SMT/HYBRID/PACKAGING a Success


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NUREMBURG, Germany With 579 exhibitors, 76 represented companies, and 502 conference attendees, SMT/HYBRID/PACKAGING 2006, Nuremburg, closed on June 1st as nearly the largest SMT/HYBRID/PACKAGING show, claims conference officials.

The three-day European event on System Integration in Micro Electronics featured two forums within the exhibition area and a concurrent conference titled "Technologies for the Third Dimension in the Production of PCBs." There were also 24 practice-oriented tutorials. Foreign exhibitors occupied 33% of booths this year, covering the current developments and novelties in the microelectronics industry.

SMT/HYBRID/PACKAGING 2007 will take place in Nuremberg, April 24–26, 2007. For more information, visit invalid link: www.mesago.de/en/SMT/main.htm www.mesago.de/en/SMT/main.htm.

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