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Reworkable CSP/BGA Underfill Performs in Low Temperatures
February 16, 2006 |Estimated reading time: Less than a minute
IRVINE, Calif. — Loctite 3549, a high flow underfill formulated specifically for use with advanced CSP and BGA packages, is now available from the Electronics Group of Henkel. It quickly fills the space beneath the CSP and BGA packages and cures rapidly at low temperature, minimizing thermal stress to other components on the PCB, and allowing for in-line curing to increase device throughput.
When fully cured, Loctite 3549 protects solder joints against mechanical stress such as shock, drop, and vibration in handheld devices. Compatible with modern lead-free solder materials, it is completely reworkable, allowing for an increased process window and the recovery of high-cost substrates and PCBs. It also features long pot life, which is 14 days at room temperature and up to seven days at 40°C processing temperature.