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Pick-and-Place Upgrade Boosts Throughput
April 10, 2006 |Estimated reading time: Less than a minute
EINDHOVEN, The Netherlands — The Speedpack upgrade package from Assembléon reportedly increases output of the company's surface mount device (SMD) pick-and-place machines by up to 15%, and improves line balancing — increasing AX5 system speeds from 94,300 to 110,000 components per hour (cph).
Speedpack's modularity upgrades specific design modules without the need to change machine setup or design, and raises outputs without performance trade-offs, such as accuracy (4 sigma at 50 µm). This is said to reduce production costs per component allowing more products to be built from the same line without the need for additional floor space.