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APEX Product Showcase
December 31, 1969 |Estimated reading time: 6 minutes
Following are just some of the many innovative products to be showcased this month at IPC Printed Circuits Expo, APEX, and the Designers Summit in Anaheim, Calif. For more information on these products, please visit each company at the show.
Selective Soldering
The GoLaser selective soldering system can be used as a stand-alone system or integrated into a fully automated SMT production line to solder THT components on the bottom side of a PCB. The power-controlled, 60-W diode laser with closed-loop temperature and solder-volume control enables a reproducible process and high precision. A vision system aligns assemblies to be processed automatically. The system can download CAD data, and features a comprehensive library of components to ease programming and operation - reducing programming time and costs. SEHO Seitz & Hohnerlein GmbH, Kreuzwertheim, Germany, www.seho.de.
Lead-free Solder Paste
SynTECH-LF lead-free, no-clean solder paste is made with 100% synthetic poly-adduct components. It is compatible with SnAg and SnAgCu alloys, with a lead content reportedly assured at <200 ppm. The paste delivers high hourly throughput with little scrap and rework, lot-to-lot and stencil printing consistency, 12-hour stencil life, 12- to 16-hour tack, and 90% metal loading. Suited for in-circuit testing (ICT) and compatible with organic solderability preservatives (OSPs) without compromising SIR values, the paste is non-conductive and non-corrosive, and features a protective post-reflow residue. AMTECH, Branford, Conn., www.amtechsolder.com.
Rapid Transit Conveyor
The rapid transit conveyor (RTC) high-speed board transport option combines with the Micron-class Europa high-accuracy mass imaging system to deliver a four-second core cycle time. The RTC uses stepper-motor technology to boost board transport speed and replace traditional belt-type transfer with a positive retention mechanism that does not rely on friction for board retention. When combined with the HawkEye print verification system, the RTC reportedly enables full board inspection at line-beat rate, increasing throughput and end-of-line yield. DEK International GmbH, Flemington, N.J., www.dek.com.
Lead-free Solder Paste
The Indium 5.1 series of lead-free, no-clean solder pastes features print-transfer efficiency through small apertures, low voiding over a range of reflow profiles, and response-to-pause printability. The series is also said to offer optimal wetting conditions to all lead-free metallizations. Indium Corporation, Clinton, N.Y., www.indium.com.
Thermally Conductive Adhesives
Based on proprietary structural adhesive technology, Loctite Bead-on-Bead is a two-part, no-mix, no-measure acrylic adhesive chemistry that allows application of each part independently to the component so mixing occurs when the two items are combined. This technology is said to replace traditional pre-mixing or solvent-activated systems and eliminate issues associated with pot-life management. The chemistry gives manufacturers increased resource usage. It also offers a 40% improvement in cooling performance and allows manufacturers to use smaller, cost-effective heat sinks. The electronics group of Henkel, Irvine, Calif., www.electronics.henkel.com.
No-clean Solder Paste
The F640 series lead-free, no-clean solder paste is said to promote wetting and reduce defects with SnAgCu alloy soldering. The paste reportedly offers a wide process window and compensates for process variations in printing, component placement, and soldering. Featuring minimal slumping and optimal print-to-print consistency, the series can be reflowed in air or nitrogen. Heraeus Circuit Materials Division, West Conshohocken, Pa., www.4cmd.com.
Lead-free Soldering Machine
Adding to the Nu/Era line of wave soldering machines is a lead-free soldering machine dubbed the “China Buster.” Designed specifically for lead-free processes, the machine features internal spray fluxers, preheaters, dual waves with temperature controls, low-dross producing solder pumps, roll-out Titanium solder pots, and Windows-based software controls. Technical Devices Company, Torrance, Calif., www.technicaldev.com.
Dross Eliminator
MS2 molten solder surfactant for leaded and lead-free processes forms a thin, floating layer that covers the entire solder surface except for the wave without mixing with the metal - eliminating dross in wave soldering. The surfactant prevents dross from forming on the surface and converts any dross from the wave into usable metal. This is said to reduce solder use by 40-75%. P. Kay Metal, Inc., Los Angeles, Calif., www.pkaymetal.com.
Wire Bond Inspection
Wire bond automatic optical inspection (AOI) capabilities have been added as an option to existing inspection systems from MVP. These capabilities enable the detection of defects such as wire trace conformity, bent wires, distance to adjacent wires, loop height, straightness tolerance, ball/wedge geometry, and contamination. The system performs detection using the wire bond inspection configuration. Machine Vision Products, Inc. (MVP), Carlsbad, Calif., www.visionpro.com.
Lead-free Soldering Iron
The i-Tool compact soldering iron is designed specifically for lead-free. Its patent-pending, 150-W micro-heating element technology enables performance similar to that of soldering irons with expensive heating cartridge tips. The Process Window Alarm audibly notifies operators when the iron tip is outside the specified process window, while automatic standby sensor technology recognizes when the iron is not in use and sends it into standby automatically - extending tip life. The iron also features fast heat-up from 70° to 700°F in 9 sec. and from standby to 710°F in 4 sec., as well as fast recovery time. ERSA GmbH, Wertheim, Germany, www.ersa.de.
Reflow Oven
Pyramax 125 provides high-volume performance in a reduced footprint and is optimized for lead-free processing. Using proprietary Closed Loop Convection Control, the oven controls heating/cooling and constant heat transfer to deliver maximum process-control flexibility, assures process repeatability from site to site and line to line, and reduces nitrogen consumption. Other features include Windows-based WINCON oven-control software, various flux management options, advanced conveyor solutions, and smart-tracking SMEMA capability. BTU International, Inc., North Billerica, Mass., www.btu.com.
Low-VOC Cleaner
A4615 is a low-VOC, aqueous-blend electronics cleaner targeting the removal of pastes, tacky fluxes, rosin flux, no-clean flux, lead-free flux, and assembly residues. The concentrated cleaner contains a blend of organic solvents, non-ionic surfactants, alkalinity builders, and organic and inorganic inhibitors in a water base. It can be used in spray-in-air inline and batch washers, immersion agitation, or ultrasonic systems, as well as stencil cleaning systems or manual applications. Effective at 25-g/l operating conditions, the material results in shiny solder joints and low foaming. The A4615 also offers multi-metal safety, RoHS compliance, no hazardous air pollutants (HAPs), non-flammability, and long bath life. Optimum performance is from 110° to 150°F. Kyzen Corp., Nashville, Tenn., www.kyzen.com.
Rework System
The Summit 1800 rework system reportedly addresses rework challenges such as lead-free rework for large components. A 65-mm alignment field of view with digital and optical zoom and split image ensure precise placement of large packages, sockets, and connectors. Programmable, motor-controlled, top-heater positioning, and independent pick-up motion provide process flexibility. Advanced Auto Profile with rules-based process development allows engineers to set specific constraints for automatic profile generation. An automatic prism shuttle facilitates accurate, repeatable component alignment. The component pick-up tube features 360° theta control and automatic alignment height, ensuring proper focus and image magnification of components. The system features magnification capability from 2-40×. Other options include a manual scavenger, component print station, cooling boost, sliding board support, a 17" LCD monitor, and a 22" × 30" board-size upgrade. VJ Electronix Inc., Shirley, Mass., www.vjelectronix.com.
Flying Prober
The Condor 500 flying prober incorporates drive technology using linear motors for high speed and high accuracy of fine-pitch. Comprehensive software allows fast test program development directly from CAD data and parts lists. Off-line simulation and panels are also supported. Test capabilities include in-circuit and functional test, open-check, memory/programming, boundary scan, and vision. The software also integrates a quality management tool (QMAN). Digitaltest GmbH, Stutensee-Blankenloch, Germany, www.digitaltest.de.
Printing System Optimizations
Additional options for the MPM Accela printing system are available, including high-speed inspection for full 2-D substrate and stencil inspection at line speeds. Built using patented, texture-based algorithms and conventional 2-D methods, the option will quantify inspection results and report them to statistical process controls (SPCs). Another feature for process setup verification and traceability uses bar-code reading capability and enhancements in machine software down to the board level. The printer also uses closed-loop control with external inspection information. Speedline Technologies, Franklin, Mass., www.speedlinetech.com.