Winners
December 31, 1969 |Estimated reading time: 9 minutes
ADHESIVES/COATINGS/ENCAPSULANTS/UNDERFILLS
The NF260 lead-free, reworkable, air-reflowable, no-flow underfill is said to deliver increased reliability one order of magnitude over existing solutions, and two orders of magnitude when not using an underfill. The underfill integrates with existing SMT processes, and can be processed in typical lead-free reflow profiles. NF260 also reportedly promotes excellent wetting, low voiding, durability in thermal cycling, and the strength necessary to withstand rigorous drop tests. Indium Corp., Clinton, N.Y., www.indium.com.
ASSEMBLY TOOLS
The MicroLine 350 Ci fully automated depaneling and routing system for PCBs uses non-contact laser cutting, reportedly eliminating mechanical stress and debris for the board and components. Components also can be placed closer to the edge of the board. Working directly from computer-aided design (CAD) data, MicroLine 350 Ci does not require artwork-related tooling, which can reduce changeover time and cost for different jobs. A dual-fiducial camera system provides instant fiducial recognition over the entire working area. LPKF Laser and Electronics, Beaverton, Ore., www.lpkfusa.com.
CLEANING EQUIPMENT
Designed without horizontal floor surfaces to prevent solder paste from building up on the wash tank’s floor, the Self Cleaning Wash Tank is said to improve cleaning quality of the stencil, resulting in increased speed and throughput rates for soldering systems. This patent-pending system features multiple funnels that are mounted onto the tank’s floor, the ends of which feed into a metal tube. Water is pumped through the tube at a rate of 15 ft./sec., ushering paste into a filter housing where it is contained. Because of this paste capture and the tank’s continually self-washing capabilities, time-consuming hand cleaning of the tank is eradicated. The tank can contain leaded and lead-free solder pastes, as well as next-generation lead-free materials. Aqueous Technologies Corporation, Rancho Cucamonga, Calif., www.aqueoustech.com.
CLEANING MATERIALS
AQUANOX A4630 lead-free cleaning materials are typically used with aqueous spray-in-air equipment at 10% to 20%, and were designed for low VOC and emissions. Working from ambient temperatures and without the use of slump-side additives, the cleaner is said to result in shiny joints throughout an extended bath life. AQUANOX A4630 is effective on all no-clean materials. Kyzen Corp., Nashville, Tenn., www.kyzen.com.
DEVICE PROGRAMMING
The Helix programming system uses tubed parts for input and output, and up to eight sockets for device programming. In operation, the part is picked from the tube and transferred to the programming socket, where the part is then programmed and returned to the tube. A precision tooling head does not require a vision system to handle fine-pitched parts, and features an overall throughput of 800 devices per hour (dph). Two sites incorporate FX4 socket capability, while integrated motors open and close programming sites synchronously with part placement and retrieval. A single computer and software interface controls BPWin software and handles control operations. BP Microsystems, Houston, Texas, www.bpmicro.com.
DISPENSING EQUIPMENT
The Camalot XyflexPro+ inline or standalone dispensing system features an advanced composite gantry design and linear drive system with motion-control drive technology. The system is said to dispense at 45,000 dph and maintain X/Y placement accuracy of <38 mm at 3 sigma. Updated software features, as well as parallel product transfers and optimized sequence commands for underfill, are said to boost throughput. A one-snap, edge-find algorithm optimizes the system for molded packages and flip-chip die. The platform architecture and tooling enable any option to be field-installed easily for configurability. Speedline Technologies, Franklin, Mass., www.speedlinetech.com.
EMS PROVIDERS
The Synchronous Flow Manufacturing (SFM) process reportedly increases customer-scheduling flexibility while reducing inventory carrying costs and capital equipment requirements. This process is said to eliminate customers’ obligations for firm schedules with pulls/“ship-on-demand,” while improving on-time delivery of customer requests. Other benefits include a 90% reduction in revenue associated with past-due orders, and a 43% reduction in production square footage, including transfer or elimination of four production lines while supporting the same amount of revenue. EPIC Technologies, Rochester Hills, Mich., www.epictech.biz.
ENVIRONMENTALLY FRIENDLY PRODUCTS/ SERVICE AND SOLDERING EQUIPMENT
Winning in two categories, the FLIP solder bath for lead-free reflow and selective solder systems features Linear Induction Pumping technology, in which three phases of AC currents flow through induction coils, inducing horizontal magnetic fields within the solder bath. The magnetic fields create vertical force (F), which moves molten solder through the nozzles. Two induction coils then generate magnetic field and propelling force as alternating AC currents flow through induction coils. After eight hours of operation, the solder bath reportedly uses 300 kg of solder, and renders 7 kg of dross. Because there are no motors, impeller shafts, or belts, the bath is also said to produce a wave that is more stable than impeller-motor types. Tamura H.A. Machinery, San Diego, Calif., www.tamura-ha.com.
INSPECTION
Ecoselect AOI+R combines automated optical inspection (AOI) and selective repair soldering in one machine, performing fully automated PCB optical inspection and repair for pin thru-hole (PTH) assemblies. Defective PCBs that follow a mass soldering process are inserted into the machine to be scanned for defects. When a defect is detected, an automatic command is sent to the selective repair module. The automatic repair program then determines the exact defect position and type. When the repair process is complete, the PCB can either be selectively re-scanned for defect corrections confirmation, or sent for desertion. ERSA GmbH, Wertheim, Germany, www.ersa.de.
MASS SOLDERING EQUIPMENT
The Lead-free Retrofit Kit can be used to upgrade existing wave soldering machines for lead-free operation without the costs associated with purchasing a new machine or replacing the solder pot. The all-titanium construction resists effects of tin scavenging often found in lead-free alloys, and protects the kit from de-dross scratching. The solder nozzles of the kit are suitable for lead-free flow characteristics, enabling it to convert an existing wave solder machine to lead-free operation, including longer contact time, reduced temperature drop, and reduced fall height. Compatible with all wave solder machines, the titanium solder pot liner eliminates iron and copper dissolution found in stainless steel or surface-coated metal parts. Specnor Tecnic Intl. Corp., Quebec, Canada, www.specnor.com.
PASSIVES AND COMPONENTS
Offering a minimum flexure of 5 mm without internal cracks and the ability to reach up to 3,000 temperature cycles, FlexiTerm is a soft-termination system suitable for depanelization applications in high-flexure-stress circuit boards, as well as variable temperature and automotive applications. The system’s flexible termination uses a conductive polymer in conjunction with base metal electrode (BME) technology. The conductive polymer coats a copper termination plated with nickel and tin. The terminations are available in 0603 to 1812 case sizes and voltages of 6.3 to 100 V. AVX Corp., Myrtle Beach, S.C., www.avx.com.
PICK-AND-PLACE
The Siplace X-Series placement platform features low-mass, carbon fiber gantries and high-performance linear drive systems equipped with a choice of placement heads to fit specific requirements. Equipped with up to four 20-nozzle placement heads, a single X-Series machine can place a range of components, including 01005s, at speeds up to 80,000 components per hour (cph), with 55-µm accuracy. With up to 160 intelligent tape feeders on a single machine, the Siplace X-series platform is suitable for use in high-mix environments. Correct feeder setup is checked automatically using wireless communication between the feeder and the machine. Siemens A&D EA, Norcross, Ga., www.siemens.com.
PRINTING
The MPM Accela printing system reportedly delivers 20% to 80% raw throughput gains and generates more quality boards per hour. Said to increase a company’s return on investment (ROI), the system features an optimized design and simple operator interface. It handles lead-free assembly and increasingly complex board challenges. Speedline Technologies, Franklin, Mass., www.speedlinetech.com.
PROCESS CONTROL TOOLS
A result of company collaborations, the IFS-X2 RFID intelligent feeder system with open architecture uses radio frequency identification (RFID) technology and the CAMX equipment communications standard to Juki Automation Systems’ placement machine intelligence outside the factory floor - tracking components from initial receipt through placement. The feeders communicate using RFID tags that do not feature any mechanical contacts that can wear or fail. An IFS Graphical Setup Wizard guides operators through the reel-retrieval process, feeder programming, and feeder placement on correct removable feeder trolleys. Cogiscan Inc., and Juki Automation Systems, Inc., Bromont, Canada, and Morrisville, N.C., www.cogiscan.com and www.jas-smt.com.
REWORK AND REPAIR
Reducing the standard QFP rework process from seven to four steps, the “Dipping” Process using the Spark 400 Laser System skips steps 3, 5, and 7, and merges steps 5 and 6 - reducing replacement time from 10 to 3.5 minutes. The process is also said to eliminate solder balls on reworked joints because it applies flux instead of solder paste for final soldering. Because 93% of the original solder remains on the pad, the process also meets IPC Class 3 requirements. BeamWorks Inc., Beaverton, Ore., www.beamworks.com.
SELECTIVE SOLDERING
The Close-loop Laser Selective Soldering Process with Spark 100 reportedly prevents board and component damage, while achieving desired solder joint quality and complete hole fill. The close-loop process monitors solder joint temperature and turns the laser off automatically once the desired solder temperature is achieved. Because most boards often do not have enough space for the cutout required for a wave-solder fixture, bridging can occur in the wave. This system is said to save users money often spent on fixturing used to accommodate selective soldering. BeamWorks Inc., Beaverton, Ore., www.beamworks.com.
SOFTWARE
The Interactiv Internet-based support solution offers machine control, predicts and schedules maintenance using remote diagnostics capabilities, views machine histories, and can access DEK’s service control centers, giving customers access to on-site support staff without service-visit delays. The Intelligent Scalable Controller Area Network (ISCAN) enables predictive maintenance to analyze system conditions and anticipate required maintenance prior to failures. Other features include Interactiv Assist, Interactiv Learn, Interactiv Recover, and DEK RSS, a Windows-based news feed that lets customers receive up-to-date company information. DEK International GmbH, Zurich, Switzerland, www.dek.com.
SOLDERING MATERIALS
Using activators to force a solder joint to remain smooth and shiny, even after high-temperature, lead-free reflow, the optimized EnviroMark 907 lead-free, no-clean solder paste can maintain expected first pass yields (FPYs). Because it produces improved grain structures, the paste is said to reduce or eliminate the need to upgrade inspection materials or retrain inspectors. Reflowed in air or nitrogen, EnviroMark 907 allows up to 150-mm/sec. print speeds, and exhibits suitable cold and hot slump behavior to prevent bridges and solder-ball formation. Kester, Des Plaines, Ill., www.kester.com.
TESTING
The Eliminator 6 (E6) electrical test tool is a pre-screener for industry-accepted flying probe test (FPT) systems. E6 uses a fixtureless, quick-test preparation and programming for high-volume production electrical test and prototyping. The tester scans PCB panels at a rate of up to 76.2-mm/sec., regardless of PCB density, test-pad size, or number of PCB images per panel, reportedly resulting in elimination rates of 85% to 92% per panel. This is said to enable test times of less than two minutes per panel. E6 targets panel-test application markets such as PCBs and IC packages. Testing for PCB inner layers is in development. The Eliminator system runs on XP Pro, features an intuitive software graphical user interface (GUI), and requires no manual setup. Everett Charles Technologies (ECT), Pomona, Calif., www.ectinfo.com.