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Molex Expands Multi-layer Flex Circuit Assembly Capabilities
December 8, 2005 |Estimated reading time: 1 minute
LISLE, Ill. — Molex Inc. now develops and delivers high-performance flex circuitry assemblies with up to 18 layers of conductive flex. In addition, Molex now has capabilities in the Americas to stamp flex circuitry and automatically circuit-etch, vacuum-laminate and drill multi-layer flex at the tightest tolerances.
"Over the last few years Molex has progressively developed its integrated solutions and test capabilities in all regions," according to Michael Nauman, president of Molex's Integrated Products Division. "Then, in October, Molex made a quantum leap forward by acquiring Century Circuits Inc., (CC&E) a Minneapolis-based flex circuitry maker specializing in electrically controlled, multi-layer flex circuit assemblies."
Molex's Minneapolis-based multi-layer flex facility delivers the ability to control target impedance to as low as ±5%. Molex also can create a 4-mil-pitch product for select applications.
Molex's and CC&E's combined test capabilities combine to provide an improved front-end resource. Molex now has advanced vision systems with closed-loop monitoring systems to assure quality at each step of the circuit production process. These vision systems allow for automatic inspection of dimensions and vias, and can measure accuracy in skew. The measuring process is totally operator-independent, allowing sustainable quality performance.
The acquisition also advances Molex's automated X-ray test capabilities, and gives them the ability to provide measurement and defect data for every solder joint tested. X-ray test is the only method for finding defects in hidden joints, verifying solder joint quality on BGAs, CCGAs and other area-array components. Hidden thru-hole joints and components under shielding are also easily verified with automated X-ray test.
Flex circuit assemblies are an ideal complement to connectors and have significant synergy with existing Molex membrane switch and PCB assembly operations. Molex is already providing interconnection solutions combining high-pin-count backplane connectors and sub-1-mm-pitch SMT connectors with flex assemblies.