-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
APEX Product Preview
December 31, 1969 |Estimated reading time: 8 minutes
ASSEMBLY TOOLS & EQUIPMENTProcess Control Tool
The ScanINSPECT virtual product inspection (VPI) process control tool reportedly qualifies each assembly and fabrication process step before production, coupling a high-resolution, color flatbed scanner with a dual-lighting system. When combined with a Windows-based computer, the tool is said to minimize training required for process control. ScanCAD International, Morrison, Colo., www.scancad.com.
Laser-marking Island
A laser-marking island consisting of a board destacker, laser marker, and optional flip station and restacker can handle a throughput of up to 510 PCBs/hour, including code verification. The laser marker controls an optional flip station, which can flip boards for double-sided marking needs. The laser-marker can handle standard 1- and 2-D codes, text, and graphics up to 18" × 18". The island measures less than 8.5’ in length, and is upgradeable. ASYS Automation, Suwanee, Ga., www.asys-llc.com.
Retrofit Kit
The Lead-free Retrofit Kit offers the ability to upgrade an existing wave soldering machine for lead-free operation. Its full titanium construction prevents corrosion normally associated with surface-coated solder pots, pumps, and nozzles. A titanium solder pot liner eliminates iron and copper dissolution of stainless-steel or surface-coated, cast iron solder pots. The kit is compatible with all wave soldering machines. Specnor Tecnic Intl. Corp., Quebec, Canada, www.specnor.com.
CLEANING MATERIALS & EQUIPMENTSelf-cleaning Wash Tank
A patent-pending, self-cleaning wash tank has been designed without horizontal floor surfaces to prevent solder paste from building up on the tank’s floor. The tank also features multiple funnels mounted on its floor, the ends of which feed into a small-diameter metal tube. Water is pumped through the tube at 15 feet/sec., moving solder paste into a special filter housing where it is captured. This self-cleaning tank removes the need for an operator or maintenance technician to scrape solder from the bottom of the tank - eliminating direct contact with hazardous solder paste, and preventing solder paste from entering the waste stream. Aqueous Technologies, Rancho Cucamonga, Calif., www.aqueoustech.com.
DISPENSING EQUIPMENTDispensing System
The Spectrum S-820 series closed-loop dispensing system offers precision dispensing for new product development and R&D labs. Using proprietary Fluidmove software, the dispensing programs and processes port directly to the company’s inline dispensing systems. The clear enclosure provides front, top, and side views of dispensing, as well as access to parts in the dispense area. A built-in vertical syringe holder provides a queue for thawing material prior to use during production. The Spectrum integrates with most jets, pumps, and valves. Asymtek, Carlsbad, Calif., www.asymtek.com.
INSPECTION EQUIPMENTX-ray Inspection
The YTX-3000 HXR X-ray inspection system features an open-tube transmission-target X-ray source with a high-voltage power supply and computer-controlled operation. Suitable for high-resolution applications, the system resolves sub-micron features with zoom magnifications up to 2,400×. The system offers a four- or five-axis sample manipulator and 380- × 500-mm X/Y travel for samples weighing up to 5 lbs. Full rotation and a tilt of 30˚ also are available. Computer-controlled motor drives provide a range of motion from ultra-slow use at high magnifications to high-speed use for travel over large distances. All systems are equipped with a control module and programmable motion for automated inspection. YESTech Inc., San Clemente, Calif., www.yestechinc.com.
X-ray/Failure Analysis
The Concept FX modular, multi-purpose X-ray inspection and failure analysis system offers 30 configurations, and provides bare board, assembly, and package inspection; prototyping; process validation; and rework verification. A no-clamp sample tray provides fast load and unload. Off-axis inspection is accomplished by rotating the X-ray source and detector around the sample tray, eliminating the need for clamping the samples. A high-resolution, high-magnification imaging train is said to include near-microscopic interlayer electrical interconnection inspection of wire-bond and die attachments. FocalSpot, Inc., San Diego, Calif., www.focalspot.com.
Digital X-ray Inspection
The manipulator design of the XD7600NT provides oblique-angle views up to 70º for any position around a 458- × 407-mm inspection area - targeting interconnections and PCBs containing BGA and chip-scale package (CSP) devices. The NT250 sealed, transmissive, filament-free, sub-micron X-ray tube provides feature recognition to 0.25 µm, particularly for failure analysis and laboratory applications. Dage Precision Industries, Inc., Fremont, Calif., www.dageinc.com.
Bench Top AOI System
The Vi-1K entry-level automatic optical inspection (AOI) system features inline performance in a compact, bench top system. The system targets high-mix/low-volume manufacturing with CAD-driven Vectorla imaging technology. The Vi-1K uses patented, proprietary software for post reflow applications. ViTechnology, Haverhill, Mass., www.vitechnology.com.
PICK-AND-PLACEPlacement Machine
The SM Series SM320 component placement platform is said to achieve placement rates up to 30,000 cph with ±50-µm accuracy, and up to 5,500 cph at ±30 µm for QFPs and BGAs. The machine’s frame and dual-gantry system features a twin-servo motor design to provide stability for placement. Slim-format feeders handle standard EIA 481 tape sizes. Optional intelligent feeders provide traceability of components and inventory management. Dynatech Technology, Inc., Horsham, Pa., www.dynatechsmt.com.
Automated Insertion Machine
The CSM 200 Automatic Insertion Machine is a semiautomatic machine for compliant-pin connector application. The machine features a BMEP servo-electric press that enables the monitoring and control of force, distance, and speed during the press process. Operators manually load a PCB and connectors onto fixtures that include sensors to ensure proper placement. The CSM then positions the connectors on the PCB automatically, while an X/Y table with PCB fixtures locates the board under the servo-press head to process the connector. The system presses each connector onto the PCB sequentially to required specifications. Each press cycle is monitored and can be halted if an error occurs. The system targets right-angle board-edge connectors with non-overmolded pins. The Automation Group of Tyco Electronics, a business segment of Tyco International Ltd., Willow Grove, Pa., www.tycoelectronics.com.
Placement Platform
The modular SIPLACE platform ranges from the SIPLACE Compact Series for the mid-range market to the SIPLACE X-Series, which is capable of placing 01005 components reliably. The SIPLACE line features a productivity lift, a dual-conveyor system, and intelligent software. Product changeovers are accomplished using software and data management to control and synchronize machines and lines. Siemens Logistics and Assembly Systems Inc., Norcross, Ga., www.siplace.com.
REWORK/REPAIRRework System
The MFR Series multi-function rework system features a compact power unit with two ports to attach any MFR Series for rework, SMT tasks, and thru-hole soldering and desoldering. For heavier or varied workloads, multiple units can be interlocked to power as many tools as necessary. A choice of heater tips meets the demands of point-to-point production soldering, while the tip-cartridge selection suits high-performance soldering and rework applications. SmartHeat technology senses the amount of heat-energy needed at the pad, which is said to ensure solder joint reliability, boost throughput, reduce cost of ownership, and protect PCBs and components from heat damage. ESD-safe materials and built-in ground continuity-sensing technology also protect components. OK International, Menlo Park, Calif., www.okinternational.com.
SCREEN PRINTINGEnhanced Stencil System
The VectorGuard system with interchangeable foils for various applications has been optimized with laser-cut nickel foils to address lead-free paste rheology and aperture-release challenges, delivering a high level of paste-volume repeatability. The system eliminates the need for a loading jig and facilitates stencil-to-frame alignment with foot-pedal operation. The design enables uniform tension throughout product life. DEK International GmbH, Flemington, N.J., www.dek.com.
SOLDERING EQUIPMENTSelective Soldering
Targeting batch or inline capabilities, the Juki 400 is said to offer an alternative to traditional wave soldering equipment in lead-free manufacturing. The three-stage, inline system for high-speed, automated soldering processes can be customized to meet specific customer requirements. Multiple solder pots run leaded and lead-free soldering without the need for hardware adjustments. A maximum of four mini-wave nozzles are available for different configurations. A traditional full wave up to 400 mm can be installed and run during the same process. The XY Fluxer option allows the system to flux, pre-heat, and solder simultaneously. A Tenifer-nitrate process protects from de-alloying by using forced hot-air nitrogen at the mini-wave to lower solder temperature and decrease time of contact. Juki Automation Systems, Morrisville, N.C., www.jas-smt.com.
Wave Solder Machines
The ECO Pascal wave soldering machine uses a proprietary Static Pressure Flow (SPF) system to maximize vertical solder flow at the nozzle and reduce machine maintenance. Vertical flow reportedly increases 15- to 18-mm in wave height, reducing voiding and improving fillet formation in thick PCB applications. Senju Metal Industry Co. (SMIC), Tokyo, Japan, www.senju-m.co.jp.
Lean Selective Soldering
The GoSelective systems are said to meet the needs of factories operating lean productions. GoSelective-1 consists of an in- and out-feed made by using a rotary table (stand-alone version) or a roller-conveyor system for in-line integration. GoSelective-2 features two process modules - an in-line conveyor system that transports assemblies through the preheat station before the gripper takes them to be fluxed and soldered. The two X and Y axes with servomotors work with ±0.1-mm repeatability. The gripper is installed at the Z-axis and is equipped with a pneumatic tilting and rotation function for defined peel-off for soldering quality. On both versions, the fluxing system has a micro-drop fluxer. SEHO Seitz & Hohnerlein GmbH, Kreuzwertheim, Germany, www.seho.de.
SOLDERING MATERIALSLead-free Solder Paste
Multicore LF318 is a halide-free, no-clean, pin-testable, lead-free solder paste designed to achieve a consistent degree of coalescence upon reflow. The paste allows manufacturers to switch to lead-free processes in all sites regardless of varying climactic conditions. The paste is said to reduce common operational defects such as solder balling, and delivers a broad reflow process window and high tack strength. Henkel Corp., Irvine, Calif., www.electronics.henkel.com.
Lead-free, No-flow Underfill
The NF260 lead-free, reworkable, air-reflowable, no-flow underfill integrates with existing SMT processes, reportedly boosting productivity and reducing costs. The underfill can accommodate component placement with existing automated equipment, can be processed in typical lead-free reflow profiles, and has shown durability in thermal cycling and thermal-shock testing. Indium Corporation, Clinton, N.Y., www.indium.com.
TEST EQUIPMENTFlying Prober
The PILOT VIP flying probe test system integrates a SMEMA conveyor for various manufacturing/test process layouts. The system includes hardware and software features of the VIVA Integrated Platform (VIP), and can be fully loaded to cover all in-circuit and functional tests. It also provides AOI inspection, boundary scan, and on-board programming capabilities. Seica S.p.A., Strambino, Italy, www.seica.com.