XS combines semiconductor and standard surface mount assembly in one system using proprietary variable reluctance motor (VRM) linear technology for accuracy and repeatability of ±9 µm at ±3 sigma. The pick-and-place machine is said to provide a low-cost alternative for placing flip chips and other advanced packages accurately. The linear-motor-driven, Class 1000 clean-room-compatible system includes high-magnification cameras, flip-chip algorithms, low force capability, heated spindles, fluxing, dispensing, and several feeder types. Universal Instruments Corp., Binghamton, N.Y., www.uic.com. Visit Universal Instruments at SEMICON West, Booth #7039.
Low-COD Cleaner
Micronox MX2188 Low Chemical Oxygen Demand (COD) Aqueous Precision Cleaner is a low-VOC, nonflammable, non-corrosive cleaner that meets RoHS and other environmental regulations for batch, inline, or immersion cleaning systems. The cleaner targets use at low concentrations while cleaning tight-pitch and low-standoff devices. This multi-solder solution is safe for use on all lead-free and eutectic solders, as well as most precious metals. The cleaner is available in 1-, 5-, and 55-gallon containers. Kyzen Corporation, Nashville, Tenn., www.kyzen.com. Visit Kyzen Corporation at SEMICON West, Booth #7850.
Dual-lane Dispensing System
The Axiom X-1022 Dual-lane dispensing system is said to increase the number of units per hour (UPH) produced in high-volume semiconductor applications, such as flip chip and chip-scale package (CSP) underfill. The system uses parallel processing on two lanes for non-stop dispensing, eliminating lost time during non-dispensing activities such as material flow-out and substrate loading and unloading. The dual-lane capability enables underfill flow-out in one lane, while underfill is jetting in another lane. Independently controlled conveyors allow different part sizes to be processed in lanes one or two for flexibility. The programmable flat-belt, dual-lane conveyor also accommodates several process carriers, including Auer boats, lead frames, and custom carriers. The SMEMA-compliant conveyor features a fixed first rail and an adjustable second, third, and fourth. The system is also configured with up to six stations of contact or impingement heating and three stations per lane (pre-heat, dispense, and post-heat) to ensure consistent substrate heating. Asymtek, Carlsbad, Calif. www.asymtek.com. Visit Asymtek at SEMICON West, Booth #8121.
Dry Cleaning Process
Eco-Snow, a CO2-based dry cleaning process, removes particles that build up during manufacturing, reducing resolution and lowering yields in cell phone cameras and image-sensor modules. Using the patented Eco-Snow VersaClean 1200 system, the process injects CO2 snow onto the imaging device’s surface to remove particles. Eco-Snow, a wholly owned division of BOC, Livermore, Calif., www.boc.com. Visit BOC at SEMICON West, Booth #729.
X-ray Inspection System
The Revolution X-ray inspection system offers a 75° viewing angle and 15° to the plane of the board - reportedly enabling up to 600× magnification at all angles over the 16" × 16" manipulator scan area. The steep viewing angle can also provide a side-view profile of the BGA and solder joint, ensuring a higher level of inspection analysis. The system also features a stable format with snap-in extended life filaments claimed to enable positional accuracy through fast servo-motors on all axes for high-speed inspection. An integral mono-block X-ray source, which eases scanning, can also reduce floor space. The optional computed tomography (CT) extension, which requires the installation of a sixth axis to ensure the sample is X-rayed over 360°, makes the system suitable for high-resolution 3-D analysis. The CT reconstruction engine builds a 3-D data cloud, allowing a sample to be viewed from any angle, sliced in any direction, measured, and analyzed after reconstruction. This can also serve as a reverse-engineering tool. The system features InspectX software and a large glass viewing door. Revolution was designed for BGA, microBGA, multilayer board, and PCB solder joint inspection. X-Tek Systems, Herts, U.K., www.xtekxray.com. Visit X-Tek at SEMICON West, Booth #8839.
Mass Imaging Platform
Enabling high-accuracy mass imaging of solder paste, solder spheres, flux, and adhesives onto singulated substrates or components directly from the carrier, SinguLign, a capability of the Micron Class platform, is said to accurately process known-good parts sized down to 20-mm. The system uses an accurate printing platform, specialized tooling, a carrier, and miniaturized print- or ball-placement heads to deposit paste to parts individually. The carrier, which holds multiple substrates, is transported into the printer where a vacuum tower raises the first substrate or component to print height, secures it in place, and aligns the substrate. Following this, the substrate is imaged with application-specific material and lowered back into the carrier. This process continues for all parts. Upon completion, the carrier is moved to the next process. Tooling and parts-handling features are said to enable full print support and fast processing times. The printer also enables ultra-fine-pitch imaging, and allows for imaging onto substrates or pre-packaged, 3-D components. DEK International, Zurich, Switzerland, www.dek.com. Visit DEK at SEMICON West, Booth #7139.